industry news
Subscribe Now

TI delivers the industry’s highest voltage rating in next-generation automotive LED drivers for dashboard applications

DALLAS (May 28, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the next-generation AEC-Q100 qualified automotive LED drivers, feature-packed with the industry’s highest voltage rating, thermal shutdown protection and optimized electromagnetic compatibility (EMC) performance. In harsh automotive environments, the electronics must endure high temperatures, high voltage transient and electromagnetic interference. It is crucial for the devices to survive such conditions while reducing electromagnetic emissions. The TLC6C598-Q1 and TLC6C5912-Q1 are monolithic, medium-voltage, low-current 8-bit/12-bit shift registers designed for use in systems that require relatively moderate load power, such as LEDs. The TLC6C598-Q1 and TLC6C5912-Q1 are designed for automotive dashboard applications, including tell-tale warning lamps, instrumentation cluster, and LED illumination and control. For more information or to order samples, visit www.ti.com/tlc6c598-q1-pr and www.ti.com/tlc6c5912-q1-pr

Key features and benefits of the TLC6C598-Q1 and TLC6C5912-Q1:

  • Highest voltage rating: The TLC6C598-Q1 and TLC6C5912-Q1 have the highest rating of up to 40V on all outputs. This allows the TLC6C598-Q1 to power up to eight strings of LEDs and the TLC6C5912-Q1 to power up to twelve strings of LEDs directly connected to the automotive battery.
  • Thermal shutdown protection: The TLC6C598-Q1 and TLC6C5912-Q1 offer self-protection against power dissipation, which results in better long-term reliability when low- and high-temperature demands are placed on the device.
  • Optimized EMC performance: The TLC6C598-Q1 and TLC6C5912-Q1 have controlled and optimized rise and fall time for the outputs, reducing the electromagnetic emissions.

Tools and support:

A simulation model is available for the TLC6C598-Q1 at www.ti.com/tlc6c598-q1-model-pr and for the TLC6C5912-Q1 at www.ti.com/tlc6c5912-q1-model-pr. A reference design, schematic checklist, and application note are also available.

Availability, packaging and pricing

The TLC6C598-Q1 comes in two packages: the SOIC-D and TSSOP-PW 16-pin packages are available now for ordering at a suggested retail price of $0.50 in 2,500-unit quantities. The TLC6C5912-Q1 comes in two packages: the SOIC and TSSOP 20-pin packages are available now for ordering at a suggested retail price of $0.70 in 2,500-unit quantities.

Texas Instruments drives automotive innovation

TI’s state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market. Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. TI offers SafeTI™ devices designed to facilitate OEMs’ compliance with the requirements of ISO 26262, as well as parts specifically designated as compliant with the AEC-Q100 and TS16949 standards, all with excellent product documentation. Click here to learn more.

Find out more about TI’s automotive and transportation portfolio by visiting the links below:

About Texas Instruments                                        

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world’s brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at www.ti.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
33,409 views