EEJournal

industry news
Subscribe Now
May 8, 2012

Tensilica and VWorks Partner to Provide Virtual Prototyping Platforms

SAN DIEGO, Calif.  – May 8, 2012 – Tensilica®, the leader in dataplane processor IP cores, and VWorks, leader in virtual prototyping and system simulation, today announced a partnership to provide virtual platforms based on Tensilica’s Xtensa® dataplane processors (DPUs), dramatically reducing customers’ embedded software development time. 

As part of the collaboration, Tensilica’s DPU models are integrated with the VLAB™ virtual platform simulation environment from VWorks, providing early access, high performance and direct software debug capability. Software and services are provided by VWorks and its service partner ASTC.

“We see virtual platforms as increasingly important in multi-core design, accelerating hardware and embedded software development,” stated Chris Jones, Tensilica’s director of product marketing. “The VLAB solutions from VWorks promise to deliver a new range of business and technical options to our customers.”

“Tensilica configurable cores are popular across many markets ranging from mobile to automotive to consumer applications. VWorks VLAB virtual platforms accelerate the development of systems and software for the Xtensa IP family and offer a new generation of performance and application,” said Jay Yantchev, CEO at ASTC / VWorks.

Tensilica is the newest member of the VWorks IP Partners program, which is focused on accelerating development across multiple communities in electronics supply chains, capitalizing on the benefits of virtual prototyping and services.

About VWorks and ASTC

The Australian Semiconductor Technology Company (ASTC) is a privately held semiconductor design, services, and software company serving global markets. VWorks, a software solutions subsidiary of ASTC, is an industry leader in virtual prototyping and system simulation, for semiconductors, embedded software, and systems. Both serve supply chains for automotive, transportation, mobile, multimedia electronics and embedded software. ASTC and VWorks are headquartered in Adelaide, Australia, with over 100 staff, and offices in Australia, Europe, Japan, and North America. For more information, see www.vworks.com 

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.

Leave a Reply

featured blogs
How Synopsys IP and TSMC’s N12e Process are Driving AIoT
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
More from Synopsys...
Captivating Component Art
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
More from Max's Cool Beans...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Digi XBee 3 Global Cellular Solutions
Sponsored by Mouser Electronics and Digi
Adding cellular capabilities to your next design can be a complicated, time consuming process. In this episode of Chalk Talk, Amelia Dalton and Alec Jahnke from Digi chat about how Digi XBee Global Cellular Solutions can help you navigate the complexities of adding cellular connectivity to your next design. They investigate how the Digi XBee software can help you monitor and manage your connected devices and how the Digi Xbee 3 cellular ecosystem can help future proof your next design.
Click here for more information about DIGI XBee® 3 Global LTE-M/NB-IoT Smart Modems
Nov 6, 2023
25,226 views