industry news
Subscribe Now

STMicroelectronics Launches Single-Chip Magnetometer, Extending Leading Sensor Portfolio for Mobile and Consumer Applications

Geneva, February 21, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, the world’s top MEMS manufacturer, and the leading supplier of MEMS sensors for consumer and portable applications[1], has added a high-performance standalone 3-axis magnetometer to its MEMS sensor portfolio. The new sensor delivers high performance in a very small package.

Because of its small size and high performance, the sensor is ideal for mobile phones, tablets or personal navigation devices. ST’s standalone magnetometer is also perfectly suited to indoor navigation applications where it reliably calculates dead-reckoning when no satellite signal is available

By introducing the 2 x 2 x 1mm LIS3MDL magnetometer, ST now offers unique flexibility for designers to implement movement and position detection in space-constrained products such as smartphones and personal navigation devices. The device can also be combined with other discrete sensors from ST such as 3-axis MEMS accelerometer or 3-axis MEMS gyroscope, to build sensors with as many as 9 degrees of freedom (DOF).

Using ST’s iNEMO Engine Sensor Fusion software, designers can further enhance location-detection capabilities by integrating additional miniature sensors from ST’s portfolio for multiple-DOF (M-DOF) sensing. Sensor Fusion software helps coordinate any combination of sensors from ST’s broad portfolio to create reliable, high-quality M-DOF systems quickly and efficiently for location-based services, enhanced motion-based gaming, and pedestrian dead-reckoning for indoor and multi-floor navigation. For example adding a MEMS pressure sensor, for altitude sensing, can enhance in-building accuracy, as well as support extended smartphone functionality and location-based operator services.

“By introducing our first discrete magnetometer and offering high performance and low power consumption, we can now offer customers a complete range of standalone and integrated miniature sensors,” said Fabio Pasolini, General Manager, Motion MEMS Division, STMicroelectronics. “Designers can partition their multiple-degrees-of-freedom sensor designs with optimal performance.”

ST is the leading supplier of MEMS devices for consumer and mobile applications according to IHS, with 48% of the world market for motion sensors in mobile handsets and tablets in 2012. ST’s sensors are the most used sensors across all of the major portable operating systems (Android, iOS, and Windows).

Samples of the LIS3MDL are available and mass production is scheduled for Q2 2013. Unit pricing is US$0.60 for volumes in the range of 1,000 pieces. If your company has a high-volume need, please contact your ST sales office.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2012, the Company’s net revenues were $8.49 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Non-Magnetic Interconnects
Sponsored by Mouser Electronics and Samtec
Magnets and magnetic fields can cause big problems in medical, scientific, industrial, space, and quantum computing applications but using a non-magnetic connector can help solve these issues. In this episode of Chalk Talk, Amelia Dalton and John Riley from Samtec discuss the construction of non-magnetic connectors and how you could use non-magnetic connectors in your next design.
May 3, 2023
40,571 views