Choosing an FPGA package is both simple and fun.
We have flat-pack, via-stack, timing sometimes outa’ whack; BGA, pin-array, tin-whisker sneak attack, lead-free, QFP, 12-layer PCB; cavity-up, cavity-down, ceramic, plastic, heat-sink ground; flip-chip, classic DIP, moisture-sensitive micro-chip… OK, wait. Let’s break this down.
Package selection is one of the most important and least understood aspects of part selection for most FPGA designers. While the digitally inclined among us are savvy to the subtleties of speed-grade selection and cognizant of the complexities of LUT-counting, we tend to glaze over at mere mention … Read More → "Package Deal"