industry news
Subscribe Now

Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

  • Expands use cases to foster development of innovative new video bridging applications using the latest generation processors, displays and sensors
  • Design flexibility, unique programmability and high performance of CrossLink make it ideal for broad markets including consumer, industrial and automotive
  • Designs based on CrossLink IP use up to 40% less logic than previous versions with reduced power consumption while enabling more functionality

PORTLAND, OR – February 21, 2017 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced the expansion of its Lattice CrossLink™ programmable ASSP (pASSP) solutions to enable new video bridging capabilities with the release of three new CrossLink intellectual property (IP) and two new CrossLink demonstration platforms showcasing MIPI® DSI to LVDS and CMOS to MIPI CSI-2. Reinforcing Lattice’s commitment to provide bridging solutions for consumer, industrial, and automotive applications, the company has optimized existing CrossLink IP to save logic resources and lower power consumption.

The CrossLink product was designed to address the challenges of today’s rapidly changing I/O landscape by offering designers a new way to develop high performance, low power and compact bridging solutions. Since the product introduction less than a year ago, Lattice has seen strong interest from customers to expand beyond typical early applications of the CrossLink product for simple interface conversion, merging and muxing of image sensors, application processors and displays.

By optimizing existing IP, leveraging new IP and development platforms, along with additional resources, Lattice can offer more solutions for a greater variety of bridging applications that captures the best of both worlds with the combined the flexibility and fast time to market of an FPGA and the power and functional optimization of an ASSP.

“The new CrossLink IP and solutions will enable our customers to adopt cameras and displays with the latest mobile interface technology to reduce overall system cost, power and size, while accelerating the design cycle of their next-generation products,” said C.H. Chee, senior director of marketing, mobile & consumer division at Lattice Semiconductor. “As inventors of the first programmable bridging device, and the world’s fastest MIPI D-PHY bridging device, Lattice is committed to delivering a low cost bridging solution with the highest bandwidth, lowest power and smallest footprint.” 

Key features of the new CrossLink pASSP IP solutions include:

New IPs

New Technology Demonstration Platforms

  • CMOS to MIPI CSI-2 Camera Bridging Demonstration
    • o   Connects a popular image sensor with MIPI DPI CMOS-type pixel bus to the CSI-2 input on the application processor
    • o   MIPI DSI to LVDS display bridging demonstration
    • o   Connects the applications processor to a Dual Link LVDS display
  • MIPI DSI to LVDS Interface Bridging Demonstration
    • o   Connects mobile application processors to large format LVDS displays
    • o   Demonstrates the ability for industrial displays to interface to high volume, high performance mobile Application Processors.

Additional Resources

  • Full suite of CrossLink IP can be accessed here: http://bit.ly/2k84sQb
  • New CrossLink IPs available in Clarity Designer can be downloaded with Lattice Diamond 3.9 here:

http://www.latticesemi.com/en/Products/DesignSoftwareAndIP/FPGAandLDS/LatticeDiamond.aspx

CrossLink evaluation boards with the new IPs are available now from Lattice and its distributors. To learn more, please visit www.latticesemi.com/CrossLink.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.

 

For more information about Lattice please visit www.latticesemi.com.  You can also follow us via LinkedInTwitterFacebookYouTube or RSS.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
27,086 views