industry news
Subscribe Now

Artesyn Embedded Technologies Announces Open Compute Project (OCP) Platform for Network Functions Virtualization

Artesyn Embedded Technologies today announced its first high performance integrated computing system inspired by Open Compute Project (OCP) standards. The Centellis® OCP Platform is designed to help communication service providers dramatically lower the capital and operating expense associated with running their networks by leveraging open standard and open source hardware and software, and taking advantage of virtualization and cloud technologies. This new Centellis OCP Platform is a rack solution that integrates servers, storage and top-of-rack switches, and offers improvements in density, availability, flexibility, scalability, serviceability, manageability, and ease of deployment versus traditional rack servers.

The Centellis OCP Platform is designed for the development and deployment of network functions virtualization (NFV) applications orchestrated by software-defined networking (SDN). It is compatible with Artesyn’s Centellis® Virtualization Platform, which is based on a field-proven software framework for NFV. This gives service providers a common application deployment software platform, which is independent of the hardware architecture and can support the scaling of virtual network functions (VNFs) from the edge to the core of carrier networks.

“Our research shows that communications service providers have concerns about whether OCP and other commercial-off-the-shelf (COTS) technologies will meet the needs of their networks,” said Doug Sandy, chief technology officer, Artesyn Embedded Technologies. “Therefore, Artesyn is collaborating with customers and contributing to industry bodies such as the Open Compute Project (OCP) and European Telecommunications Standards Institute (ETSI) to apply our many years of experience in building solutions for the telecom infrastructure to the emerging demand for OCP technologies in carrier networks. The new Artesyn Centellis OCP Platform offers a path to a class of OCP solutions that are optimized to network equipment requirements.”

Artesyn has published an eBook, The Guide to OCP for Smart Carriers, which explores how OCP technologies offer great promise for service providers and considers the challenges in making these technologies viable for carrier networks.

About Artesyn Embedded Technologies

Artesyn Embedded Technologies is a global leader in the design and manufacture of highly reliable power conversion and embedded computing solutions for a wide range of industries including communications, computing, medical, military, aerospace and industrial. For more than 40 years, customers have trusted Artesyn to help them accelerate time-to-market and reduce risk with cost-effective advanced network computing and power conversion solutions. Artesyn has over 20,000 employees worldwide across nine engineering centers of excellence, four world-class manufacturing facilities, and global sales and support offices.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Autonomous Robotics Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
Connectivity solutions for autonomous robotic applications need to include a variety of orientations, stack heights, and contact systems. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec explore trends in autonomous robotic connectivity solutions and the benefits that Samtec interconnect solutions bring to these applications.
Jan 22, 2024
14,468 views