industry news
Subscribe Now

VadaTech Offers New AdvancedTCA High-End Processor/Carrier for PCIe Gen 3 Cards

Henderson, NV – Dec 01, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a new AdvancedTCA carrier for one PCIe Gen 3 card along with on-board Intel Xeon processor and shelf manager.

The ATC121 features a Xeon E3-1268L V3 processor, quad-core @ 2.3 GHz or turbo frequency @ 3.3 GHz.   The carrier has an x16 PCIe Gen 3 slot to accept any standard PCIe edge-type module.  The AdvancedTCA board also provides several graphics ports including dual Display Port input and a DVI-D and Display Port outputs. It also has dual RJ-45, USB, and RS-232 ports.  VadaTech offers customized versions of the ATC121 for different I/O front panel options. 

VadaTech’s ATC121 AdvancedTCA Carrier board offers an optional on-board VT003 shelf manager.  The VT003 is VadaTech’s standard 3rd generation shelf manager for AdvancedTCA boards and as a mezzanine in several 1U MicroTCA solutions.   The ATC121 also has optional mSATA sockets for up to several TB of storage. 

VadaTech offers AdvancedTCA systems, chassis, RTMs, carriers, switches, processors and specialty test products.   The company also provides MicroTCA chassis, power modules, JSMs, and over 200 AdvancedMCs of various types. 

About VadaTech

VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems.  With a focus on MicroTCA and AdvancedTCA solutions, the company offers unmatched product selection and expertise in the full xTCA ecosystem.   With our unique combination of electrical, mechanical, software, and system-level expertise, VadaTech can provide customized commercial or rugged computing solutions to meet the most complex customer requirements.  VadaTech also offers specialized product solutions for VPX/VME, CompactPCI, and other architectures.  A member of PICMG and VITA, VadaTech is headquartered in Henderson, NV with offices in Europe and Asia Pacific. 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
1,685 views