industry news
Subscribe Now

New Virtualization Platform from Artesyn Embedded Technologies Enables Faster and More Cost-Effective Service Provider SDN/NFV Deployments

Artesyn Embedded Technologies today announced the Centellis™ Virtualization Platform (Centellis VP), an open hardware and software solution that enables network equipment and service providers to save time-to-market and cost when implementing virtualized applications in next-generation networks. It includes the industry standard OpenFlow and OpenStack software stacks for software defined networking (SDN) and network function virtualization (NFV). The Centellis VP enables service providers to run multiple virtualized applications such as firewall, deep packet inspection (DPI), security, or session border controller on a single hardware platform – thus eliminating the need for multiple application-specific hardware platforms.

Load-balanced switching makes virtual application deployment even more efficient. Network traffic enters the Centellis VP through the switch blades, where Artesyn’s FlowPilot™ load balancing software direct traffic flows to the appropriate virtualized application, reducing the need for processor-intensive virtual switching (vSwitch). Artesyn’s Centellis VP is based on open hardware and software architectures, is carrier-grade and designed to be certified to NEBS standards.

Todd Wynia, vice president for communication products, Artesyn Embedded Technologies, said: “As service providers virtualize more applications, they can shorten their development time and cost with a highly scalable and carrier-grade platform such as Artesyn’s Centellis VP. Because our virtualization framework software is based on industry standard NFV stacks, virtual functions can be sourced from multiple vendors, avoiding application vendor lock-in and providing the best total cost of ownership.”

The Artesyn Centellis VP application virtualization software framework has been optimized using the Intel® Accelerated Data Plane Development Kit (DPDK). It is integrated with a widely-deployed ATCA hardware architecture to ensure a multi-vendor payload ecosystem combined with the scalability and maintainability of a bladed architecture. The Centellis VP is capable of up to 160 Gbps server interconnect to provide the bandwidth required for line-rate application processing and includes up to 12 dual-processor ArtesynATCA-7480 server blades based on the latest Intel® Xeon® E5-2600 V3 processors.

About Artesyn Embedded Technologies

Artesyn Embedded Technologies, formerly Emerson Network Power’s Embedded Computing & Power business, is a global leader in the design and manufacture of highly reliable power conversion and embedded computing solutions for a wide range of industries including communications, computing, medical, military, aerospace and industrial. For more than 40 years, customers have trusted Artesyn to help them accelerate time-to-market and reduce risk with cost-effective advanced network computing and power conversion solutions. Artesyn has over 20,000 employees worldwide across nine engineering centers of excellence, four world-class manufacturing facilities, and global sales and support offices.

 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Non-Magnetic Interconnects
Sponsored by Mouser Electronics and Samtec
Magnets and magnetic fields can cause big problems in medical, scientific, industrial, space, and quantum computing applications but using a non-magnetic connector can help solve these issues. In this episode of Chalk Talk, Amelia Dalton and John Riley from Samtec discuss the construction of non-magnetic connectors and how you could use non-magnetic connectors in your next design.
May 3, 2023
40,571 views