industry news
Subscribe Now

Tyco Electronics Provides High-Performance LCD Coaxial Embedded Display Interface (LCEDI) And LCEDI Source Receptacle (SR)

HARRISBURG, Pa. – Feb 15, 2011 – The rapidly developing tablet, notebook and netbook PC markets are creating demand for high-performance interconnects with sufficient throughput to drive the latest display technology. With these requirements in mind, Tyco Electronics (TE) introduced the next-generation LCD Coaxial Embedded Display Interface (LCEDI) family of connectors, with which TE is able to provide a total solution for panel / main board interconnection. 

There are two distinct versions of LCEDI connectors: LCEDI and LCEDI SR. LCEDI connectors are mainly designed for notebook panels and tablet PCs, while LCEDI SR connectors are designed for system applications. 

This family of connectors provides exceptional electrical performance in both low-voltage differential signaling (LVDS) and embedded DisplayPort (eDP) applications. It is licensed by I-PEX CO., LTD. and is fully compatible and intermateable with the I-PEX CABLINEVS connector series, the global standards connector for LED backlight wide (16×9) panel interface. Its ultra-low profile mating configuration (1.1mm height) makes it ideal for the slim LED backlight LCD panels of advanced notebook personal computers. 

VESA specified that next-generation digital video interface eDP, in conjunction with standard DisplayPort V1.1a specification, will support the PC market and offer a cost-effective substitute to current LVDS transmission technology. eDP architecture drives 2.7 Gbps per lane with a bandwidth of 10.8 Gbps over four differential lanes. Each data lane embeds clock signal for superb signal integrity, producing much lower EMI at higher speed data transmission. 

TE’s LCEDI connector family accommodates consistent digital data transmission through one, two or four DisplayPort standard lanes at a reduced bit rate of 1.62 Gbps or a high bit rate of 2.7 Gbps through each lane, and even faster data rates are possible over different wiring schemes. The product family offers high density for tablet, notebook and netbook PC applications, minimizing space and accommodating future pin out for LED backlight technology. 

For more information on the TE family of LCEDI connectors, please visit http://www.te.com/products/LCEDI-PR

ABOUT TYCO ELECTRONICS

Tyco Electronics Ltd. is a global technology company with fiscal 2010 sales of US$12.1 billion to customers in more than 150 countries. We design, manufacture and market products for customers in a broad array of industries including automotive; data communication systems; consumer electronics; telecommunications; aerospace, defense and marine; medical; energy; and lighting. With approximately 7,000 engineers and worldwide manufacturing, sales and customer service capabilities, we are a recognized leader in many of the industries we serve. More information on TE can be found at www.te.com.


Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Digi XBee 3 Global Cellular Solutions
Sponsored by Mouser Electronics and Digi
Adding cellular capabilities to your next design can be a complicated, time consuming process. In this episode of Chalk Talk, Amelia Dalton and Alec Jahnke from Digi chat about how Digi XBee Global Cellular Solutions can help you navigate the complexities of adding cellular connectivity to your next design. They investigate how the Digi XBee software can help you monitor and manage your connected devices and how the Digi Xbee 3 cellular ecosystem can help future proof your next design.
Nov 6, 2023
22,741 views