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The Amalgamation Situation

AMD and the Era of Data Convergence

Keep innovation in your back pocket and the end game in your sights at all times. This race is ride or die. The data center waits for no one. Mark Papermaster (CTO – AMD) joins Fish Fry this week to discuss the complex chip competition in the data center market, why open ecosystems are the lynchpin of data center evolution, and why he believes that your product is only as good as your team.  Also this week, we take a closer look at how you can maximize your performance-per-watt with Zynq UltraScale+ MPSoCs.


 

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Links for June 17, 2016

More information about AMD

New Episode of Chalk Talk: Running Out of Processing Power? No Problem.

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Andy Pease, CEO – QuickLogic

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

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We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

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Reduce 3D IC design complexity with early package assembly verification

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Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

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Littelfuse Protection IC (eFuse)
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