editor's blog
Subscribe Now

Conditioning Sensor Signals

Some time back, ZMDI made an announcement about a sensor conditioner they had released. A couple things gave me cause for pause as I looked it over. First was the description of a one-pass calibration process as being unique. The other was the fact that a major component of the advanced sensors you may see presented at conferences, examples of which we covered in a sensor article series earlier this year, is the associated circuitry required to turn a raw sensor output into a reliable, usable signal. I.e., conditioning the signal on the same chip as the sensor.

So I checked in with ZMDI to get their thoughts on both of these topics.

With respect to calibration, all sensors require it, worldly imperfections being what they are. Calibration involves measuring the response of the sensor and then applying corrections that are stored in the sensor; each unit has to be individually calibrated. The question is how you do it.

Some apparently correct using analog techniques; some, including ZMDI, use digital. Some – most of the analog ones in particular – use a multi-pass calibration process to set all of the various parameters because there may be coupling between them, so you need to set some values before measuring and setting others. So you do one measurement pass to acquire one set of values and set a correction. Then you do another pass and set a different parameter. Etc.

The one-pass approach measures all necessary data in one pass, and then offline software – e.g., in a PC – can calculate all of the corrections and program them into the sensor’s EEPROM. This is inherently a faster process than multi-pass.

As far as integrating the conditioner with the sensor is concerned, ZMDI agrees that, in principle, this can certainly be done and would be “a reasonable and mutually beneficial advancement,” although no ongoing projects at ZMDI were identified. They indicated that the kinds of sensors best suited to a combined solution are, of course, those that involve MEMS processes that integrate nicely with CMOS. Those include, in particular, piezo-electric sensors measuring things like pressure and strain as well as those that measure inertia – vibration and acceleration.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,531 views