industry news
Subscribe Now

Vishay Intertechnology’s New MOSFET and Diode Power Modules in EMIPAK 1B Offer a Complete Solution for On-Board Charging Applications

Flexible Devices Feature a Variety of Circuit Configurations in the Compact Package With PressFit Pin Locking Technology

MALVERN, Pa. — Nov. 16, 2022 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced seven new MOSFET and diode power modules designed specifically for on-board charger applications. Offered in a variety of circuit configurations, the integrated solutions combine high efficiency fast body diode MOSFETs and SiC, FRED Pt®, and MOAT diode technologies in the compact EMIPAK 1B package featuring patented PressFit pin locking technology.

The Vishay Semiconductors devices released today offer all the circuit configurations required for AC/DC, DC/DC, and DC/AC conversion in on-board charging applications — input / output bridges, full-bridge inverters, and power factor correction (PFC) — across a wide range of power ratings. Compliant with the AQG-324 automotive guideline, the modules can be combined to provide a complete solution for electric (EV) and hybrid electric (HEV) vehicles, in addition to e-scooters, agricultural equipment, railways, and more.

Based on a matrix approach, the devices’ EMIPAK package can accommodate a range of custom circuit configurations in the same compact 63 mm by 34 mm by 12 mm footprint. This enables higher power density than utilizing discrete solutions while providing the flexibility to use each module in different power stages for industrial and renewable energy applications, including welding, plasma cutting, UPS, solar inverters, and wind turbines.

The devices’ exposed AI2O3 direct bonded copper (DBC) substrate provides improved thermal performance, while their optimized layout helps to minimize stray inductance for better EMI performance. The modules’ PressFit pin locking technology allows for easy PCB mounting and reduces mechanical stress on the substrate, while their baseless structure increases reliability by reducing the number of solder interfaces.

Device Specification Table:

Part number Circuit configuration
VS-ENK025C65S Dual-boost PFC MOSFET and full-bridge MOSFET inverter
VS-ENV020F65U Six independent Ultrafast rectifier legs for output rectification
VS-ENW30S120T Full-bridge SiC diodes
VS-ENY050C60 Full-bridge inverter MOSFET
VS-ENV020M120M Six independent diode legs for AC line input rectification
VS-ENM040M60P Half-controlled input bridge plus boost PFC leg MOSFET and half-bridge inverter MOSFET
VS-ENZ025C60N Double-interleaved bridgeless PFC (four channels) with individual return diodes

Vishay offers a complete lineup of power modules built on silicon technologies, including Si and SiC diodes, thyristors, IGBTs, and MOSFETs, as well as passive components such as capacitors, shunts, and NTC and PTC thermistors. The devices are available in a wide range of topologies — standard solder pin and PressFit connections — with broad power spectrums. Compliant to industry standards, and customizable to meet specific application requirements, the power modules are highly flexible and cost-effective, and they help designers reduce time to market and improve overall system performance.

Samples of the new power modules are available now. Production quantities are available with lead times of 26 weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.™ Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

GaN Solutions Featuring EcoGaN™ and Nano Pulse Control
In this episode of Chalk Talk, Amelia Dalton and Kengo Ohmori from ROHM Semiconductor examine the details and benefits of ROHM Semiconductor’s new lineup of EcoGaN™ Power Stage ICs that can reduce the component count by 99% and the power loss of your next design by 55%. They also investigate ROHM’s Ultra-High-Speed Control IC Technology called Nano Pulse Control that maximizes the performance of GaN devices.
Oct 9, 2023
25,758 views