industry news
Subscribe Now

VadaTech Announces an Altera Arria-10™ GX1150 based AMC with Dual Embedded SFP/SFP+ GbE/10GbE

Henderson, NV – March 1, 2021 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC539. The AMC539 is based on the Altera Arria-10™ GX1150 FPGA in F1517 package and is compliant to AMC.1, AMC.2, AMC.3 and/or AMC.4 specifications. Additionally, the module has dual front panel SFP+ for 2x 10GbE fiber.

The on-board, re-configurable FPGA interfaces to the AMC FCLKA and TCLKA-D via an MLVDS Cross Bar Switch (CBS). The module includes an oven-controlled crystal oscillator (OCXO) clock reference which generates precise protocol-fixed clocks routed to the FPGA to support SyncE over GbE and 10GbE. It also has two banks of DDR4 (64-bit wide) giving 16 GB total memory, allowing for large buffer sizes to be stored during processing as well as for queuing the data to the host. Backplane fabric selection is by ordering option and FPGA load, including support for dual x4 PCIe.

About VadaTech

VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA, VPX and PCIe solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific.

Leave a Reply

featured blogs
Apr 16, 2024
In today's semiconductor era, every minute, you always look for the opportunity to enhance your skills and learning growth and want to keep up to date with the technology. This could mean you would also like to get hold of the small concepts behind the complex chip desig...
Apr 11, 2024
See how Achronix used our physical verification tools to accelerate the SoC design and verification flow, boosting chip design productivity w/ cloud-based EDA.The post Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud appeared ...
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
36,585 views