industry news
Subscribe Now

VadaTech Announces a Dual FMC+ Carrier with Xilinx Zynq® UltraScale+ FPGA

Henderson, NV – December 5, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC560. The AMC560 is an AMC FPGA Carrier with dual FMC+ (VITA 57.4) interfaces and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. The unit has a Xilinx UltraScale+ XCZU19EG MPSoC FPGA that provides 1,968 DSP Slices and 1,143k logic cells. The Zynq UltraScale+ EG devices feature a quad-core ARM® Cortex-A53 platform running up to 1.5GHz, combined with dual-core Cortex-R5 real-time processors and a Mali-400 MP2 graphics processing unit.

In addition, the on-board re-configurable FPGA interfaces directly to the AMC FCLKA, TCLKA-D, FMC+ DP0-16 and all FMC+ LA/HA/HB pairs. The FPGA has an interface to a single DDR4 memory channel (64-bit wide with ECC), which allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. The module has on board 64 GB of Flash, 128 MB of boot flash and a SD Card as an option.

About VadaTech

VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA, VPX and PCIe solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific.

Leave a Reply

featured blogs
Jan 27, 2020
Everybody writing software wants it to perform according to its specification and to be reliable. I hope that this is a safe assumption. There are 3 things to be done to achieve these goals: design well; implement carefully; test thoroughly. None of these are optional. A care...
Jan 27, 2020
I see switches everywhere: toggle switches, slider switches, rotary switches, pushbutton switches, magnetic switches, reed switches, mercury switches, smart switches, and'€¦ the list goes on....
Jan 24, 2020
[From the last episode: We looked at the different ways memory can be organized in different kinds of systems.] Let'€™s look at a scenario: you run a restaurant, but you'€™re short on funds to hire people. So you'€™re your own chief cook and bottle-washer. You do everyt...
Jan 23, 2020
Embedded design trends typically revolve around three main ideas: faster data rates, smaller form factors and cost-effective solutions. Those design trends drive the theme for the 2020 Embedded Tech Trends forum: The Business and Technology Forum for Critical and Intelligent ...

Featured Video

Automotive Trends Driving New SoC Architectures -- Synopsys

Sponsored by Synopsys

Today’s automotive trends are driving new design requirements for automotive SoCs targeting ADAS, gateways, connected cars and infotainment. Find out why it is essential to use pre-designed, pre-verified, reusable automotive-optimized IP to meet such new requirements and accelerate design time.

Drive Your Next Design to Completion Today with DesignWare IP® for Automotive SoCs