industry news
Subscribe Now

Toshiba releases new high peak output current photocouplers

Ultra-thin SO6L package offers easy upgrade path to reduce height in existing and new designs

Düsseldorf, Germany, 18th January 2022 – Toshiba Electronics Europe GmbH (“Toshiba”) has introduced two photocouplers (TLP5705H and TLP5702H), housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs. The rugged devices are ideally suited to applications in industrial equipment including inverters, AC servo drives, photovoltaic (PV) inverters and uninterruptible power supplies (UPS)

The TLP5705H is Toshiba’s first product to deliver a peak output current rating of ±5.0A in a thin SO6L package while the TLP5702H has a peak output current rating of ±2.5A. When designing with these new photocouplers, systems such as small to medium capacity inverters and AC servo drives that use buffer circuits for current amplification can now drive their IGBTs/MOSFETs directly from the photocoupler. This eliminates the need for any buffer circuit while simplifying design, reducing part count and enabling miniaturisation.

The SO6L package occupies a footprint of just 10.0mm x 3.84mm and can be mounted on the PCB land pattern of a conventional SDIP6 package, facilitating an easy upgrade path for Toshiba’s current photocouplers, such as the TLP700H.

At only 2.3mm (max.) high, the SO6L package is thinner than the current 4.25mm tall SDIP6, which brings greater flexibility to component placement, and also allows it to be mounted on the reverse side of a PCB or used where physical constraints impose limits on available height. Where a larger lead-form is required, the TLP5702H(LF4) and TLP5705H(LF4) designate parts with identical electrical performance, housed in an SO6L(LF4) package with wider pin distance.

All of the new photocouplers operate from a supply voltage (VCC) between 15 to 30V DC and offer a propagation delay of just 200ns. They all operate at temperatures between -40C and +125C making them ideal for industrial applications and other harsh environments.

Volume shipments of the new devices start today.
#
About Toshiba Electronics Europe
Toshiba Electronics Europe GmbH (TEE) is the European electronic components business of Toshiba Electronic Devices and Storage Corporation. TEE offers European consumers and businesses a wide variety of innovative hard disk drive (HDD) products plus semiconductor solutions for automotive, industrial, IoT, motion control, telecoms, networking, consumer and white goods applications. Next to HDDs, the company’s broad portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs) amongst others.

TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services. The company president is Mr. Tomoaki Kumagai.

For more company information visit TEE’s web site at www.toshiba.semicon-storage.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Introducing QSPICE™ Analog & Mixed-Signal Simulator
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Amelia Dalton and Mike Engelhardt from Qorvo investigate the benefits of QSPICE™ - Qorvo’s Analog & Mixed-Signal Simulator. They also explore how you can get started using this simulator, the supporting assets available for QSPICE, and why this free analog and mixed-signal simulator is a transformational tool for power designers.
Mar 5, 2024
5,879 views