industry news
Subscribe Now

Toshiba release new 40V/2.0A constant current stepper motor driver IC

Latest device operates without an external sense resistor and is integrated in the newly launched Stepper 17 Click board™ from Mikroe

Düsseldorf, Germany, 14. October 2021 – Toshiba Electronics Europe GmbH (“Toshiba”) has extended its lineup of stepping motor driver ICs with a new product that is capable of constant current motor control without the need for an external current sense resistor.

The new TB67S539FTG is housed in a 5.0mm x 5.0mm QFN32 package and is suited to a wide range of constant current control stepper motor applications including those found in office automation, commercial and industrial equipment. The device is also suited to use in surveillance cameras and projectors.

Based upon Toshiba’s latest BiCD process, the new product is capable of driving bipolar stepping motors at voltages up to 40V and currents up to 2.0A. The integrated H-bridge circuit for motor control uses an Nch/Nch configuration and has a built-in charge pump circuit for output stage control.

The current detector is integrated within the QFN32 package, removing the need for an external current sense resistor. In addition, the TB67S539FTG does not require an external capacitor for the charge pump as it is also integrated. With this high level of integration, the need for PCB space is significantly reduced.

The output stage (covering the upper and lower transistor) has an RDS(ON) of just 0.8 Ohm, ensuring efficient operation and reducing heat generation during use. When in sleep mode, the device draws a maximum current of 1µA.

Mass production shipments of the new device start today.

Alongside the stepping motor IC, a new, compact add-on board is also available. Created in partnership with Mikroe, the Stepper 17 Click board™ is supported by a mikroSDK compliant library, with functions that simplify software development.

For more information on the TB67S539FTG stepper motor IC, please visit:

Or, for the Stepper 17 Click board™, please visit:

About Toshiba Electronics Europe
Toshiba Electronics Europe GmbH (TEE) is the European electronic components business of Toshiba Electronic Devices and Storage Corporation. TEE offers European consumers and businesses a wide variety of innovative hard disk drive (HDD) products plus semiconductor solutions for automotive, industrial, IoT, motion control, telecoms, networking, consumer and white goods applications. Next to HDDs, the company’s broad portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs) amongst others.

TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services. The company president is Mr. Tomoaki Kumagai.

For more company information visit TEE’s web site at

Leave a Reply

featured blogs
Dec 8, 2021
It's almost time for the event that Design and Verification engineers have been waiting for - DVCon India. Now in the 6th year, the Design and Verification Conference, or DVCon, is one of the... [[ Click on the title to access the full blog on the Cadence Community site...
Dec 7, 2021
We explain the fundamentals of photonics, challenges in photonics research & design, and photonics applications including communications & photonic computing. The post Harnessing the Power of Light: Photonics in IC Design appeared first on From Silicon To Software....
Dec 6, 2021
The scary thing is that this reminds me of the scurrilous ways in which I've been treated by members of the programming and IT communities over the years....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Emulation and Prototyping to Accelerate Your Product Development Process

Sponsored by Cadence Design Systems

Validate your most sophisticated SoC designs before silicon and stay on schedule. Full system verification and early software development is possible with Cadence Palladium and Protium Dynamic Duo for IP/SoC verification, hardware and software regressions, full system verification, and early software development.

Click here for more information about Emulation and Prototyping from Cadence Design Systems

featured paper

Simplify building automation designs with MSP430

Sponsored by Texas Instruments

Find out how optimized building automation requires simple, flexible designs. With integrated, high-performance signal chain, MSP430 MCUs can enable high-accuracy motion detection, sensing and motor control to take performance and efficiency to the next level.

Click to read more

featured chalk talk

The Gateway to Connected Intelligent Vehicles

Sponsored by Mouser Electronics and NXP Semiconductors

Connectivity is going to play a vital role in the future of connected and autonomous vehicles. One of the keys to the success of our future automotive designs will be the incorporation of service-oriented gateways. In this episode of Chalk Talk, Amelia Dalton chats with Brian Carlson from NXP about the role that service-oriented gateways will play in the future of connected and autonomous vehicles and the details of NXP’s new S32G2 vehicle network processors that are going to make all of this possible.

Click here for more information about the NXP Semiconductors S32G2 Vehicle Network Processor