industry news
Subscribe Now

Superior Flexibility of RS485-Networking Transceiver from STMicroelectronics Simplifies Design, Saves Board Space and Bill of Materials

Geneva, December 3, 2018 — The STMicroelectronics STR485LV 3.3V transceiver for RS485  a (physical layer) communication standard broadly used in industrial systems applications enhances design flexibility by providing an external pin to select 20Mbps or 250kbps communication and interfacing directly with low-voltage logic down to 1.8V.

The user-selectable data rate allows designers to specify the same device and thus simplify inventory management for RS485-networking applications, ranging from high-speed/short-range up to the maximum communication distance (4000 feet) depending on cable performance. It is ideal for a wide variety of scenarios, including telecom infrastructure, high-speed data links, or low-voltage microcontroller communications.

Designers get the flexibility to connect low-voltage logic devices from 1.8V to 3.3V directly, without needing level-shifting components, leveraging the 1.65-3.6V supply-voltage range for data and enable signals. By maintaining internal driver-output resistance above 96Ω up to 105°C, the STR485 allows up to 256 transceivers on the same bus in accordance with the RS485 specification.

Rich features for safety and robustness include thermal shutdown to prevent bus contention or faults causing excessive power consumption, and a receiver failsafe mode that prevents errors if inputs are idle, shorted, or unconnected. The bus pins withstand over ±8kV contact discharge and ±16kV air discharge without latch-up, exceeding IEC 61000-4-2 specifications, and are resistant to IEC61000-4-4 fast transient burst class-B.

Packaged as a 3mm x 3mm DFN10 featuring flow-through logic-to-bus pinning that simplifies board design, the STR485 is available now from $1.55 for orders of 1000 pieces.

Please visit www.st.com/str485-pr for further information.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Want early design analysis without simulation?

Sponsored by Siemens Digital Industries Software

Traditional verification methods are failing today's complex IC designs, which require a proactive, early-stage analysis approach. A shift-left methodology addresses IP block integration challenges and the limitations of traditional simulation and ERC tools. Insight Analyzer detects hard-to-find leakage issues across power domains, enabling early analysis without full simulation. Identify inefficiencies earlier to reduce rework, improve reliability, and enhance power performance.

Click to read more!

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
2,150 views