industry news
Subscribe Now

SmartDV’s LPDDR5 IP Clocks 612 MHz in FPGA Functional Test, 1.6GHz at 28nm

Outperforms Competition by 3X During Recent Customer Evaluation

SAN JOSE, CALIF. –– May 6, 2020 –– SmartDV™ Technologies today confirmed its LPDDR5 SDRAM controller design intellectual property (IP) achieved a speed of over 600 megahertz (MHz) in a field programmable gate array (FPGA) functional test and 1.6 gigahertz (GHz) in a 28-nanometer design during a recent competitive evaluation.

The highly configurable LPDDR5 IP scored higher than competitive offerings by delivering faster performance (e.g. clock rate), outperforming the closest competitor by 3X. It demonstrated a smaller footprint due to lower gate count and lower power, as well as lower latency. 

“The recent completion of a technical qualification at a large semiconductor company calibrated the performance of our LPDDR5 controller IP and confirmed its exceptional competitive advantage,” says Deepak Kumar Tala, SmartDV’s managing director. “We’re especially proud of the IP’s high performance that reached 612Mhz. The closest competitor came in at 200Mhz.”

SmartDV’s design IP targets multiple applications such as high-performance computing, networking, wearables, IoT and mobile, and can be rapidly customized to meet specific user needs. In addition to earlier versions of its LPDDR SDRAM controller IP, it supports the JESD209-5 LPDDR5 protocol standard specification. The IP is compatible with DFI 5.0 and supports a variety of host bust interfaces, including AHB, APB, OCP, TileLink, Wishbone, VCI and Avalon PLB. An open, flexible architecture ensures it can be used for any custom bus interface. 

Availability and Pricing

The SmartDV LPDDR5 controller IP is delivered as soft design IP with register transfer level (RTL) source code and a comprehensive test suite that can be implemented in ASIC, system-on-chip (SoC) or FPGA designs. 

Pricing is available upon request.

Email requests for datasheets or more information should be sent to sales@Smart-DV.com 

About SmartDV

SmartDV™ Technologies is the Proven and Trusted choice for Verification and Design IP with the best customer service from more than 250 experienced ASIC and SoC design and verification engineers. SmartDV offers high-quality standard protocol Design and Verification IP for simulation, emulation, field programmable gate array (FPGA) prototyping, post-silicon validation, formal property verification and RISC-V CPU verification. Any of its Design and Verification IP solutions can be rapidly customized to meet specific customer design needs. The result is Proven and Trusted Design and Verification IP used in hundreds of networking, storage, automotive, bus, MIPI and display chip projects throughout the global electronics industry. SmartDV is headquartered in Bangalore, India, with U.S. headquarters in San Jose, Calif. 

Connect with SmartDV at:

Website: www.Smart-DV.com 

Linkedin: https://www.linkedin.com/company/smartdv-technologies/about/ 

Twitter: @SmartDV  

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
28,852 views