industry news
Subscribe Now

Sidense and Intellitech collaborate on Electronic Chip IDs, anti-counterfeiting and semiconductor security for Secure Supply Chain Enablement

Ottawa, Canada – (September 12, 2017) – Sidense Corp., a leading developer of non-volatile memory (NVM) IP cores, and Intellitech, a leader in IEEE 1149.x based standard solutions, have collaborated on a solution that enables an IC designer to easily implement a per-die IEEE 1149.1-2013 Electronic Chip ID with robust anti-tamper and anti-counterfeit security features. The solution forms the basis of secure supply chain enablement by authenticating that the IC is from the source it purports to be from and has passed tests for the speed and temperature grade with which it is marked.

IEEE 1149.1-2013/JTAG has standardized the general format for ECIDs (Electronic Chip Identification) with a set of description languages for programming and reading it. A basic ECID records the die position on the wafer with a unique ID that enables tracking of the die from wafer to field. This tracking is essential for correlation of failures found in SLT (System Level Test) back to the fabrication process to create improvements in wafer lithography and wafer test. The standard allows extending the ECID to include storage fields for die authentication, anti-cloning and per-die security. ECID also provides the basic foundation, through security keys, for device authentication, a fundamental requirement for secure boot and feature enablement.

The Sidense 1T-NVM is ideally suited for ECID, security key storage and other security related applications. 1T-NVM is very small with no physically detectable logic ‘state’ (unlike FLASH) that would allow security keys be read or altered. The initial vehicle for this collaboration is the Sidense SHF solution. The SHF comprises a Memory Array, containing the patented 1T-Fuse OTP bit cells, an Integrated Power Supply (IPS) and controller. The controller integrates a BOOT function for OTP and IPS power-up, a program and read verify function and a built-in self-test (BIST) capable of defect repairs.

“We are extremely pleased with our ongoing collaboration with Intellitech,” said Andrew Faulkner, Senior Director Product Management, Sidense Corp. “The outcome of this collaboration delivers a turnkey, standards-based solution for tracking die and for anti-cloning protection throughout the IC supply chain.”

The Intellitech NVM Silicon Instrument is Verilog IP that interfaces to the Sidense SHF controller. The instrument uses the IEEE 1149.1-2013 languages to describe recording fields for JEDEC vendor ID, fab, wafer, unique die ID, die X-Y position, speed and temperature grade along with the pass/fail status of the die. A recording field for an optional SHA256 hash of this data is provided as a maximum anti-tamper countermeasure. While the design of the NVM Silicon Instrument and Sidense memory prevents tampering, the SHA256 hash value guarantees that none of the identification data bits have been altered.  The Silicon Instrument provides read/write capability to the SHF array through a flexible and programmable firewall, allowing the designer to specify memory locations to be programmed during wafer-probe test but then locked from further reading via JTAG. Similarly, other locations used for the ECID can be programmed and then locked from further programming but are fully readable via JTAG in the field.

“Sidense was quick to recognize that their customers can get to working silicon faster with having pre-engineered standards-based ecosystems built-around their secure SHF 1T-NVM,” said CJ Clark, CEO of Intellitech Corporation.

The solution is completed using Intellitech’s NEBULA software development environment that addresses NVM use from design to fab and field. The designer can write, read, and lock the Sidense 1T-NVM with the IEEE 1149.1-2013 Procedural Description Language (PDL) scripts via the NEBULA software. This can be done pre-silicon via the NEBULA plug-ins that drive verification environments provided by the three major EDA players. A freely available “ECID reader” version of the software is available from Intellitech’s website for authentication of the die by the public.

About Sidense Corp.

Sidense Corp. provides very dense, highly reliable, and secure Logic Non-Volatile Memory (LNVM) IP for one-time programmable (OTP) and emulated Multi-time Programmable (eMTP) use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-NVM macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming, and device configuration uses.

Over 150 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-NVM as their embedded non-volatile memory solution for more than 500 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About Intellitech Corporation

Intellitech is a technology leader in test, debug and configuration solutions based on IEEE 1149.x related standards.  The company is sought out by customers to provide methodologies, IP and tools which lower a customer’s cost in developing or manufacturing an electronic product. Intellitech is a registered trademark of Intellitech Corp. in the U.S., E.U. and other countries. Silicon Instruments is a trademark of Intellitech Corp. Information about Intellitech can be found at https://www.intellitech.com.

 

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

OPTIGA™ TPM SLB 9672 and SLB 9673 RPI Evaluation Boards
Sponsored by Mouser Electronics and Infineon
Security is a critical design concern for most electronic designs today, but finding the right security solution for your next design can be a complicated and time-consuming process. In this episode of Chalk Talk, Amelia Dalton and Andreas Fuchs from Infineon investigate how Infineon’s OPTIGA trusted platform module can not only help solve your security design concerns but also speed up your design process as well.
Jun 26, 2023
35,755 views