Samtec, Inc., the service leader in the connector industry, announces product expansion of its popular mPOWER ultra micro power interconnect system. mPOWER vertical board connectors (UMPS, UMPT) and right-angle board connectors (UMPT-RA) are now available with through-hole board termination options, providing the enhanced mechanical robustness that is often required in harsh industrial, military, and aerospace applications. Connector designs using surface mount technology are also available.

Designed for power density, mPOWER ultra micro connectors offer a 40% space savings over conventional power connectors. Their compact form factor supports up to 18 A per power blade, enabling reliable high current performance without sacrificing board space.

In addition to power density, mPOWER interconnects provide design flexibility across board-to-board, wire-to-board, and wire-to-wire applications. System design is simplified through a range of options, including vertical and right-angle configurations, stack heights from 5 mm to 20 mm, rugged latching features, and 2 to 10 power positions. PVC or Teflon^® fluoropolymer cable assemblies are available in multiple wire gauges to support varying application needs.

About Samtec, Inc.

Samtec is a $1 billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ international locations and products sold in more than 125 countries, Samtec’s global presence enables its unmatched customer service. Samtec delivers next-generation, high-quality interconnect solutions for the datacom, telecommunications, computer, semiconductor, medical, industrial, automotive, and instrumentation industries, among others.