industry news
Subscribe Now

RS Components introduces new evaluation and development kits based on Infineon’s AURIX™ TriCore™ microcontroller

Application kits target fast and easy development for wide selection of use cases in automotive and industrial automation

LONDON, UK, 15 July 2021 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel provider of product and service solutions, today announced availability of a new range of evaluation and development kits for Infineon’s AURIX™ family of microcontrollers, which are based on the manufacturer’s 32-bit TriCore™ microprocessor core.

Infineon’s AURIX™ TriCore™ concept combines the elements of a RISC processor core, a microcontroller and a DSP in a single microcontroller chip that combines embedded safety and security features, making it a leading choice for electronics designers developing systems for a wide range of automotive and industrial applications.

The series of Arduino-compatible low-cost evaluation and development kits ranges from simple design projects up to more sophisticated designs. In addition, and to simplify development, Infineon’s AURIX™ platform offers a highly integrated software development (IDE) environment providing engineers with everything they need to compile, debug, and Flash program their AURIX™ MCU based applications.

The AURIX™ TC297 TFT application kit, for example, offers a low-cost and flexible application development platform for the 32-bit AURIX™ TriCore™ platform. The kit comes with various on-board components with specific features including the TC297 controller in a 292-pin LFBGA package, a 320 x 240 LCD display, SD card slot, high-speed CAN transceiver, and acoustic beeper.

At the high end of the AURIX™ portfolio, the range offers fully featured kits tailored to automotive and industrial use cases such as motor control units or automotive gateways. While at the lower end, the range includes the TC275 ‘lite’ and the TC375 lite kit both supported by the free of charge IDE (AURIX™ development studio). In addition, the TC275 ‘shield buddy’ and the TC375 lite kit low-cost kits that follow the Arduino standard, making it compatible with many of the widely available application shields.

The portfolio provides an extensive range of options for engineers, including a wide choice of memories, peripheral sets, frequencies, temperatures, and packaging options.

Infineon’s AURIX™ TriCore™microcontroller development kits are shipping now from RS globally.

About RS Components
RS Components is a trading brand of Electrocomponents plc, a global omni-channel provider of product and service solutions for designers, builders and maintainers of industrial equipment and operations. We stock more than 650,000 industrial and electronic products, sourced from over 2,500 leading suppliers, and provide a wide range of product and service solutions to over 1.2 million industrial customers. With operations in 32 countries, we trade through multiple channels and ship c. 60,000 parcels a day.

We support customers across the product life cycle, whether via innovation and technical support at the design phase, improving time to market and productivity at the build phase, or reducing purchasing costs and optimising inventory in the maintenance phase. We offer our customers tailored product and service propositions that are essential for the successful operation of their businesses and help them save time and money.

Electrocomponents plc is listed on the London Stock Exchange and in the year ended 31 March 2021 reported revenue of £2.0 billion. Electrocomponents plc has nine operating brands: RS Components, Allied Electronics & Automation, RS PRO, OKdo, DesignSpark, IESA, Synovos, Needlers and Liscombe.

For more information on RS, please visit the website at https://uk.rs-online.com/web/.

Leave a Reply

featured blogs
Jul 24, 2021
Many modern humans have 2% Neanderthal DNA in our genomes. The combination of these DNA snippets is like having the ghost of a Neanderthal in our midst....
Jul 23, 2021
The Team RF "μWaveRiders" blog series is a showcase for Cadence AWR RF products. Monthly topics will vary between Cadence AWR Design Environment release highlights, feature videos, Cadence... [[ Click on the title to access the full blog on the Cadence Community...
Jul 23, 2021
Synopsys co-CEO Aart de Geus explains how AI has become an important chip design tool as semiconductor companies continue to innovate in the SysMoore Era. The post Entering the SysMoore Era: Synopsys Co-CEO Aart de Geus on the Need for AI-Designed Chips appeared first on Fro...
Jul 9, 2021
Do you have questions about using the Linux OS with FPGAs? Intel is holding another 'Ask an Expert' session and the topic is 'Using Linux with Intel® SoC FPGAs.' Come and ask our experts about the various Linux OS options available to use with the integrated Arm Cortex proc...

featured video

DesignWare Controller and PHY IP for PCIe 6.0

Sponsored by Synopsys

See a demo of Synopsys’ complete IP solution for PCIe 6.0 technology showing the controller operating at 64GT/s in FLIT mode and the PAM-4 PHY in 5-nm process achieving two orders of magnitude better BER with 32dB PCIe channel.

Click here for more information about DesignWare IP for PCI Express (PCIe) 6.0

featured paper

Intel® Agilex™ FPGAs target IPUs, SmartNICs, and 5G Networks White Paper

Sponsored by Intel

Security challenges in the form of cyberattacks and data breaches loom ever larger as attacks on high-speed networks multiply. Massive amounts of data are at risk but so are physical resources, including critical physical infrastructure. Cryptography and authentication represent potent countermeasures. The latest members of the Intel® Agilex™ FPGA and SoC FPGA families feature hardened crypto blocks paired with MACsec soft IP to help mitigate the risks and limit the effects of these cyberattacks.

Click to read more

featured chalk talk

Complete Packaging for IIoT Devices

Sponsored by Mouser Electronics and Phoenix Contact

Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT design packaging.

Click here for more information about Phoenix Contact ICS 50 Enclosure System