industry news
Subscribe Now

RS Components adds Renesas Synergy™ AE-CLOUD2 kit to speed LTE IoT connectivity development

New development board kit uses latest cellular communication protocols for fast evaluation, prototyping and development of cloud-connected Internet of Things applications

LONDON, UK, 27 November, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel distributor, today announced that the Renesas Synergy™ AE-CLOUD2 kit (https://uk.rs-online.com/web/p/products/1771104/) from Renesas Electronics is now available and shipping from RS in the EMEA and Asia Pacific regions. The kit enables rapid evaluation, prototyping and development of LTE-cellular IoT cloud-connected applications.

The AE-CLOUD2 kit helps embedded developers to quickly and easily connect IoT devices and sensors to global cloud services via cellular (Note), Ethernet or Wi-Fi communications. It also allows them to evaluate new narrowband LPWAN (Low Power Wide Area Network) cellular radio options including the CAT-M1 and NB-IoT protocols, which have been specially developed for use in IoT applications.

The AE-CLOUD2 kit’s main processor board has a Renesas Synergy S5D9 microcontroller (MCU), which integrates a 120MHz Arm® Cortex®-M4 processor core, 2MB of code flash memory, up to 640KB of SRAM and 64KB of data flash. The MCU’s flash memory capability is expanded with an external 32MB memory device connected via a high-speed quad-SPI interface, which is ideal for the storage of graphics and other digital assets. The kit features a wide sensor selection including devices for sensing light, sound, temperature, humidity, pressure and air quality, as well as accelerometer and gyroscope measurement devices, and a geomagnetic sensor for compass navigation.

The AE-CLOUD2 kit can connect to a number of different IoT cloud platforms as well as the Renesas Synergy Enterprise Cloud Toolbox. This is a demo application that enables the fast connection to major cloud services, including Amazon Web Services, Microsoft Azure or Google Cloud, to display a web dashboard for visualising sensor data.

The kit can be used globally with support for Cat-M1, Cat-NB1 and 2G/EGPRS, as well as GPS. It also complies with global regulatory certifications for FCC, CE, RoHS, WEEE and Japan MIC. Contents of the kit include the Synergy S5D9 MCU board, Wi-Fi and LTE-CATM1 connectivity boards, plus cellular and GPS antennas, and USB and Ethernet cables.

Note: The AE-CLOUD2 kit has been designed to work with CAT-M and NB-IoT networks. Users should check that these networks are supported by cellular providers in their region and have the ability to configure the modem to establish a connection to an available regional network through a local cellular provider.

Renesas Synergy is a trademark of Renesas Electronics Corporation. Arm and Arm Cortex are registered trademarks of Arm Limited in the EU and other countries.

About RS Components
RS Components, Allied Electronics & Automation and IESA are the trading brands of Electrocomponents plc, a global multi-channel distributor. We offer more than 500,000 industrial and electronics products, sourced from over 2,500 leading suppliers, and provide a wide range of value-added services to over one million customers. With operations in 32 countries, we ship more than 50,000 parcels a day.

Electrocomponents is listed on the London Stock Exchange and in the last financial year ended 31 March 2018 had revenues of £1.71bn.

For more information, please visit the website at www.rs-online.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Embedded Storage in Green IoT Applications
Sponsored by Mouser Electronics and Swissbit
In this episode of Chalk Talk, Amelia Dalton and Martin Schreiber from Swissbit explore the unique set of memory requirements that Green IoT designs demand, the roles that endurance, performance and density play in flash memory solutions, and how Swissbit’s SD cards and eMMC technologies can add value to your next IoT design.
Oct 25, 2023
23,881 views