industry news
Subscribe Now

Renesas’ Innovative Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus

Renesas R-Car SoCs Contribute to Enhanced User Experience

TOKYO, Japan, October 26, 2021 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its R-Car H3 and R-Car M3 system-on-chips (SoCs) have been adopted by Toyota Motor Corporation (“Toyota”) for their next-generation multimedia systems. The Renesas R-Car H3 and R-Car M3 SoCs are designed for in-vehicle infotainment (IVI) applications that deliver images, audio, and a variety of information from both in-vehicle and external sources to the driver in a safe and convenient manner. Toyota’s next-generation multimedia system will make its first appearance in the Lexus NX, scheduled for release in November 2021 and later. These systems are planned to be installed in other Lexus- and Toyota-branded vehicles.

Toyota’s next-generation multimedia system incorporates a large-format, high-resolution, maximum 14-inch, wide touch display. The display area can be flexibly divided into sections and zoomed in and out, providing an outstanding combination of advanced functionality and convenience. The system features voice recognition functions, such as quick startup in response to voice commands, an automotive sound system, and an over-the-air (OTA) software update function.

Within these functions, Renesas’ R-Car SoCs provide the ability to smoothly import map information, images, and video input from users’ preferred devices, including smartphones, and connected applications to the large display. They also enable functions such as display touch controls, voice recognition via the microphone input, and audio output to multiple speakers. In addition, the R-Car SoCs’ sophisticated built-in security functions enable secure OTA software updates and provide advanced connected services powered by the SoCs’ outstanding computing performance.

As multimedia system functions vary based on the vehicle model, Toyota has implemented the R-Car H3 in systems for high-end models equipped with full functionality, and the mid-range R-Car M3 in other vehicle models. The R-Car Family provides excellent software compatibility across the product line, contributing to more efficient development when extending systems to a wide range of vehicle models. In addition, Renesas’ broad array of R-Car ecosystem partners offered support for its development.

“In order to meet users’ diversified needs in the CASE era, a new multimedia system was developed,” said Masato Kobayashi, Director of Connected System Development Division at Toyota Motor Corporation. “Two of our biggest challenges in realizing the leading-edge system was the efficient development while securing the necessary performance and making complex automotive software. Renesas’ R-Car SoCs are designed specifically for automotive applications, providing excellent performance and reliability, backed by a robust ecosystem – a combination that enabled us to create innovative multimedia systems.”

“I am delighted that Renesas’ R-Car SoCs are part of Toyota’s next-generation multimedia system, and that Lexus vehicles equipped with this functionality are coming to the market,” said Takeshi Kataoka, Senior Vice President and General Manager of the Automotive Solution Business Unit at Renesas Electronics Corporation. “I am excited that next-generation cockpit systems offering an intuitive user experience will be available in a wide range of car models moving forward, and that vehicles offering an enhanced user experience with security and convenience will become available worldwide.”

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedInFacebookTwitterYouTube, and Instagram.

Leave a Reply

featured blogs
Dec 8, 2021
It's almost time for the event that Design and Verification engineers have been waiting for - DVCon India. Now in the 6th year, the Design and Verification Conference, or DVCon, is one of the... [[ Click on the title to access the full blog on the Cadence Community site...
Dec 7, 2021
We explain the fundamentals of photonics, challenges in photonics research & design, and photonics applications including communications & photonic computing. The post Harnessing the Power of Light: Photonics in IC Design appeared first on From Silicon To Software....
Dec 6, 2021
The scary thing is that this reminds me of the scurrilous ways in which I've been treated by members of the programming and IT communities over the years....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Synopsys & Samtec Demo PCIe 6.0 IP, Connector & Cable Systems for AI Hardware Designs

Sponsored by Synopsys

This demo features Synopsys’ DesignWare PHY IP for PCIe 6.0, performing at maximum channel loss, with Samtec's connectors in a configurable, GPU-based AI/ML system.

Click here for more information about DesignWare IP for PCI Express (PCIe) 6.0

featured paper

Using the MAX66242 Mobile Application, the Basics

Sponsored by Analog Devices

This application note describes the basics of the near-field communication (NFC)/radio frequency identification (RFID) MAX66242EVKIT board and gives an application utilizing the NFC capabilities of iOS and Android® based mobile devices to exercise board functionality. It then demonstrates how the application enables use of memory and secure features in the MAX66242. It also shows how to use the MAX66242 with an onboard I2C temperature sensor, demonstrating the device's energy harvesting feature.

Click to read more

featured chalk talk

Security Regulations Drive Requirements

Sponsored by Mouser Electronics and Silicon Labs

IoT Security certification schemes can be complex, but security identities and security certification inheritance can make this aspect of your IoT design quite a bit easier. In this episode of Chalk Talk, Amelia Dalton chats with Mike Dow from Silicon Labs about the current state of global security regulations, the difference between physical and logical attacks, and how Silicon Labs SoCs and modules can help you solve the security demands of your next design.

Click here for more information about Silicon Labs EFR32xG21B SoC & xGM210P Modules with Secure Vault