industry news
Subscribe Now

Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2

Accelerates Robotics Development Support for Upcoming ROS 2 Communication Protocol and Contributes to Further Growth of the Robotics Market

TOKYO, Japan, October 29, 2018― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is accelerating the development of robotics systems to deliver intelligence at the industrial endpoint by extending the features of Renesas’ high-performance, 32-bit RX65N Series of microcontrollers (MCUs) to support the DDS-XRCE (Data-Distribution Service for Extremely Resource Constrained Environments™), one of the upcoming protocol standards for ROS 2 communication. Renesas’ support of the DDS-XRCE framework enables the development of software that controls the sensors and actuators that will be embedded at robotics system endpoints, such as welfare, safe guard, reception, cleaning, household robots, and other robotics endpoints.

The Robot Operating System (ROS) is a key framework that provides libraries and tools that enable developers to bring new innovations to the robotics community. There has been new interest in extending ROS access to embedded MCUs, which accelerates the development of service robots. The development of the ROS 2 addresses these needs.

Renesas implemented an eProsima Micro XRCE-DDS client on an RX65N MCU. Employing two RX65N MCU-based boards – one as a sensor operating as the eyes and nose of a robot, and one as an actuator operating as the robot’s hands and legs – Renesas has verified the successful control and communication of these devices using the DDS-XRCE. All software used in this demonstration will be open sourced and be available in Q4 2018.

“We are excited to see Renesas supporting DDS-XRCE, which extends ROS 2 to allow its use in embedded microcontrollers. Their work will provide additional momentum to expand the ROS community even further,” said Brian Gerkey, Chief Executive Officer, Open Robotics.

“We are pleased that Renesas has selected eProsima as the primary DDS-XRCE solution. We are leading networking middleware experts, and collaboration with the leading MCU company accelerates deployment of ROS 2 into embedded microcontrollers,” Jaime Martin Losa, Chief Executive Officer, eProsima. 

Renesas is a gold sponsor of ROSCon JP 2018, which was held in Tokyo on September 14th, 2018 and a bronze sponsor of ROSCon 2018 held in Madrid on September 29th and 30th, 2018, and proactively supports ROS community.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. A global leader in microcontrollers, analog, power, SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics, Office Automation and Information Communicatioxn Technology applications to help shape a limitless future. Learn more at renesas.com.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
10,840 views