industry news
Subscribe Now

Pixus Develops OpenVPX Chassis Platform Supporting Speeds in Excess of 100GbE and 2500W of Cooling

Waterloo, Ontario  —  Jan 5, 2020 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has provided the fastest known customized OpenVPX backplane/chassis design in the market.  

The 9U RiCool chassis platform for 6U OpenVPX boards features dual hot-swappable 191 CFM fans for cooling up to 2500W.  The design allows the use of Rear Transition Modules (RTMs) in all slots.  Rear-pluggable PSU’s provide power for the VPX and custom rails, available in various wattage and output options. 

The 14-slot design required routing for 28G+ signals across the backplane.  This is in excess of the 4 x 25G speeds of 100GbE and the capability of the high-performance RT3 VPX connector.   As such, a special high-speed connector was utilized for the 28G+ signals.  The backplane also required VITA 66.5 and VITA 67.x interfaces for optical and RF through the printed circuit board.

Pixus offers high-performance OpenVPX and other open standard architecture backplanes, chassis platforms, and specialty products.  The company also provides customizable faceplates, ejector handles, card guides, and other components.

 About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.  

Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
13,778 views