Waterloo, Ontario  —  Jan 31, 2022 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has a new 6U tall 19” rackmount chassis for 3U OpenVPX and SOSA aligned boards.  The chassis was designed specifically for the high-power requirements of solutions that are aligned to the SOSA technical standard. 

The rugged rackmount chassis supports up to 16 conduction-cooled modules per SOSA requirements and VITA 48.2 specifications.  A specialized card mat set diverts heat to fins which spread the heat away from the card cage.  Rear MIL grade fans then pull airflow through the fins to cool in excess of 100W/slot, depending on the application specifics.  

Pixus provides a wide range of OpenVPX and SOSA aligned profiles up to 100GbE and PCIe Gen4 speeds.  Various implementations of VITA 62 power supply configurations are available along with customizable I/O solutions for VITA 66/67 or other interfaces.  Pixus also offers a mezzanine-type of VPX Chassis Manager designed for SOSA aligned applications.  The unit is VITA 46.11 compliant and resides behind the backplane (without blocking any VITA 66/67 interfaces), and does not take up any plug-in slots.  

Pixus offers OpenVPX chassis solutions in various grades from commercial to MIL rugged.   The company has a variety of solutions for 3U and 6U sized boards. 

 About Pixus Technologies 

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  SOSA aligned, OpenVPX, ATCA, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.