industry news
Subscribe Now

ADLINK and Charles Industries Jointly Announce Industry’s First Pole Mounted Multi-access Edge AI and Machine Learning Solution

SAN JOSE, Calif. — March 18, 2019 — ADLINK Technology and Charles Industries, Ltd. (Charles) have joined together to demonstrate the industry’s first complete micro-edge low latency Artificial Intelligence/Machine Learning/Deep Learning (AI/ML/DL) solution that can be co-located on LTE small cell poles or with emerging 5G radios. The solution is being demonstrated at the NVIDIA GPU Technology Conference (GTC), March 19-21, at the San Jose McEnery Convention Center in Booth #317.

The new solution is a compact low profile pole or wall mountable unit based on an integration of ADLINK’s latest AI Edge Server MECS-7210 and Charles’ SC102 Micro Edge Enclosure. Combining the rugged designs from the two industry-leading companies, this advanced solution is ideally suited for outdoor telecom use cases and well positioned to be deployed globally enabling carriers and communities to provide a wide range of new and advanced services, including autonomous vehicles/pods, virtual and augmented reality applications, vision analytics with additional AI/ML/DL applications.

The solution further demonstrates ADLINK and Charles’ commitment to facilitating the transformation of communications network architectures in the era of 5G. Powered by advanced, dual-socket Intel® Xeon® Scalable processors, the MECS-7210 is a high performance, cost effective commercial-off-the-shelf (COTS) platform in a small footprint 2U chassis with 420mm of system depth. Designed for all I/O front access, dust prevention, wide operation temperature, and dual full-height full-length (FHFL) PCIe expansion slots reserved for access to acceleration hardware (FGPA/GPU), ADLINK’s MECS-7210 is among the first platforms to fully comply with Open Telecom IT Infrastructure (OTII) defined by Open Data Center Committee (ODCC) to meet 5G requirements of ultra-low latency, high bandwidth, real-time access to radio network.

Charles’ SC102 Micro-Edge Enclosure has been custom-designed for the MECS-7210, using advanced thermal modeling to ensure reliable, high-end AI and compute equipment performance in harsh outdoor operating environments. To be able to handle the extreme temperature ranges and rugged attributes of telecom edge technologies, the SC102 Micro-Edge Enclosures complies with the stringent Bellcore GR-487 specifications for an outdoor ambient environment of -40ºC to +55ºC.  The enclosed solution integrates system cooling and power by incorporating a 1,880W heat exchanger and 250W heater, and providing power feed options for either AC or DC depending on site availability. In addition, the enclosure is sealed against environmental elements such as rain, wind, ice, and sun and equipped with alarms for temperature and door intrusion.

The MECS-7210 Edge Server and SC102 enclosure are available as an integrated unit as well as separately, please contact ADLINK Technology or Charles Industries, Ltd. for details. For more information, please visit: www.adlinktech.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

VITA RF Product Portfolio: Enabling An OpenVPX World
Sponsored by Mouser Electronics and Amphenol
Interoperability is a very valuable aspect of military and aerospace electronic designs and is a cornerstone to VITA, OpenVPX and SOSA. In this episode of Chalk Talk, Amelia Dalton and Eddie Alexander from Amphenol SV explore Amphenol SV’s portfolio of VITA RF solutions. They also examine the role that SOSA plays in the development of military and aerospace systems and how you can utilize Amphenol SV’s VITA RF solutions in your next design.
Oct 25, 2023
24,010 views