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ON Semiconductor Introduces New 900 V and 1200 V SiC MOSFETs for Demanding Applications

PHOENIX, Ariz. – Mar.10, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has expanded their range of wide bandgap (WBG) devices (http://bit.ly/39lngB2) with the introduction of two additional families of silicon carbide (SiC) MOSFET (Read More → "ON Semiconductor Introduces New 900 V and 1200 V SiC MOSFETs for Demanding Applications"

Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics

SAN JOSE, Calif., March 9, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has been working together with STMicroelectronics to successfully tape out a 56G very short-reach (VSR) SerDes in 7nm for a system on chip (SoC) targeted at the networking, cloud and data center markets. Cadence provided the critical IP architecture, certain IP sub-blocks and relevant design support, leveraging its investments in 56G and 112G PAM4 SerDes technology while ST developed the complete SerDes core, making use of its extensive know-how in this field.

“Cadence’s strong 112G SerDes fully hits the requirements relevant to ASICs … Read More → "Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics"

OmniVision Unveils Nyxel® 2 Technology, Extends Lead in No-Light, Near-Infrared CMOS Image Sensing Performance for Machine and Night Vision

SANTA CLARA, California – March 9, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced Nyxel® 2—the second generation of its revolutionary near-infrared (NIR) technology for image sensors that operate in low to no ambient light conditions. Despite launching the first generation more than two years ago, competing mass-produced CMOS image sensors are still failing to … Read More → "OmniVision Unveils Nyxel® 2 Technology, Extends Lead in No-Light, Near-Infrared CMOS Image Sensing Performance for Machine and Night Vision"

High-Grade iNEMO Sensors from STMicroelectronics Deliver Machine-Learning Core Efficiencies for Industrial and Consumer Applications

Geneva, March 9, 2020 – STMicroelectronics is extending the benefits of its motion-detection machine-learning core (MLC) technologies into industrial and high-end consumer applications with the latest ISM330DHCX and Read More → "High-Grade iNEMO Sensors from STMicroelectronics Deliver Machine-Learning Core Efficiencies for Industrial and Consumer Applications"

Vishay Intertechnology Automotive Grade IHDM Inductor Offers Stable Inductance and Saturation at Temps to +180 °C and Current to 150 A

MALVERN, Pa. — March 9, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHDM Automotive Grade edge-wound, through-hole inductor with rated current up to 150 A for under the hood applications. Featuring powdered iron alloy core technology, the Vishay Custom Magnetics IHDM-1008BC-3A provides stable inductance and saturation over a demanding operating temperature range from -40 °C to +180 °C with low power losses and excellent heat dissipation.

The edge-wound coil of the device released today provides low DCR down to 0.25 mΩ, which minimizes losses and improves rated current performance for increased efficiency. Compared to competing ferrite-based solutions, the … Read More → "Vishay Intertechnology Automotive Grade IHDM Inductor Offers Stable Inductance and Saturation at Temps to +180 °C and Current to 150 A"

CEVA Unveils World’s Most Powerful DSP Architecture

  • Gen4 CEVA-XC architecture offers highest performance of 1,600 GOPS, innovative dynamic multithreading and advanced pipeline to reach operating speeds of 1.8GHz at 7nm
  • CEVA-XC16, first processor based on the architecture, targets 5G Intelligent Radio Access Networks (RAN) and enterprise access points, with 2.5X improvement in peak performance
MOUNTAIN VIEW, Calif., – March 4, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced the unveiling of the world’s most powerful DSP architecture, the Gen4 CEVA-XC. This new architecture delivers unmatched performance for the most complex parallel processing workloads required … Read More → "CEVA Unveils World’s Most Powerful DSP Architecture"

LMD demonstrates Bluetooth-enabled V-Sensor™, bringing medically-accurate blood pressure and temperature measurement to wearables market

March  2020,Lausanne, Switzerland:  Leman Micro Devices (LMD), the developer of regulated consumer healthcare products that is backed by major players within the mobile device industry, announces that its V-Sensor™, which together with the company’s e-Checkup™ app, measures five vital signs – blood pressure, body temperature, pulse rate, respiration rate and blood oxygen – is now Bluetooth-enabled.  This development extends the company’s unique technology to the wearables market, … Read More → "LMD demonstrates Bluetooth-enabled V-Sensor™, bringing medically-accurate blood pressure and temperature measurement to wearables market"

LoRa Alliance® Brings LoRaWAN® World Expo to Paris in June 2020

Fremont, California – Mar. 5, 2020 – The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for the Internet of Things (IoT) low-power wide-area networks (LPWANs), today formally introduced the Read More → "LoRa Alliance® Brings LoRaWAN® World Expo to Paris in June 2020"

STMicroelectronics Announces New Audio Amplifier IC That Leverages the Expertise of Alps Alpine

Geneva, March 5, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the new FDA901 class-D audio amplifier IC, with a semiconductor design that incorporates the world-class audio design expertise of Alps Alpine Co., Ltd., a major Japanese manufacturer of car audio equipment and information communication equipment. The new chip aims to contribute to the creation of multi-function, high-fidelity car audio systems that fuse the high efficiency of class-D amplifiers with the high-quality sound of ST’s class-AB amplifiers.

The FDA901 features low residual noise, a low … Read More → "STMicroelectronics Announces New Audio Amplifier IC That Leverages the Expertise of Alps Alpine"

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