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Image available by request or download from this link. STMicroelectronics Introduces STM32L4+ Microcontrollers for Power- and Cost-Sensitive Smart Embedded Applications

March 12, 2020

Geneva, March 12, 2020 – New STM32L4P5 and STM32L4Q5 microcontrollers (MCUs) from STMicroelectronics bring the performance of the Arm® Cortex®-M4 core to cost-sensitive and power-conscious smart connected devices, including utility meters, industrial and medical sensors, fitness trackers, and smart-home products.

With memory density down to 512KB Flash and 320KB SRAM, ST’s new STM32L4+ MCUs deliver performance with economy. Compact 10mm x 10mm 64-pin and 7mm x 7mm 48-pin package options let designers tackle applications limited by size constraints such as wearable form factors.

Read More → "Image available by request or download from this link. STMicroelectronics Introduces STM32L4+ Microcontrollers for Power- and Cost-Sensitive Smart Embedded Applications"

DVCon U.S. 2020 Announces Stuart Sutherland Best Paper & Best Poster Winners

March 12, 2020

Louisville, CO – March 12, 2020 –The 2020 Design and Verification Conference and Exhibition U.S. (DVCon U.S.), sponsored by Accellera Systems Initiative (Accellera), concluded its 32nd annual event last week. The 2020 Best Paper and Poster winners, as voted on by attendees, were announced at the closing reception.

The Steering Committee adjusted the conference and exhibition schedule to three days from the traditional four-day program to accommodate schedule changes. To honor the work that all session, tutorial, poster, short workshop, panel presenters and exposition partners put into the conference, and to connect with registered attendees who … Read More → "DVCon U.S. 2020 Announces Stuart Sutherland Best Paper & Best Poster Winners"

Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers

Optimized software enables low-power neural network inferencing for advanced audio, voice and sensing applications
March 11, 2020

SAN JOSE, Calif., March 11, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that software for Cadence® Tensilica® HiFi digital signal processors (DSPs) has been optimized to efficiently execute TensorFlow Lite for Microcontrollers, part of the TensorFlow end-to-end open-source platform for machine learning (ML) from Google. The combination of edge-based ML running on the ultra-low power cores supports the increasing demand for pervasive intelligence in advanced audio, voice and sensing applications. For more information on the Tensilica HiFi DSP family, visit Read More → "Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers"

Renesas Expands RF Beamforming Portfolio for Satellite Communications, Radar, and Phased Array Applications

Next-Generation Beamformer ICs and Dual-Channel Low Noise Amplifiers Improve Transmit Efficiency and Lower Receive Noise of Phased Array Antennas
March 11, 2020

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave solutions with the introduction of two new IC families for satellite communications (Satcom), radar, and phased array applications: The F65xx transmit active beamforming ICs and F692x low-noise amplifiers (LNAs). Featuring a combination of low power consumption, high gain, and compact size, the new solutions deliver a performance boost for antennas used in Satcom and radar systems.</ … Read More → "Renesas Expands RF Beamforming Portfolio for Satellite Communications, Radar, and Phased Array Applications"

Renesas Expands RF Beamforming Portfolio for Satellite Communications, Radar, and Phased Array Applications

Next-Generation Beamformer ICs and Dual-Channel Low Noise Amplifiers Improve Transmit Efficiency and Lower Receive Noise of Phased Array Antennas
March 11, 2020

Düsseldorf, March 10, 2020 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave solutions with the introduction of two new IC families for satellite communications (Satcom), radar, and phased array applications: The F65xx transmit active beamforming ICs and F692x low-noise amplifiers (LNAs). Featuring a combination of low power consumption, high gain, and compact size, the new solutions … Read More → "Renesas Expands RF Beamforming Portfolio for Satellite Communications, Radar, and Phased Array Applications"

Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave

Alphawave Adopts Synopsys Solution to Accelerate Design of High-speed Connectivity IP
March 11, 2020

MOUNTAIN VIEW, Calif., March 10, 2020 /PRNewswire/ —

Highlights:

Ambiq Micro’s Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA’s Bluetooth® Low Energy IP

Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC) already powered by the new Bluetooth licensing agreement
March 11, 2020
MOUNTAIN VIEW, Calif., – March 10, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Ambiq Micro, the leader in ultra-low power solutions has licensed CEVA’s RivieraWaves Bluetooth® low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC) that features in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices from the world’s biggest brands.

RS Components launches next generation of compact, low-cost, high-spec RF signal generators

New touchscreen GUI, complex digital modulation and output up to 3GHz
March 11, 2020

LONDON, UK, 10 March 2020 – RS Components (RS) (https://uk.rs-online.com/web/), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has introduced a new generation of radio-frequency (RF) signal generators from Aim-TTi, providing high performance and functionality without the price tag normally associated with a leading manufacturer. Aimed at industrial electronics design, … Read More → "RS Components launches next generation of compact, low-cost, high-spec RF signal generators"

NXP Digital Key Solution Expands Secure Car Access Across Key Fobs, Smartphones, Smart Cards and Other Mobile Devices

March 10, 2020
  • Makes Car Access Securely transferable from 1:1 to many-to-many
  • Leverages Car Connectivity Consortium (CCC) Standards with Secure Element (SE) and NFC Technologies
  • Provides components and the end-to-end cybersecurity architecture for enabling the digitalization of car access.

    EINDHOVEN, The Netherlands, March 10, 2020 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a new automotive Digital Key Solution that enables smartphones, key fobs and other mobile devices to securely communicate, store, authenticate and share digital keys with vehicles. The solution expands the convenience of car access by providing the secure basis required to enable new features like key … Read More → "NXP Digital Key Solution Expands Secure Car Access Across Key Fobs, Smartphones, Smart Cards and Other Mobile Devices"

Newark Launches Exclusive Raspberry Pi 4 Starter Kit to Provide Customers with All-in-One Kit for Quick-Start Embedded Computing

March 10, 2020

Chicago – March 10, 2020: Newark, the Development Distributor, has launched its exclusive Raspberry Pi 4 Starter Kit. Featuring the Raspberry Pi 4 Model B computer and a range of Newark’s own brand Multicomp Pro products, the new Starter Kit provides an out of the box experience for first-time users and customers looking to reduce new product development times.

Available for same day shipping, the Raspberry Pi 4 … Read More → "Newark Launches Exclusive Raspberry Pi 4 Starter Kit to Provide Customers with All-in-One Kit for Quick-Start Embedded Computing"

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