News – Page 794 – EEJournal

DATA MODUL presents a new product category: easyTOUCH Plus

October 14, 2020

Hauppauge, 10/12/2020

DATA MODUL presents easyTOUCH Plus, a new standard off the shelf product line which consists of printed cover glasses optically bonded to its proprietary easyTOUCH PCAP products alongside a matching controller.

In contrast to DATA MODUL’s established easyTOUCH Display line, easyTOUCH Plus products are delivered without a pre-assembled display. This approach offers customers more flexibility in selecting the suitable display for their PCAP application.

“The easyTOUCH Plus products can also be offered bonded directly to a TFT upon request. Customers are able to … Read More → "DATA MODUL presents a new product category: easyTOUCH Plus"

RS Components provides essential engineering support to young superbike team at leading UK championships through its RS PRO range of mechanical tools

RS’ sponsorship of GR MotoSport team at Bennetts British Superbikes championships this week brings the highest international safety standards on engineering equipment to safeguard riders

October 14, 2020

LONDON, UK, 13 October 2020 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers and suppliers, has announced its sponsorship of the GR MotoSport (https://grmotosport.co.uk/) team at this week’s Bennetts British Superbikes (BSB) (Read More → "RS Components provides essential engineering support to young superbike team at leading UK championships through its RS PRO range of mechanical tools"

Microchip Technology Introduces Its First Trust&GO Wi-Fi® 32-bit MCU Module with Advanced Peripheral Options

Pre-provisioned for market-leading cloud platforms, the all-in-one WFI32E01PC Trust&GO solution delivers powerful MCU functionality and verifiable identity

October 14, 2020

CHANDLER, Ariz., Oct. 13, 2020 (GLOBE NEWSWIRE) — As the Internet of Things (IoT) expands beyond home automation and drives deeper into home control – including Heating, Ventilation and Air Conditioning (HVAC), garage doors and fans – and grows in building and industrial automation, the need for highly integrated, reliable and secured Industrial IoT (IIoT) connectivity is greater than ever. Microchip Technology (Nasdaq: MCHP) today announced the first-ever Wi-Fi microcontroller (MCU) module with Microchip’s Trust&GO-enabled unique, verifiable identity.

For developers designing secure IIoT systems, Microchip’s highly integrated Read More → "Microchip Technology Introduces Its First Trust&GO Wi-Fi® 32-bit MCU Module with Advanced Peripheral Options"

Cadence Brings Verification IP to the Chip Level with New System VIP Solution

New offering enables up to 10X efficiency gains in system-level testbench assembly, execution and analysis for hyperscale, automotive, mobile and consumer chips

October 13, 2020

SAN JOSE, Calif., October 13, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® System-Level Verification IP (System VIP), a new suite of tools and libraries for automating system-on-chip (SoC) testbench assembly, bus and CPU traffic generation, cache-coherency validation and system performance bottleneck analysis. Using Cadence System VIP, customers creating complex hyperscale, automotive, mobile and consumer chips can improve chip-level verification efficiency by up to 10X.

For more information about Cadence System VIP, please visit Read More → "Cadence Brings Verification IP to the Chip Level with New System VIP Solution"

Synopsys Demonstrates Industry’s First PCI Express 5.0 IP Interoperability with Intel’s Future Xeon Scalable Processor

Successful Interoperability Enables Low-Risk Integration and Broad Adoption of the PCIe 5.0 Interface in High-Performance Computing SoCs

October 13, 2020

MOUNTAIN VIEW, Calif., Oct. 13, 2020 /PRNewswire/ —

Highlights:

Interoperability establishes end-to-end 32GT/s PCIe 5.0 link between DesignWare IP for PCI Express 5.0 Complete Solution and future Intel Xeon Scalable processors
The DesignWare IP for PCI Express 5.0 delivers industry’s lowest latency and highest throughput with optimized power consumption for short and long channels
Future Intel Xeon Scalable processors deliver … Read More → "Synopsys Demonstrates Industry’s First PCI Express 5.0 IP Interoperability with Intel’s Future Xeon Scalable Processor"

iWave chooses u-blox JODY-W2 Bluetooth® and Wi-Fi module for its i.MX8 system-on-module and single-board computer designs

JODY-W2 robustly fulfilled the high expectations in terms of short range connectivity on the industrial-grade computing platforms.

October 13, 2020

Thalwil, Switzerland – October 13, 2020 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies and services, today announced that iWave Systems Technologies, an Indian-based hardware design firm, has selected the u blox JODY-W2 multiradio module for its powerful i.MX8 system-on-module (SOM) and single-board computer (SBC) designs. The solutions target complex consumer, medical, and industrial embedded computing applications.

The i.MX8 SOM and SBC solutions are highly integrated computing platforms that are designed for multimedia-focused applications. They boast extensive computing power delivered by a dual cortex A72, quad cortex A53 cores, dual graphical processing unit ( … Read More → "iWave chooses u-blox JODY-W2 Bluetooth® and Wi-Fi module for its i.MX8 system-on-module and single-board computer designs"

TE Connectivity designs NTSEAL 20 Position Connector for use in harsh environments

Innovative, hybrid connector utilizes the industry-trusted TE/DEUTSCH Size 16 & 20 Common Contact System for inline applications

October 13, 2020

SHANGHAI – Oct. 13, 2020 – To address the need for flexible and robust wire-to-wire connectivity in a compact format, TE Connectivity (TE), a world leader in connectivity and sensors, has designed Read More → "TE Connectivity designs NTSEAL 20 Position Connector for use in harsh environments"

MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem

Collaboration intended to expand global availability of standardized, interoperable solutions for high-speed in-vehicle connectivity

October 13, 2020

PISCATAWAY, N.J., October 13, 2020 – The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced it has signed a memorandum of understanding (MOU) with IEEE, the world’s largest technical professional … Read More → "MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem"

TDK develops miniaturized, high-performance automotive power inductors

October 13, 2020

47 μH inductance achieved in a small size
Product structure that reduces open risks
Operating temperature range up to 155°C
Qualified in accordance with AEC-Q200

October 13, 2020

TDK Corporation (TSE: 6762) developed new power inductors, BCL322515RT, for use in automotive electronics, intended for insertion into the power line of an automobile electronic control circuit. Mass production will launch in October 2020.

Using TDK’s proprietary material technologies and structure design, the inductors achieve high inductance (47 μH) in a small size (3.2 x 2.5 x 1.5 mm). The saturation current is 0.72 A. … Read More → "TDK develops miniaturized, high-performance automotive power inductors"

Silicon Labs Strengthens Isolated Gate Driver Portfolio

New isolated gate drivers cut latency by 50% while significantly increasing transient immunity

October 13, 2020

AUSTIN, Texas – October 13, 2020 – Read More → "Silicon Labs Strengthens Isolated Gate Driver Portfolio"