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Samtec Virtually Showcases Latest Silicon-to-Silicon Interconnect Solutions at SC20

November 13, 2020

New Albany, IN Samtec Inc., a privately held $800 MM global manufacturer of a broad line of electronic interconnect solutions, will virtually showcase and demonstrate their latest high-performace interconnect solutions at SuperComputing 2020.

HPC system designers must balance increasing throughput, scalability and density demands with cost and time-to-market. Samtec addresses these challenges with industry-leading design expertise, system optimization, and innovative architectural solutions ideally suited for HPC applications. Key technologies will be featured during SC20 via the Exhibitor Forum, Virtual Demonstations and Featured Products.

SC20 Exhibitor Forum

Read More → "Samtec Virtually Showcases Latest Silicon-to-Silicon Interconnect Solutions at SC20"

ON Semiconductor and Theta Power Systems International Establish Collaboration for Motor Control Applications

Relationship will provide engineers with easy access to advanced motor control techniques
November 11, 2020

PHOENIX, Ariz. – Nov. 10, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has established a collaboration with Theta Power Systems International. This collaboration will enable customers to capitalize on industry-leading motor control techniques along with high performance semiconductor solutions targeting applications migrating to brushless DC (BLDC) motors.

Theta Power Systems International has several decades of experience deploying motor control software with name-brand appliance companies, along with a customer base that spans the globe. Together, Theta Power Systems International and ON Semiconductor will address the causes behind motors consuming approximately 45% of the world’s electricity, by providing hardware and … Read More → "ON Semiconductor and Theta Power Systems International Establish Collaboration for Motor Control Applications"

CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC

November 11, 2020

Rockville, MD., – November 11, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).

“We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP solution for its next-generation automotive SoC,” said Gideon Wertheizer, CEO of CEVA. “Automotive manufacturers are continually adopting more cameras, radars and other sensors throughout the car to ensure a safer and more automated driving experience. Our leading-edge DSPs along with our software framework and stringent safety … Read More → "CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC"

Pinnacle Imaging SystemsTM Announces DenaliTM 3.0 ISP

The 3rd generation Denali programable ISP is a fully customizable solution for designers of mission critical applications demanding maximum real-time imaging data from a small-footprint and energy-efficient ISP on the Xilinx Zynq UltraScale+ platform.
November 11, 2020

South San Francisco, C.A. – November 11, 2020 – Today, Pinnacle Imaging SystemsTM, a developer of Image Signal Processors (ISP) and High Dynamic Range (HDR) video solutions, launched its new Denali™ 3.0 Programmable Image Signal Processor IP. Pinnacle Imaging’s camera-ready, end-to-end HDR ISP leverages its proprietary advanced algorithms to accurately tone map high contrast scenes for mission critical applications requiring data-rich, real-time imaging. With Denali 3.0, Pinnacle Imaging … Read More → "Pinnacle Imaging SystemsTM Announces DenaliTM 3.0 ISP"

Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP

Certification enables customers to develop ISO 26262-compliant SoCs for autonomous driving and ADAS applications
November 11, 2020

SAN JOSE, Calif., November 10, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification. The ISO 26262:2018 functional safety standard’s ASIL B(D) certification is essential for the development of automotive systems-on-chip (SoCs) used in autonomous driving and advanced driver assistance systems (ADAS) applications. For more information on the Tensilica ConnX B10 and B20 DSPs, please visit Read More → "Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP"

IAR Systems accelerates development of smart factory applications based on Renesas’ R-IN32M4

New evaluation kit simplifies evaluation of Renesas’ R-IN32M4-CL3 IC for industrial Ethernet communication with CC-Link IE TSN
November 11, 2020

Tokyo, Japan / Uppsala, Sweden—November 11, 2020—IAR Systems®, the future-proof supplier of software tools and services for embedded development, today announces the availability of the new evaluation kit IAR KickStart Kit™ for Renesas’ R-IN32M4-CL3, assisting developers in development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which support CC-Link IE TSN targeted for smart factory applications.

The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. It combines gigabit Ethernet bandwidth with Time-Sensitive Networking (TSN). Renesas’ R-IN32M4-CL3 is tailored for CC-Link IE TSN and meets TSN … Read More → "IAR Systems accelerates development of smart factory applications based on Renesas’ R-IN32M4"

First Cryptographic Companion Device Brings Pre-programmed Security to the Automotive Market

Microchip’s new TrustAnchor device provides OEMs and their module suppliers with a simplified path to automotive network security, reducing costs and time to market
November 11, 2020

CHANDLER, Ariz., Nov. 11, 2020 (GLOBE NEWSWIRE) — Due to the rise of in-vehicle network connections like Bluetooth® and LTE/5G, today’s vehicles host more vulnerabilities than ever before, driving new cybersecurity regulations and specifications for the automotive market. Helping OEMs and their module suppliers simplify the upgrade of existing designs to meet security requirements for future generations, Microchip Technology Inc. (Nasdaq: MCHP) today announced its Read More → "First Cryptographic Companion Device Brings Pre-programmed Security to the Automotive Market"

STMicroelectronics and Quanta Computer Collaborate on Reference Design for Augmented-Reality Smart Glasses

November 11, 2020
  • Leverages Quanta’s expertise in system design for manufacturability
  • Builds on ST leadership and successes in MEMS1 micro-actuation and LBS2 systems

Geneva, Switzerland, and Taiwan, November 11, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Quanta Computer, a world-leading notebook computer manufacturer, have agreed on a joint effort to develop a reference design for augmented-reality (AR) smart glasses. Based on ST’s Laser-Beam Scanning technology and Quanta’s AR eyewear design and manufacturing capabilities, the AR-glasses reference design … Read More → "STMicroelectronics and Quanta Computer Collaborate on Reference Design for Augmented-Reality Smart Glasses"

congatec premiers AMD Ryzen Embedded V2000 processor on COM Express Compact

Massively more power on much smaller footprint
November 11, 2020

San Diego, CA, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the … Read More → "congatec premiers AMD Ryzen Embedded V2000 processor on COM Express Compact"

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