industry news
Subscribe Now

Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP

Certification enables customers to develop ISO 26262-compliant SoCs for autonomous driving and ADAS applications

SAN JOSE, Calif., November 10, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification. The ISO 26262:2018 functional safety standard’s ASIL B(D) certification is essential for the development of automotive systems-on-chip (SoCs) used in autonomous driving and advanced driver assistance systems (ADAS) applications. For more information on the Tensilica ConnX B10 and B20 DSPs, please visit

The ASIL B(D) certification includes support for both random hardware faults (ASIL B) and systematic faults (ASIL D). This certification is based on SGS-TÜV Saar’s comprehensive audit and assessment of the functional safety development flow in accordance with the ISO 26262:2018 standard and can be found on the SGS-TÜV website.

“Cadence Tensilica ConnX B10 and B20 DSPs are the first DSPs optimized for radar, lidar and V2X applications to achieve Functional Safety Processor full compliance based on SGS-TÜV Saar’s comprehensive assessment in accordance with the ISO26262:2018 standard,” said Wolfgang Ruf, head of Functional Safety for Semiconductors at SGS-TÜV Saar. “Certification of the Cadence Tensilica ConnX B10 and B20 DSPs for ASIL D systematic and ASIL B random compliance attests to the high functional safety quality of their DSP IP, which meets stringent automotive industry safety-critical requirements. SoC designers can have peace of mind that their designs can achieve compliance when using functional safety-certified Tensilica DSP IP.”

Tensilica ConnX DSPs are widely used for building entry-level to high-performance sensors and communication ICs for automotive applications. These DSPs support various data types (8b, 16b, 32b and 64b) and IEEE 754 floating-point precisions, including half, single and double precision. Application-specific accelerations are designed in to boost radar, lidar and/or communication processing performance. The Tensilica Instruction Extension (TIE) language further boosts performance for the designer’s specific algorithm and applications. With a common instruction-set architecture (ISA) and consistent programming model, Tensilica DSPs help protect a customer’s software investment by providing a high degree of software portability and reusability.

“Ensuring coverage for random hardware faults and systematic faults is mandatory for development of ISO 26262-compliant SoCs,” said Larry Przywara, senior group director, Tensilica marketing at Cadence. “Processing requirements for ADAS and autonomous vehicles continue to escalate to support more sophisticated radar, lidar and V2X functions. The industry-first ASIL B(D) certification of the Tensilica ConnX B10 and B20 DSPs designed for these functions enables designers to develop performance-leading ISO 26262-compliant automotive SoCs. In addition, the Tensilica Vision Q7 DSP for vision and AI applications has also received ASIL B (D) compliance certification.”

Tensilica ConnX DSPs support Cadence’s Intelligent System Design™ strategy, enabling SoC design excellence.

About Cadence
Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For six years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at

Leave a Reply

featured blogs
Nov 24, 2020
The ICADVM20.1 and IC6.1.8 ISR15 production releases are now available for download at Cadence Downloads . For information on supported platforms and other release compatibility information, see the... [[ Click on the title to access the full blog on the Cadence Community si...
Nov 23, 2020
It'€™s been a long time since I performed Karnaugh map minimizations by hand. As a result, on my first pass, I missed a couple of obvious optimizations....
Nov 23, 2020
Readers of the Samtec blog know we are always talking about next-gen speed. Current channels rates are running at 56 Gbps PAM4. However, system designers are starting to look at 112 Gbps PAM4 data rates. Intuition would say that bleeding edge data rates like 112 Gbps PAM4 onl...
Nov 20, 2020
[From the last episode: We looked at neuromorphic machine learning, which is intended to act more like the brain does.] Our last topic to cover on learning (ML) is about training. We talked about supervised learning, which means we'€™re training a model based on a bunch of ...

featured video

Available DesignWare MIPI D-PHY IP for 22-nm Process

Sponsored by Synopsys

This video describes the advantages of Synopsys' MIPI D-PHY IP for 22-nm process, available in RX, TX, bidirectional mode, 2 and 4 lanes, operating at 10 Gbps. The IP is ideal for IoT, automotive, and AI Edge applications.

Click here for more information about DesignWare MIPI IP Solutions

featured paper

Streamlining functional safety certification in automotive and industrial

Sponsored by Texas Instruments

Functional safety design takes rigor, documentation and time to get it right. Whether you’re designing for the factory floor or cars on the highway, this white paper explains how TI is making it easier for you to find and use its integrated circuits (ICs) in your functional safety designs.

Click here to download the whitepaper

Featured Chalk Talk

Thermal Bridge Technology

Sponsored by Mouser Electronics and TE Connectivity

Recent innovations can make your airflow cooling more efficient and effective. New thermal bridges can outperform conventional thermal pads in a number of ways. In this episode of Chalk Talk, Amelia Dalton chats with Zach Galbraith of TE Connectivity about the application of thermal bridges in cooling electronic designs.

More information about TE Thermal Bridge Technology