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CEA-Leti Announces 16 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

GRENOBLE, France – March 3, 2021 – CEA-Leti, a technology research institute of CEA Tech, will present 16 papers during Photonics West 2021, March 6-11, including an invited paper, “Advanced roughness characterization for 300mm Si photonics patterning & optimization”.

In addition, the institute will host a virtual workshop, “Emerging Photonic and Integration Technologies for Healthcare” on March 25.

The one-hour event will explore coming innovations in photonics, and will include virtual stands where participants can discuss their innovations. Group-and-private chat networking will be available through text, video and audio chat.

Photonic … Read More → "CEA-Leti Announces 16 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25"

Synopsys Announces Euclide to Accelerate Design and Verification Productivity

MOUNTAIN VIEW, Calif., March 3, 2021 /PRNewswire/ —

Highlights:

VadaTech Announces an Altera Arria-10™ GX1150 based AMC with Dual Embedded SFP/SFP+ GbE/10GbE

Henderson, NV – March 1, 2021 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC539. The AMC539 is based on the Altera Arria-10™ GX1150 FPGA in F1517 package and is compliant to AMC.1, AMC.2, AMC.3 and/or AMC.4 specifications. Additionally, the module has … Read More → "VadaTech Announces an Altera Arria-10™ GX1150 based AMC with Dual Embedded SFP/SFP+ GbE/10GbE"

Lattice Expands mVision Solutions Stack Capabilities

  • Stack Offers New Image Sensor Modules and Image Signal Processing (ISP) Solutions 
  • Supports Lattice Propel Design Environment and RISC-V CPU Co-processing

HILLSBORO, OR – March 1, 2021 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, launched the latest version of its award-winning solutions stack for low power embedded vision systems, Lattice mVision™ 2.0. The new version features multiple updates … Read More → "Lattice Expands mVision Solutions Stack Capabilities"

Micro Rotary DIP Switches Ideal for Space-Constrained Designs

LAKE OSWEGO, Ore. — March 2, 2021 — CUI Devices’ Switches Group today announced the addition of micro rotary actuator types to its DIP switches product line. Housed in compact 7.2 x 7.2 x 2.9 mm packages, the RDS-7229 series features 4, 10, or 16 positions, a 5.08 mm pitch, and surface mount or through hole mounting styles. Thanks to their compact footprints and IP67 ratings, these rotary DIP switches are ideal for a range of space-constrained industrial, commercial, or telecommunication applications where moisture and environmental contaminants are major concerns.

To meet a variety of design requirements, the rotary DIP switch models offer multiple termination types, including gull … Read More → "Micro Rotary DIP Switches Ideal for Space-Constrained Designs"

ADLINK adopts Upverter to offer customers full automation of SMARC carrier board design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter — a web-based drag-and-drop designer tool. The Upverter tool requires minimal engineering skills, allowing customers to create their own SMARC based carrier board design within hours, and receive prototypes within weeks. Upverter generates the electrical design files of fully custom-defined carrier board designs on demand, as well as an instant Bill of Materials (BOM) complete with pricing, a customized device tree, documentation, and mechanical … Read More → "ADLINK adopts Upverter to offer customers full automation of SMARC carrier board design"

IAR Systems and Secure Thingz launch shrink-wrapped solution for organizations targeting EN 303645 compliance for secure IoT applications

Cambridge, United Kingdom / Uppsala, Sweden—March 2, 2021—Secure Thingz, an IAR Systems® Group company, today announced Compliance Suite, a set of tools and training specifically targeted to provide embedded developers with a simplified path to building applications that are compliant with the European EN 303645, UK & Australian 13 Best Practices, and the evolving US Cybersecurity Improvement Act (NISTIR 8259). 

Compliance is a challenge for every organization working in the fast-moving Internet of Things domain; given that most applications are unique, and that formal certification methodologies are both costly and time consuming. To this … Read More → "IAR Systems and Secure Thingz launch shrink-wrapped solution for organizations targeting EN 303645 compliance for secure IoT applications"

Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter

CHANDLER, Ariz., March 02, 2021 (GLOBE NEWSWIRE) — There are many consumer, enterprise and industrial devices today that have a USB Type-C port as the only input power option. While USB-C® technology can offer high power and high data rate, it limits the range of the installation to a maximum of three meters from an AC outlet. As Power over Ethernet (PoE) becomes more prevalent and a more convenient solution to provide power over a standard Ethernet cable, it is the most practical solution to provide both power and data up to 100 meters. While most adapters on the … Read More → "Microchip Releases the First IEEE 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter"

Class-D Amplifier for High-Definition Automotive Audio from STMicroelectronics Adds Diagnostics for Safety Alerting

Geneva, March 2, 2021 – The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.

The HFDA801A is a 2MHz switching pulse-width modulation (PWM) Class-D amplifier with a quad-bridge configuration. An integrated high-performance digital-to-analog converter ( … Read More → "Class-D Amplifier for High-Definition Automotive Audio from STMicroelectronics Adds Diagnostics for Safety Alerting"

Reflex Photonics awarded multimillion-dollar contract to deliver radiation-resistant optical transceivers for advanced, high-throughput communication satellites

Reflex Photonics, a Smiths Interconnect company, has been awarded a multimillion-dollar contract to deliver thousands of SpaceABLE®28 optical module devices to be used in state-of-the-art, high-throughput communication satellites (HTCS) that will be deployed in geostationary orbit.

Building on the recognized robustness inherent in the design of Reflex Photonics’ optical modules, the SpaceABLE28 line will provide radiation-resistant optical interconnect modules tested and qualified for use in harsh space environment.

Reflex Photonics has benefited from support from the European Space Agency ARTES Scylight program with financial contribution from the Canadian Space Agency to pursue the development of … Read More → "Reflex Photonics awarded multimillion-dollar contract to deliver radiation-resistant optical transceivers for advanced, high-throughput communication satellites"

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