industry news
Subscribe Now

Reflex Photonics awarded multimillion-dollar contract to deliver radiation-resistant optical transceivers for advanced, high-throughput communication satellites

SpaceABLE optical modules developed for ARTES Scylight program

Reflex Photonics, a Smiths Interconnect company, has been awarded a multimillion-dollar contract to deliver thousands of SpaceABLE®28 optical module devices to be used in state-of-the-art, high-throughput communication satellites (HTCS) that will be deployed in geostationary orbit.

Building on the recognized robustness inherent in the design of Reflex Photonics’ optical modules, the SpaceABLE28 line will provide radiation-resistant optical interconnect modules tested and qualified for use in harsh space environment.

Reflex Photonics has benefited from support from the European Space Agency ARTES Scylight program with financial contribution from the Canadian Space Agency to pursue the development of advanced, high-speed, digital intrasatellite optical fiber communication modules.
Tullio Panarello, Vice President and General Manager Fibre Optics and Components at Smiths Interconnect, commented:

The optimization of our radiation-resistant transceivers to address the rigorous demands of GEO HTCS would not have been possible without the reputable cross-functional teams at Reflex and the invaluable contribution of the Canadian and European space agencies.

Optical communication technology is becoming one of the major revolutions in HTCS. It will bring unprecedented transmission rates, data security, and resilience to the future HTCS and satellite constellations. The contract award to Reflex Photonics acknowledges our market-leading design expertise and our commitment to technical excellence.
The ARTES Scylight program was designed to address the development, demonstration, and utilization of innovative optical technologies for digital satellite communication and foster commercial support for new market opportunities.

Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

CBOT MULTIGIG Transceiver Platform
In this episode of Chalk Talk, Anders Thelin from TE Connectivity and Amelia Dalton explore how the CBOT MULTIGIG transceiver platform helps address these challenges with a modular, high-performance approach to rugged, high-density connectivity. We also investigate how this platform supports next-generation system architectures, improves design efficiency, and enables robust performance in even the most demanding environments.
May 18, 2026
920 views