industry news
Subscribe Now

Micro Rotary DIP Switches Ideal for Space-Constrained Designs

LAKE OSWEGO, Ore. — March 2, 2021 — CUI Devices’ Switches Group today announced the addition of micro rotary actuator types to its DIP switches product line. Housed in compact 7.2 x 7.2 x 2.9 mm packages, the RDS-7229 series features 4, 10, or 16 positions, a 5.08 mm pitch, and surface mount or through hole mounting styles. Thanks to their compact footprints and IP67 ratings, these rotary DIP switches are ideal for a range of space-constrained industrial, commercial, or telecommunication applications where moisture and environmental contaminants are major concerns.

To meet a variety of design requirements, the rotary DIP switch models offer multiple termination types, including gull wing, angled gull wing, and J-hook gull wing as well as PC pin and crimped PC pin. The models also feature raised or flat actuator levels with arrow, cross, or slotted actuator styles. Carrying operating temperature ranges from -40 to 85°C, the micro rotary DIP switches hold 50 Vdc switching/non-switching rated voltages and 100 mA switching/non-switching rated currents.

The RDS-7229 models are available immediately with prices starting at $1.69 per unit at 500 pieces through distribution. Please contact CUI Devices for OEM pricing.

Summary
Product name: RDS-7229 Series
Availability: Stock to 7 weeks
Possible users: Space-constrained industrial, commercial, or telecom applications
Primary features: Compact packages, multiple termination types, IP67 rated
Cost: $1.69 per unit at 500 pieces through distribution

View details for the RDS-7229 series:
https://www.google.com/url?q=https://www.cuidevices.com/sitesearch/searchbypartialmatch?partnumber%3Drds-7229%26refinement%3D1_products&sa=D&source=editors&ust=1614340340233000&usg=AOvVaw3c0B2sCDAS5idUVHd74g7q

About CUI Devices
CUI Devices is a technology company focused on the development, manufacturing, and distribution of electronic components for a broad base of market segments. In operation as CUI Inc since 1989, CUI Devices has built customer and partner relationships and value by focusing on making the design engineer’s job easier and more successful through best-in-class online experiences, technical support, and customer service. In September 2019, CUI Devices announced a partial buy-out of CUI Inc’s operations, purchasing the Interconnect, Audio, Thermal Management, Motion, Sensor, and Switches lines. As a stand-alone entity, CUI Devices will continue to invest in the future through new technologies, talented employees, expanded manufacturing capabilities, and a growing global reach. To learn more, visit www.cuidevices.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
9,282 views