News – Page 637 – EEJournal

New release of Imagimob tinyML platform enables developers to build AI models in minutes

October 27, 2021

Imagimob today announced that the new release of its tinyML platform is now available to its customers. The new release focuses on making it easier and faster for developers to build and deploy performance-ready tinyML applications on edge devices.

New features include:

Starter Projects
Starter projects save time for developers. They increase the quality of the AI application and reduces time needed to get up and running. A developer can select a starter project from a list of pre-defined projects, and build deep learning AI models in minutes. The starter project includes … Read More → "New release of Imagimob tinyML platform enables developers to build AI models in minutes"

CUI Devices Introduces Industry’s Smallest Micro Buzzer

October 27, 2021

LAKE OSWEGO, Ore. — October 27, 2021 — CUI Devices’ Audio Group today announced the introduction of a 3.2 mm x 3.2 mm magnetic transducer buzzer, making it among the smallest micro buzzers in the industry. As the latest addition to CUI Devices’ micro buzzers line, the CMT-322-65-SMT-TR< … Read More → "CUI Devices Introduces Industry’s Smallest Micro Buzzer"

Semtech Announces Intelligent Sensor Platform, PerSe™, Improving Mobile Connectivity and Compliance for Personal Connected Consumer Devices

PerSe™ portfolio features three new product lines – PerSe Connect, PerSe Connect Pro and PerSe Control

October 27, 2021

CAMARILLO, Calif., Oct. 27, 2021 – Semtech Corporation (Nasdaq: SMTC), a leading global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its PerSe™ line of sensors targeted for the personal … Read More → "Semtech Announces Intelligent Sensor Platform, PerSe™, Improving Mobile Connectivity and Compliance for Personal Connected Consumer Devices"

congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

October 27, 2021

San Diego, CA, 27 October, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – introduces new platforms and design strategies for 5G connected mobile and stationary devices. As important innovation accelerators, 5G edge technologies are in high demand, especially among OEMs in the mobility, transportation, logistics and smart city markets, but also among industrial mobile machinery and robotics vendors. They all need new embedded platforms – most often with real-time capabilities. And they want to be able to control these new platforms over the air with zero downtime to enable a totally new generation of smart mobile and stationary devices. … Read More → "congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices"

Renesas’ Innovative Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus

Renesas R-Car SoCs Contribute to Enhanced User Experience

October 26, 2021

TOKYO, Japan, October 26, 2021 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its R-Car H3 and R-Car M3 system-on-chips (SoCs) have been adopted by Toyota Motor Corporation (“Toyota”) for their next-generation multimedia systems. The Renesas R-Car H3 and R-Car M3 SoCs are designed for in-vehicle infotainment (IVI) applications that deliver images, audio, and a variety of information from both in-vehicle and external sources to the driver in a safe and convenient manner. Toyota’s next-generation multimedia system will make its first appearance in the Lexus NX, scheduled for release in November 2021 and … Read More → "Renesas’ Innovative Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus"

Movandi Announces 5G mmWave Large 300+ Antenna Array Using TSMC Bulk CMOS Technology for Infrastructure Applications

Movandi Demonstrates High-performance Phased Array Antenna Module (PAAM) Using TSMC CMOS Technology

October 26, 2021

IRVINE, Calif., October 26, 2021 – Mobile World Congress LA 2021 – Movandi, a leader in 5G mmWave RF technologies and products, today announces that its 300+ antenna PAAM design using TSMC CMOS technology delivers breakthrough performance with the scale and … Read More → "Movandi Announces 5G mmWave Large 300+ Antenna Array Using TSMC Bulk CMOS Technology for Infrastructure Applications"

TDK develops industry’s highest rated current inductors for automotive Power over Coax systems

October 26, 2021

October 26, 2021 — TDK Corporation (TSE:6762) announces the release of its newly developed ADL3225VM inductors for use in automotive Power over Coax (PoC) systems. Measuring at 3.2 x 2.5 x 2.5 mm (L xW x H), these inductors provide a compact solution for designers looking to reduce vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications. The proprietary structural design and wire winding manufacturing process ensure high impedance over a broad bandpass of 1 MHz up to 1 GHz. The inductors are compliant with AEC-Q200 and achieve the highest-rated current in the industry for the 3225 … Read More → "TDK develops industry’s highest rated current inductors for automotive Power over Coax systems"

Wind River Supports Intel Industrial SoCs Designed for Real-Time and AI-Driven Intelligent Systems

October 26, 2021

ALAMEDA, CA — Oct. 26, 2021 — Wind River®, a global leader in delivering software for intelligent systems, today announced support for Intel Atom x6000 Series and Intel Pentium and Celeron N and … Read More →

videantis processing platform reduces cost, increases flexibility of fail-operational systems

October 26, 2021

With fine-grain scalability and flexible redundancy, the videantis unified processing platform enables fail-operational processing and functional safety up to ASIL D for highly automated driving at reduced cost
Both fail-operational sensor-based signal processing as well as central AI inference are supported by the videantis v MP6000UDX unified platform
The technology has been validated as part of the € 50 million PRYSTINE research project

Hannover, Germany, October 25, 2021 – Today, videantis, a leading supplier of deep learning, computer vision, image processing and video coding solutions, announced availability of its technological platform for fail-operational processing at … Read More → "videantis processing platform reduces cost, increases flexibility of fail-operational systems"

Infineon enables highly integrated USB Type-C charger unification

October 25, 2021

Munich, Germany – 25 October, 2021 – Using energy responsibly is the essential factor for innovations in the field of energy efficiency towards a greener planet. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the market leader for power semiconductors, is continuously investing and innovating in futureproof semiconductor technologies and solutions, enabling environmentally friendly applications as well as performance and ease of design.

The EZ-PD™ BCR (Barrel Connector Replacement) is a highly integrated USB-C controller, together with the USB-C connector, it replaces barrel connectors, custom connectors or legacy USB connectors in electronic devices. The EZ-PD … Read More → "Infineon enables highly integrated USB Type-C charger unification"