industry news
Subscribe Now

congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

San Diego, CA, 27 October, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – introduces new platforms and design strategies for 5G connected mobile and stationary devices. As important innovation accelerators, 5G edge technologies are in high demand, especially among OEMs in the mobility, transportation, logistics and smart city markets, but also among industrial mobile machinery and robotics vendors. They all need new embedded platforms – most often with real-time capabilities. And they want to be able to control these new platforms over the air with zero downtime to enable a totally new generation of smart mobile and stationary devices. congatec addresses these needs with an array of recently launched Computer-on-Modules. Specifically designed for industrial-grade edge appliances, they enable out-of-band management over IP connectivity even when the devices are down.

“Most important for OEM equipment and embedded system design houses are currently the Intel Core processors based congatec modules that support the extended temperature ranges, which makes them a perfect fit for all outdoor equipment – whether mobile, portable or stationary. The latest congatec modules with soldered RAM also deliver great advantages as they are qualified for applications exposed to extreme shock and vibrations. All modules provide opportunity to deploy TSN capable real-time connected OTA services and Device2x communication. In addition, we also offer virtual machine implementations for enabling different tasks and domains on a single device,” explains congatec’s Director Product Marketing Martin Danzer and adds: “Target platforms, upon which our customers can realize their 5G strategies, range from high-end edge server to low power client platforms.”

COM-HPC: The new standard for innovators

Two new module families based on the brand new COM-HPC specification currently provide the greatest innovation potential for customers: The conga-HPC/cTLU and conga-HPC/cTLH COM-HPC Client modules based on the 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors are designed for the most demanding IoT gateway and edge computing applications requiring highest bandwidth with up to 20 PCIe Gen 4 lanes. A congatec starter set is available for both module families to enable instant application development. The starter set includes the conga-HPC/EVAL-Client carrier board, which is based on the ATX form factor. This is highly efficient as engineers can utilize standard PC components for their embedded system designs. For more information on congatec’s COM-HPC portfolio, please visit https://www.congatec.com/en/technologies/com-hpc/

COM Express: Now better than ever before

Another highlight for 5G platform designs is congatec’s extensive COM Express portfolio, which offers the latest processor performance enhancements across the entire feature set. The brand new COM Express Type 6 conga-TS570 modules based on the new Tiger Lake H processors set a new benchmark for massive connected real-time IIoT gateway, edge computing and micro server workloads. For demanding transportation and mobility applications requiring high computing performance in an ultra rugged shape, the new 11th Gen Intel Core based modules are an ideal fit as they support extreme temperature ranges of -40°C to +85°C. For 24/7 connected fanless embedded systems, the conga-TCV2 COM Express Compact Computer-on-Modules based on AMD Ryzen Embedded V2000 processors are another attractive option. Please visit https://www.congatec.com/en/technologies/com-express/ to see the entire broad range of COM Express platforms for 5G connected appliances.

Small form factors: More power for the little things

congatec’s latest modules for the low power performance level are perfectly tailored for 5G connected and solar powered distributed process controls in smart energy grids, remote train and wayside systems, connected autonomous vehicles, and mobile outdoor equipment with limited battery capacity. Flagships with time sensitive networking (TSN) support include Intel Atom x6000E Series, Intel Celeron and Pentium N & J Series processors (code name “Elkhart Lake”) on SMARC, Qseven, COM Express Compact and COM Express Mini Computer-on-Module standards, as well as Pico-ITX Single Board Computers (SBCs).

Real-life system demo

Design setup with TSN support for 5G connected real-time appliances has been realized with congatec’s demo system for workload consolidation: Designed in cooperation with Intel and Real-Time Systems, and qualified by Intel as a ready for production unit, this platform integrates three preconfigured virtual machines to demonstrate how various tasks can be executed on a single platform with full determinism – even if one virtual machine is booting. The 5G enabled platform targets collaborative systems, and is preconfigured to include vision and AI for improved situational awareness.

Edge data center power

For OEMs requiring 5G connected edge server level computing power, congatec’s COM Express Type 7 Server-on-Modules based on the AMD EPYC 3000 Embedded processors support up to 16 cores. Multiple cores open even more options for workload consolidation by utilizing virtual machines on the basis of hypervisor technology from Real-Time Systems. As the EPYC 3000 Embedded processors consume up to 100 watt TDP, congatec has also designed appropriate cooling solutions, making system integration of these high-end embedded platforms an easy task.

The ARM Cortex flagships

SMARC and Qseven platforms on the basis of NXP i.MX 8 processor technologies round off the 5G platform offerings. Here, congatec sets the focus on the latest NXP i.MX 8M Plus processor. With machine and deep learning capabilities, the new ultra-low power SMARC and Qseven modules enable applications to see and analyze their surroundings for situational awareness, visual inspection, identification, surveillance and tracking, as well as gesture-based contactless machine operation and augmented reality. The technology is predestined for e-charging infrastructures requiring load balancing logic for various distributed charging columns and 5G connectivity for payment, services and management. TSN support is a given for all of these platforms.

Further information on congatec’s ecosystem for i.MX 8 based designs can be found at: https://www.congatec.com/imx8

About congatec

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, transportation, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. Founded in 2004 and headquartered in Deggendorf, Germany, the company reached sales of 127.5 million US dollars in 2020. More information is available on our website at www.congatec.com or via LinkedIn, Twitter and YouTube.

Leave a Reply

featured blogs
Dec 8, 2021
It's almost time for the event that Design and Verification engineers have been waiting for - DVCon India. Now in the 6th year, the Design and Verification Conference, or DVCon, is one of the... [[ Click on the title to access the full blog on the Cadence Community site...
Dec 7, 2021
We explain the fundamentals of photonics, challenges in photonics research & design, and photonics applications including communications & photonic computing. The post Harnessing the Power of Light: Photonics in IC Design appeared first on From Silicon To Software....
Dec 6, 2021
The scary thing is that this reminds me of the scurrilous ways in which I've been treated by members of the programming and IT communities over the years....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Imagination Uses Cadence Digital Full Flow for GPU Development

Sponsored by Cadence Design Systems

Learn how Imagination Technologies uses the latest Cadence digital design and simulation solutions to deliver leading-edge GPU technology for automotive, mobile, and data center products.

Click here to learn more about Cadence’s digital design and signoff solutions

featured paper

IPU-Based Cloud Infrastructure: The Fulcrum for Digital Business

Sponsored by Intel

As Cloud Service Providers consider their investment strategies and technology plans for the future, learn how IPUs can offer a path to accelerate and financially optimize cloud services.

Click to read more

featured chalk talk

KISSLING Products: Rugged and Reliable Solutions

Sponsored by Mouser Electronics and TE Connectivity

Rugged and reliable designs today have a specific set of design requirements that may not be found in other industries including robustness, durability, and the ability to resist harsh environments. In this episode of Chalk Talk, Amelia Dalton chats with Mark Dickson from TE Connectivity about the KISSLING product family which includes a wide variety of rugged and reliable solutions for your next design.

Click here for more information about TE Connectivity / KISSLING Ruggedized Switching Products