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UNO-148 Scalable Tiger Lake DIN-Rail Control PC available from Impulse Embedded

October 28, 2021
  • Low-power, high-performance 11th Gen Tiger Lake Intel Core processors
  • 2kV isolated I/O and wide input voltage ideal for industrial control applications
  • 2.5GigE LAN supports Intel Time-Sensitive Networking (TSN) for real-time, low latency communications
  • DIN-rail mountable, fanless, and compact

Impulse Embedded, a leading provider of industrial computing … Read More → "UNO-148 Scalable Tiger Lake DIN-Rail Control PC available from Impulse Embedded"

Credo Announces First Offering of 800G HiWire Active Electrical Cables for Next Generation Decentralized Data Centers and AI Servers

800G HiWire AECs decrease cabling volume by up to 75% less over traditional direct-attached copper cables while improving reliability and consuming 50% less power than optical cabling
October 28, 2021

San Jose, Calif., October 28, 2021 – Read More → "Credo Announces First Offering of 800G HiWire Active Electrical Cables for Next Generation Decentralized Data Centers and AI Servers"

e-con Systems launches rugged and powerful Ready-to-Deploy IP66 Smart AI camera

SONY STARVIS IMX290 Sensor | NVIDIA TX2 | AI Smart Camera
October 28, 2021

San Jose and Chennai – e-con Systems Inc., a leading embedded camera solutions provider launches an IP66 rated and Ready-to-Deploy smart camera, SmarteCAM with AI processing capabilities. SmarteCAM comes with a camera based on the SONY STARVIS IMX290 image sensor with an Image Signal Processor (ISP) that supports High Dynamic Range (HDR) and an NVIDIA® TX2 module as the host.

Read More → "e-con Systems launches rugged and powerful Ready-to-Deploy IP66 Smart AI camera"

InnovationLab announces a powerful software package for its printed sensors

SensorMatrixLAB simplifies design, configuration and use
October 28, 2021

Heidelberg, Germany – October 28, 2021 – InnovationLab, the expert in printed electronics “from lab to fab”, today announced the availability of a downloadable software package, SensorMatrixLAB, that significantly simplifies the use of its printable sensors.

Free of charge for existing customers, SensorMatrixLAB simplifies the process of getting started with InnovationLab’s printed sensors and enables the visualization and processing of sensor generated data. By … Read More → "InnovationLab announces a powerful software package for its printed sensors"

New version of Melexis Pump/Fan Driver ICs pushes lifetime boundaries to next level

Dedicated automotive pump driver meets requirements for high ambient temperatures and long operating lifetime.
October 28, 2021

Tessenderlo, Belgium, 28 October 2021 – In order to address more challenging customer deployments, Melexis has expanded its MLX90412 product offering. The latest version of this 2.2A automotive-qualified pump/fan driver IC is optimized to deal with high ambient temperature levels and supports prolonged operational lifespans.

Melexis, a global microelectronics engineering company, introduces the MLX90412GLW single-coil pump/fan IC with integrated driver stage. It is intended for applications with high ambient temperature such as automotive water pumps. The MLX90412GLW drives pumps up to 15W in Internal Combustion Engines (ICE). This typically implies a maximum ambient operating temperature up … Read More → "New version of Melexis Pump/Fan Driver ICs pushes lifetime boundaries to next level"

Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices

New Tensilica HiFi 1 DSP delivers increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy
October 28, 2021

SAN JOSE, Calif., October 28, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence® Tensilica® HiFi 1 DSP, which improves the user experience by delivering breakthrough audio/voice innovation for small battery devices such as TWS earbuds, hearing aids, Bluetooth headsets, smart watches and other wearables. The HiFi 1 DSP’s ultra-low energy consumption extends the duration of voice communication and music playback, allowing always listening to voice commands with minimal impact to battery life. This enables small form factor, low-cost consumer and mobile devices, as well as automotive and industrial devices, to offer increased functionality with low energy consumption.

< … Read More → "Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices"

Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process

DesignWare Interface and Foundation IP Deliver Optimized Power and Performance for High-Performance Computing and Mobile SoCs
October 27, 2021

MOUNTAIN VIEW, Calif., Oct. 27, 2021 /PRNewswire/ —

Highlights from this announcement:

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

October 27, 2021

Highlights:

● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems

● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout

● The Voltus IC Power Integrity Solution, tightly coupled with the Celsius Thermal Solver, facilitates multi-die IR drop and thermal analysis for design robustness

● Customers can confidently adopt the Cadence 3D-IC solution and TSMC 3DFabric technologies to create next-generation hyperscale computing, mobile and automotive applications

SAN JOSE, Calif., … Read More → "Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs"

Infineon introduces high precision coreless current sensor XENSIV™ TLE4972 for automotive applications

October 27, 2021

Munich, Germany – 27 October, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its first automotive current sensor: the new XENSIV™ TLE4972. The coreless current sensor uses Infineon’s well-proven Hall technology for precise and stable current measurements. With its compact design and diagnosis modes, the TLE4972 is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches.

As a result of proprietary temperature and stress compensation, TLE4972 offers state-of-the-art sensing without the negative effects caused by magnetic cores. Due to its differential sensing structure, neither core nor shield … Read More → "Infineon introduces high precision coreless current sensor XENSIV™ TLE4972 for automotive applications"

Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process

Design kits now available for early adopters
October 27, 2021

SAN JOSE, Calif., October 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the immediate availability of Cadence® IP supporting the PCI Express® (PCIe®) 6.0 specification on the TSMC N5 process. The Cadence IP for PCIe 6.0 consists of a high-performance DSP-based PHY and a feature-rich companion controller to deliver the optimized performance and throughput for next-generation applications in hyperscale computing and 5G communications, including networking, emerging memory and storage. Early adopters of Cadence IP for PCIe 6.0 can access design kits now.

The 5nm PCIe 6.0 PHY test chip silicon from Cadence demonstrated excellent electrical performance across all PCIe rates. The … Read More → "Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process"

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