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NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications

September 12, 2024

September 10, 2024 at 3:00 AM EDT

  • Trimension SR250 is the industry’s first single-chip solution combining on-chip processing with short-range ultra-wideband (UWB) radar and secure UWB ranging, enabling new user experiences in autonomous homes and for Industrial IoT
  • Integrated radar processing capabilities enable reduced power consumption for improved efficiency
  • NXP’s radar capabilities are supported with firmware, middleware, and sample applications to save effort and simplify deployment for faster design-in

EINDHOVEN, the Netherlands, Sept. 10, 2024 — NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the Trimension®</ … Read More → "NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications"

Sondrel announces Advanced Modelling Process for AI chip designs

September 12, 2024

Reading UK – 10 September 2024. Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs. This runs through every stage of a chip’s design to ‘prove’ that the design is what was specified – Functional Verification — and that it does what it is supposed do – Performance Verification.

Paul Martin, Sondrel’s Global Field Engineering Director, explained, “AI chips are extremely complex to design because of the huge amounts of data that have to flow round them … Read More → "Sondrel announces Advanced Modelling Process for AI chip designs"

TASKING enhances tools support for NXP automotive microcontrollers and processors

TASKING's VX-toolset for Arm v7.1r1 supported by NXP`s Real-Time Drivers (RTD) for S32K388 and extends support for S32N55 to the iC7 family of debuggers
September 12, 2024
Munich, Germany, 10 September 2024 – TASKING, recently promoted to NXP Gold Partner status, has enhanced its tools support to optimize and accelerate software development for NXP® Semiconductors’ automotive microcontrollers and processors. TASKING introduces version v7.1r1 of the compiler toolchain VX-toolset for Arm for embedded software development. The new version of the compiler toolchain is now fully supported and qualified to be used with NXP’s new and innovative Real-Time Drivers (RTD) for S32K388 zonal aggregator microcontroller. Additionally, the TASKING family of iC7 hardware debuggers now supports virtual and hardware … Read More → "TASKING enhances tools support for NXP automotive microcontrollers and processors"

Melexis introduces digital output Triphibian™ pressure sensor

September 11, 2024

Tessenderlo, Belgium, 10 September 2024 – Melexis expands its Triphibian™ family with the MLX90834 pressure sensor, designed for automotive applications such as EV thermal management. This robust, factory-calibrated MEMS solution accurately measures pressure in both gas and liquid media from 2 to 70 bar. Its digital SENT output delivers absolute pressure information, diagnostic and temperature data, enabling enhanced system performance and reliability.

At the heart of the MLX90834 is Melexis’ ground-breaking Triphibian™ technology. This innovative MEMS sensor design allows for accurate pressure measurements in both gas and liquid media, even at pressures up to 70 bar. This versatility is achieved through a unique … Read More → "Melexis introduces digital output Triphibian™ pressure sensor"

New programmable resistor modules from Pickering Interfaces address both functional test & verification and HIL applications

PXI/PXIe simulation modules available in multiple resistance ranges & resolution capabilities to meet the needs of most functional test systems
September 11, 2024

September 2024, Clacton-on-Sea, UK: Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced a new family of Read More → "New programmable resistor modules from Pickering Interfaces address both functional test & verification and HIL applications"

Rethink Robotics Launches Detachable Mobile Manipulator Robot at IMTS 2024

The Rethink Riser mobile manipulator robot (MMR) allows a single AMR to serve multiple stationary cobot applications.
September 11, 2024

Boston, MA — September 9, 2024 — Announcing a major relaunch and rebranding, Rethink Robotics returns to IMTS, unveiling a full portfolio of new robotics products, including seven Rethink Reacher cobots, its Rethink Ryder AMR line, and the Rethink Riser MMR. Combining … Read More → "Rethink Robotics Launches Detachable Mobile Manipulator Robot at IMTS 2024"

Synopsys Advances Imaging System Development with Industry’s First Complete Virtual Prototyping Platform

ImSym - Imaging System Simulator Offers Accuracy, Accelerated Time-to-Market, and Enhanced Team Collaboration
September 11, 2024
  • Industry’s only system-level imaging virtual prototyping platform
  • Integrates the trusted accuracy of Synopsys’ CODE V and LightTools
  • Significantly reduces the time required for imaging system conceptualization
  • Features a unified simulation environment and Python interfaces for streamlined teamwork and custom workflows

SUNNYVALE, Calif., Sept. 10, 2024 /PRNewswire/ — Read More → "Synopsys Advances Imaging System Development with Industry’s First Complete Virtual Prototyping Platform"

TDK expands inline structure and low-resistance type MEGACAP MLCCs with metal frames for automotive

September 11, 2024
  • The automotive-grade inline structure MEGACAP MLCCs are qualified based on the automotive standard AEC-Q200
  • Low resistance achieved by optimizing metal frame materials
  • Lineup includes 99 nF/1000 V with Class 1 and 47 μF/100 V with Class 2 dielectric

 

September 10, 2024

 

TDK Corporation (TSE:6762) has extended the automotive-grade CA series of its MEGACAP MLCCs with a metal frame. Mass production of the product series began in September 2024.

 

In recent years, the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles ( … Read More → "TDK expands inline structure and low-resistance type MEGACAP MLCCs with metal frames for automotive"

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