News – Page 4 – EEJournal

65W GaN converter delivers space-saving power for cost-conscious applications

March 14, 2025

ST’s VIPerGaN65D flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers up to 65W with universal input voltage.

The quasi-resonant offline converter integrates a 700V gallium nitride (GaN) transistor and optimized gate driver with typical protection features, making wide-bandgap technology easily accessible to elevate power density and efficiency. The GaN transistor operates at up to 240kHz, with minimal switching losses, permitting a … Read More → "65W GaN converter delivers space-saving power for cost-conscious applications"

Navitas Drives a Paradigm Shift in Power with Single-Stage Bi-Directional Switch (BDS) Converters

Bi-Directional GaNFast™ plus new IsoFast™ drivers enable advanced ‘single-stage’ topologies to further enhance efficiency, power density, and performance in AC-DC and AC-AC conversion.

March 14, 2025

TORRANCE, CA – March 13^th, 2025—Navitas Semiconductor (Nasdaq: NVTS), the only … Read More →

Rohde & Schwarz launches R&S NRP140TWG(N) thermal power sensor: A new benchmark for F band applications

March 14, 2025

Rohde & Schwarz presents the new R&S NRP140TWG(N) thermal power sensor, designed to meet the growing demands of applications in the F band utilizing a WR 8 waveguide connector. The NRP140TWG(N) is fully traceable to the National Metrology Institute (NMI) in Germany (PTB) and is temperature compensated, ensuring accurate and reliable measurements. With its plug-and-play capability, users can easily connect via USBTMC or LAN digital connectivity, making it an ideal solution for a wide range of applications.

The new R&S NRP140TWG(N) follows the excellent R&S NRP170 … Read More → "Rohde & Schwarz launches R&S NRP140TWG(N) thermal power sensor: A new benchmark for F band applications"

Aitech and Intuidex Join Forces to Deliver AI-Accelerated Computing Solutions for Extreme Sea, Land, Air, and Space Missions

Aitech and Intuidex Collaborate to Bring AI Processing with Pattern of Life Analysis to Demanding Environments for Faster, More Effective and Accurate Responses

March 14, 2025

CHATSWORTH, Calif. and BETHLEHEM, Pa. – March 11, 2025 – Aitech, a leading provider of rugged embedded systems for use in military, aerospace and space platforms, and Intuidex, Inc., a software, services and data model solution provider, today announced a partnership to deliver ruggedized … Read More → "Aitech and Intuidex Join Forces to Deliver AI-Accelerated Computing Solutions for Extreme Sea, Land, Air, and Space Missions"

Enclustra Introduces MLSoC Modalix System-on-Module to Accelerate Multi-Modal and Gen AI Applications at the Edge

March 14, 2025

Zurich, Switzerland – March 10, 2025 – Enclustra, the leading innovator in FPGA-based System-on-Modules (SoMs) and high-performance embedded solutions, today announced the launch of its latest SoM featuring SiMa.ai’s MLSoC Modalix 50 TOPs device. This cutting-edge solution expands Enclustra’s portfolio to address the growing demand for multi-modal and Gen AI applications at the embedded edge, providing organizations with a compact, high-efficiency platform to accelerate AI adoption.

Designed in collaboration with SiMa.ai, the MLSoC Modalix SoM offers seamless compatibility with leading GPU-based SoM solutions, enabling customers to integrate AI capabilities without major architectural overhauls. When combined with SiMa.ai’ … Read More → "Enclustra Introduces MLSoC Modalix System-on-Module to Accelerate Multi-Modal and Gen AI Applications at the Edge"

e-con Systems to Showcase Advanced High Accuracy 1MP ToF Camera and AI-Powered 360° Vision Solution at Embedded World 2025

March 13, 2025

California & Chennai (March 13, 2025): e-con Systems®, a global leader in embedded vision solutions, exhibits its latest advancements in camera technology across diverse industries at Embedded World 2025 in Nuremberg, Germany from March 11-13, 2025. Visitors will get an exclusive look at e-con’s latest innovations, including high-resolution 1MP Time-of-Flight (ToF) camera based on AF0130 depth sensor at the onsemi booth (hall 4A-260), and AI-powered 360° vision solutions … Read More → "e-con Systems to Showcase Advanced High Accuracy 1MP ToF Camera and AI-Powered 360° Vision Solution at Embedded World 2025"

Synopsys SNUG Silicon Valley 2025 to Feature Arm, OpenAI and Microsoft Executive Talks

Two-Day Conference will Examine Future of AI and Intelligent Systems; Join Keynotes from Synopsys CEO and OpenAI Head of Hardware Via Livestream

March 13, 2025

SUNNYVALE, Calif., March 12, 2025 /PRNewswire/ — Read More → "Synopsys SNUG Silicon Valley 2025 to Feature Arm, OpenAI and Microsoft Executive Talks"

Lighting the Way: How Activated Gold Reveals Drug Movement in the Body

March 13, 2025

Tracking targeted drug delivery is often a challenge due to limitations in the current imaging techniques. A recent study by Tokyo’s Waseda University reports a breakthrough imaging technique that allows direct and highly sensitive tracking of gold nanoparticles (AuNPs) inside the body. This novel technique, which uses neutron activation of gold, could revolutionize cancer drug delivery by enabling real-time visualization of the gold nanoparticles without external tracers.

Gold nanoparticles (AuNPs) are tiny gold particles of 1–100 nanometers and have unique chemical and biological properties. Due to their potential to accumulate in tumors, these … Read More →

Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands

March 13, 2025

SUNNYVALE, Calif., March 12, 2025 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced the release of two state-of-the-art surface mounting package options for its industry-leading high power MOSFET portfolio. Designed to meet the robust packaging requirements for the most demanding applications … Read More → "Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications"

Mouser Electronics Sponsors 2025 Global Create the Future Design Contest to Reward Engineering Innovation

March 13, 2025

March 12, 2025 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, today announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge to engineers and innovators around the world to design the next great thing for a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined again by valued … Read More → "Mouser Electronics Sponsors 2025 Global Create the Future Design Contest to Reward Engineering Innovation"