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Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation

SUNNYVALE, Calif., June 5, 2025 – Plug and Play, the world’s largest innovation platform based in Silicon Valley, has announced a new collaboration with Synopsys, a global silicon-to-systems design solutions company. By collaborating with Plug and Play Semiconductors, Synopsys will provide selected startups with access to its design tools and software licenses.

By providing startups with access to professional-grade EDA tools, which often represent a significant investment at the early stage, Plug and Play and Synopsys aim to help lower the barrier to chip innovation, accelerate time to market, and reduce development costs across the chip design space.

< … Read More → "Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation"

New flagship Arbitrary Waveform Generators with 3.9 GHz bandwidth and 10 GS/s output rate

Spectrum Instrumentation announces four new high-performance Arbitrary Waveform Generators (AWGs), marking a significant milestone in the company’s product portfolio. Designed for demanding applications in radio frequency (RF) and microwave signal generation, the new AWGs deliver output rates up to 10 GS/s with exceptional 16-bit vertical resolution and bandwidths reaching up to 3.9 GHz. The new products are aimed at engineers and scientists working in cutting-edge fields such as wireless communications, radar system development, quantum research, and aerospace testing.

“This launch represents a major leap forward for us,” said Oliver Rovini, CTO of Spectrum Instrumentation. “It’s the … Read More → "New flagship Arbitrary Waveform Generators with 3.9 GHz bandwidth and 10 GS/s output rate"

Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation

RIVERSIDE, Calif., June 5, 2025 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its BTN02G and Read More → "Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation"

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

Infineon collaborates with Typhoon HIL to accelerate development of xEV power electronic systems using real-time hardware-in-the-loop platform

Munich, Germany – 5 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers (MCUs) can now use a complete HIL simulation and test solution using Typhoon’s HIL simulator for ultra-high fidelity motor drive, on-board charger, … Read More → "Infineon collaborates with Typhoon HIL to accelerate development of xEV power electronic systems using real-time hardware-in-the-loop platform"

Q.ANT Debuts First Interactive Live Demonstration and New Benchmarks for Analog Photonic Computing at ISC 2025

Stuttgart, Germany – June 4, 2025 – Q.ANT, today announced it will showcase live demonstrations of its photonic Native Processing Server (NPS) at ISC 2025, a leading global conference for high-performance computing (HPC). For the first time, attendees will be able to interact directly with functional photonic computing, witnessing how light can drive breakthroughs in energy and computational efficiency for AI, Physics Simulations, and other complex scientific workloads.

Built on Q.ANT’s Light Empowered Native Arithmetic’s (LENA) architecture, the … Read More → "Q.ANT Debuts First Interactive Live Demonstration and New Benchmarks for Analog Photonic Computing at ISC 2025"

Sarcina Technology advances photonic package design to address key data center challenges

Palo Alto, CA – 4 June 2025. Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves. Sarcina’s pioneering work in photonic package design is enabling a new era of high data rate, high bandwidth and low power interconnects.

Traditional copper interconnects can no longer meet the performance, power and density demands of next generation data center systems. Copper interconnects become … Read More → "Sarcina Technology advances photonic package design to address key data center challenges"

Infineon OptiMOS™ 80 V and 100 V, and MOTIX™ enable high-performing motor control solutions for Reflex Drive’s UAVs

Munich, Germany – 4 June 2025 – Reflex Drive, a deep tech startup from India has selected power devices from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next-generation motor control solutions for unmanned aerial vehicles (UAVs). By integrating Infineon’s  OptiMOS™ 80 V and 100 V , Reflex Drive’s electric speed controllers (ESCs) achieve improved … Read More → "Infineon OptiMOS™ 80 V and 100 V, and MOTIX™ enable high-performing motor control solutions for Reflex Drive’s UAVs"

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Jun 12, 2025
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