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Innovative Apatite Nanoparticles for Advancing the Biocompatibility of Implanted Biodevices

Medical implants and biomedical devices often cause inflammatory responses due to poor biocompatibility. Apatite coatings offer a potential solution but limited cell adhesion is often a challenge. To address this, scientists developed advanced apatite nanoparticles for implant coatings with superior cell adhesion. By adjusting pH during synthesis of nanoparticles, they enhanced the surface properties of these nanoparticles, achieving improved water interactions and greater structural stability, paving the way for more effective and biocompatible medical implants.

Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency

Munich, Germany – 30 January 2025 – As the world continues to face the challenges of climate change and environmental sustainability, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is at the forefront of innovation, harnessing the power of all relevant semiconductor materials including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to drive meaningful progress towards decarbonization and digitalization.

In its 2025 predictions – GaN power semiconductors, Infineon highlights that gallium nitride will … Read More → "Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency"

FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions

Munich, Germany – 29 January 2025 – FORVIA HELLA, an international automotive supplier, has selected the new CoolSiC™ Automotive MOSFET 1200 V from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next generation 800 V DCDC charging solution. Designed for on-board charger and DCDC applications in 800 V automotive architectures, Infineon’s CoolSiC MOSFET comes in a Q-DPAK package. The device uses top-side cooling (TSC) technology, which enables excellent thermal performance, easier assembly and lower system costs.

“We are excited to continue our partnership with FORVIA HELLA, leveraging our high-efficiency SiC products based on TSC packages,” … Read More → "FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions"

Digital Twin Consortium Launches Digital Twin Testbed Initiative

BOSTON, MA – JANUARY 30, 2025  –  Today, the Digital Twin Consortium® (DTC) announced its transformative Digital Twin Testbed initiative, an opportunity for members to showcase innovation in digital twin evolution. The initiative is a collaborative, holistic approach DTC members can use to develop, test, verify, and validate digital twin systems and advance digital-twin-enabling technologies.

“The DTC Digital Twin Testbed initiative opens new horizons for our members, allowing them to demonstrate how they’re pushing the boundaries of digital twins and enabling technologies,” said Dan … Read More → "Digital Twin Consortium Launches Digital Twin Testbed Initiative"

Infineon’s 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P

Munich, Germany – 30 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory for space and extreme environment applications has now received the QML-V and QML-P qualification of the Defense Logistics Agency Land and Maritime (DLAM). The QML certification is the highest reliability standard for microcircuits awarded by the U.S. government and indicates that the device will perform reliably under the most challenging conditions. This makes the memory device the first and only QML-qualified radiation-hardened NOR flash memory for the space industry. The flash memory … Read More → "Infineon’s 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P"

Silicon Labs’ BG22L and BG24L “Lite” SoCs Bring Application-Optimized Ultra-Low Power Bluetooth® Connectivity

AUSTIN, TexasJan. 30, 2025 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, introduced the BG22L and Read More → "Silicon Labs’ BG22L and BG24L “Lite” SoCs Bring Application-Optimized Ultra-Low Power Bluetooth® Connectivity"

Saelig Introduces Sensepeek SQG Passive 6GHz Probe Series

Fairport, NY, USA: Saelig Company, Inc. has introduced the Sensepeek SQG-series of passive high-frequency hands-free oscilloscope probes, designed for both AC and DC GHz applications. When used with Sensepeek baseplates or handheld, this groundbreaking series enables engineers to perform measurements up to 6GHz economically and without the need to solder connections to the test PCB.

Maintaining measurement signal integrity is crucial, and the SQG-series has exceptionally low probe-tip capacitance, which minimizes loading and signal distortion for sensitive circuits. Measuring high data rate signals is now economical and precise with these passive probes that … Read More → "Saelig Introduces Sensepeek SQG Passive 6GHz Probe Series"

Shaping Future of Displays: Clay/Europium-Based Technology Offers Dual-Mode Versatility

Electrochemical reaction-based stimuli-responsive materials are shaping up the era of innovative display devices. By embedding luminescent europium(III) complexes and color-changing viologen derivatives in a layered clay matrix, the device achieves simultaneous control of light emission and color at low voltage. The use of clay-based materials also highlights an eco-friendly approach to enhancing electronic device performance. This innovation could revolutionize display technology and the development of sensors, adaptable to changing light conditions.

SLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics

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