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Ambiq compressionKIT Cuts Edge AI Memory and Power by Up to 20x

April 30, 2026

Ambiq Micro, Inc. (“Ambiq®“), a technology leader in ultra-low power semiconductor solutions for edge AI, today announced compressionKIT™, a next-generation AI-based codec in beta release, proven to substantially reduce the power and memory costs of handling continuous sensor data in wearable and edge devices.

As always-on devices—from medical wearables to smart home and industrial sensors—generate continuous data streams, storing and transmitting that data has become a significant drain on memory, battery life, and system costs. compressionKIT addresses this at the source by compressing data while preserving the key information needed for AI—allowing … Read More → "Ambiq compressionKIT Cuts Edge AI Memory and Power by Up to 20x"

Saelig Launches Economical Harogic SGA-60 6GHz Vector Signal Generator

The SGA-60 is a vector signal generator for frequencies from 9kHz to 6GHz. It offers a standard instantaneous bandwidth of 100MHz and 50MHz of real-time streaming bandwidth. It can output CW, AM/FM, digital modulated signals, frequency/amplitude sweep, and chirp signals – all at a remarkable price.
April 30, 2026

Saelig Company, Inc. has introduced the Harogic SGA-60 6GHz Vector Signal Generator. This next-generation USB-powered Vector Signal Generator (VSG) is engineered to bridge the gap between laboratory-grade precision and the portability required for modern field operations, R&D, and T&M. The SGA-60 series covers a frequency range from 9kHz to 6GHz, for applications in modern wireless communication, aerospace, and education sectors. It offers a robust 100MHz instantaneous bandwidth for complex wideband signal generation, complemented by 50MHz of real-time streaming bandwidth, ensuring high-fidelity signal playback and continuous data throughput for sophisticated simulation environments.

Read More → "Saelig Launches Economical Harogic SGA-60 6GHz Vector Signal Generator"

Syensqo enables next-generation high-voltage smartphone batteries

Innovative material enables safer, more powerful batteries for next-generation mobile devices
April 29, 2026

Syensqo announces the growing commercial adoption of its Energain® SA076 solution in advanced consumer electronics. The material supports next-generation lithium-ion batteries used in premium smartphones, helping them operate at higher voltages while maintaining safety and performance. Energain® SA076 is now used in lithium cobalt oxide (LCO) battery systems combined with silicon-carbon (Si-C) anodes operating … Read More → "Syensqo enables next-generation high-voltage smartphone batteries"

TANAKA to Showcase Advanced Semiconductor Materials and Circular Economy Initiatives at SEMICON Southeast Asia 2026

April 29, 2026

TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, will exhibit at SEMICON Southeast Asia 2026, a major international exhibition in one of the world’s fastest-growing semiconductor manufacturing hubs, to be held at the Malaysia International Trade & Exhibition Centre (MITEC) inKuala Lumpur, Malaysia, from May 5 to 7, 2026 (Booth No. 1521). At the exhibition, TANAKA will present a comprehensive range of precious metal materials and related technologies supporting the semiconductor industry across front-end, packaging, and testing processes. Exhibits will include bonding wires, silver ( … Read More → "TANAKA to Showcase Advanced Semiconductor Materials and Circular Economy Initiatives at SEMICON Southeast Asia 2026"

Northrop Grumman Relies on INTEGRITY-178 tuMP RTOS for the First Production Delivery of EGI-M Resilient Airborne Navigation System

Advanced Airborne Positioning, Navigation, and Timing (PNT) Solution Depends on Proven Multicore RTOS for Safety Certification to DO-178C
April 29, 2026

Green Hills Software today announced that its INTEGRITY®-178 tuMP™ real-time operating system (RTOS) is part of Northrop Grumman’s delivery of the first production unit of its … Read More → "Northrop Grumman Relies on INTEGRITY-178 tuMP RTOS for the First Production Delivery of EGI-M Resilient Airborne Navigation System"

Overland AI Demonstrates Autonomous Ground Capability for USMC ROGUE Fires

April 29, 2026

Overland AI, the leader in ground-based autonomous capabilities, has successfully integrated the Overland AI OverDrive system onto the Marine Corps’ Remotely Operated Ground Unit for Expeditionary (ROGUE) Fires platform for prototyping.

OverDrive, Overland AI’s autonomy stack that is purpose-built for rugged terrain, and SPARK, the autonomy kit including sensors and compute, are intended to enable the ROGUE Fires to operate autonomously in expeditionary comms-denied and GPS-denied environments.

By integrating OverDrive into the ROGUE Fires prototype, Overland AI is demonstrating the ability to autonomously maneuver disaggregated fires assets across littoral environments, increasing mission … Read More → "Overland AI Demonstrates Autonomous Ground Capability for USMC ROGUE Fires"

Teledyne FLIR Defense Grows Third-Party Payload Integration Program, Adds Emesent Hovermap LiDAR for Unmanned Air, Ground, and Detection Platforms

Newly certified payload works across drones, robots, and radiation detection systems to speed deployment of GPS-denied mapping and fused CBRN visualizations
April 29, 2026

 Unveiled at Modern Day Marine 2026, Teledyne FLIR Defense announced the expansion of its Third-Party Payload Integration Program with the certification of Read More → "Teledyne FLIR Defense Grows Third-Party Payload Integration Program, Adds Emesent Hovermap LiDAR for Unmanned Air, Ground, and Detection Platforms"

Infineon provides MEMS technology for Valeo’s ground projection module based on laser beam scanning presented at 2026 Auto Beijing

April 28, 2026
  • Valeo and Infineon are collaborating on a ground projection module to enhance V2X communication and road safety.
  • They showcase their first product at AutoBeijing, integrating Infineon’s MEMS technology into Valeo’s short distance HD and bi-color projection module.

Infineon Technologies AG FSE: IFX / OTCQX: IFNNY) a global leader in semiconductor and sensor solutions, and Valeo, a global leader in automotive lighting, are collaborating on a short distance ground projection module integrating Laser Beam Scanning (LBS). Their first collaborative innovation is showcased at 2026 AutoChina in Beijing, China, at the Valeo booth (Hall … Read More → "Infineon provides MEMS technology for Valeo’s ground projection module based on laser beam scanning presented at 2026 Auto Beijing"

SECO demonstrates its end-to-end smart vending ecosystem at VendItalia 2026

Experience SECO’s smart vending ecosystem live, featuring connected machines, contactless payments, and real-time data insights through fully integrated edge-to-cloud solutions.
April 28, 2026

23 April 2026 – SECO will participate in VendItalia 2026, taking place in Rimini from May 6 to 8, where it will present its smart vending solutions through live demonstrations and integrated technologies designed to support more connected and efficient vending operations.

Live demos: real-world smart vending in action

At the event, visitors will experience a live smart vending demo based on the SBC-SANTVEND-MX6 solution, integrated with Clea Vend and KarL4. The demonstration will feature a fully operational coffee vending machine, showcasing a real-world purchase flow with contactless payments, real-time data collection, and cloud-based analytics.

Through Read More → "SECO demonstrates its end-to-end smart vending ecosystem at VendItalia 2026"

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