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Vishay Intertechnology AEC-Q200 Qualified Thick Film Power Resistor Offers Enhanced Protection Against Short Transient Pulses

Offered in Clip-Mount TO-247 Package for Direct Mounting on a Heatsink, Device Combines High Pulse Absorption to 75 J/0.1 s With Power Dissipation of 150 W
April 10, 2025

MALVERN, Pa. — April 9, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today that it has extended its LTO series of thick film power resistors with a new AEC-Q200 qualified device that delivers higher pulse absorption up to 75 J/0.1 s. Offered in a clip-mount TO-247 package for direct mounting on a heatsink, the Vishay Sfernice LTO 150H offers high power dissipation of 150 W at a +45 °C case temperature.

The device released today features a unique design that provides 30 % higher energy absorption than existing LTO series devices for enhanced protection against short transient pulses. The result is more stable operation in high … Read More → "Vishay Intertechnology AEC-Q200 Qualified Thick Film Power Resistor Offers Enhanced Protection Against Short Transient Pulses"

Navitas & GigaDevice Announce Partnership to Combine Power & Control for Next-Gen, High-Frequency, High-Efficiency, & High-Density Power Platforms

Joint lab collaboration expected to accelerate GaN & SiC adoption in AI data centers, EV, solar and energy storage systems (ESS)
April 9, 2025

KIOXIA, AIO Core and Kyocera Announce Development of PCIe 5.0-Compatible Broadband Optical SSD for Next-Generation Green Data Centers

April 9, 2025

Germany, Düsseldorf, 9 April 2025 – KIOXIA Corporation, AIO Core Co., Ltd. and Kyocera Corporation today announced the development of a prototype PCIe 5.0-compatible broadband SSD with an optical interface (broadband optical SSD). The three companies will develop technologies for broadband optical SSDs to enhance their suitability for advanced applications that require high-speed transfer of large data, such as generative AI, and will also apply them to proof-of-concept (PoC) tests for future social implementation.

The new prototype achieved functional operation with the high-speed PCIe 5.0 interface, which is twice the bandwidth of the previous PCIe 4.0 generation [1], through the combination of … Read More → "KIOXIA, AIO Core and Kyocera Announce Development of PCIe 5.0-Compatible Broadband Optical SSD for Next-Generation Green Data Centers"

Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection

New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry's first side-wettable flank versions
April 9, 2025

Nijmegen, April 09, 2025: Nexperia today announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimized for protecting and filtering high-speed data communication links which are increasingly used in modern cars. Applications like in-vehicle camera video-links, multi-gigabit automotive Ethernet networks as well as infotainment interfaces like USBx, HDMIx, and PCIex, can be protected against potentially damaging ESD events.

Flip-chip packages have minimal parasitic components – they come without bond wires or copper lead frames resulting in high performance and excellent signal integrity. Nexperia’s … Read More → "Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection"

Innatera Appoints Intralink to Bring Brain-Inspired AI to Asia

Supercharging sensors with ultra-low-power AI for edge devices.
April 8, 2025

RIJSWIJK, NETHERLANDS – April 8, 2025 – Innatera, the leading provider of neuromorphic computing solutions, has appointed Intralink, an international business development consultancy, to introduce Innatera’s ultra-low-power AI technologies to Asia. The rollout will begin in China and Taiwan, with plans for further expansion across the region. The partnership will empower local Original Equipment Manufacturers (OEMs) to drive innovation in next-generation products, from smart sensors and wearables to autonomous systems.

Innatera’s neuromorphic technology mimics how the human brain processes information, enabling ultra-efficient and lightning-fast AI computations. Unlike traditional … Read More → "Innatera Appoints Intralink to Bring Brain-Inspired AI to Asia"

TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications

April 8, 2025
  • HAL/HAR 35xy* is an ASIL C ready, stray-field robust Hall-effect 2D position sensor family with enhanced features for safety-critical automotive applications

    New sensors include a single-die version (HAL 3550) and a dual-die version (HAR 3550) with analog (linear, ratiometric) and digital (PWM, SENT & Switch) output interfaces

    Based on the flagship Micronas HAL/HAR 39xy family, offering a more cost-effective option without sacrificing performance or functional safety performance

    Main target applications are steering wheel angles, brake and accelerator pedal positions, valve positions, and chassis position detection**

April 08, 2025

TDK Corporation ( … Read More → "TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications"

ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm

COM-HPC-mMTL: 14-Core Intel® Core™ Ultra Processor with Integrated ARC GPU+NPU and 16x PCIe Ultra-Power Performance, Perfectly Sized to Fit Any Space
April 8, 2025
  • ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm
  • COM-HPC-mMTL: 14-Core Intel® Core™ Ultra Processor with Integrated ARC GPU+NPU and 16x PCIe
  • Ultra-Power Performance, Perfectly Sized to Fit Any Space

Summary:

Lynred unveils LTB, comprehensive software suite enabling quicker integration of its infrared sensors

April 8, 2025
Lynred ToolBox (LTB) supports Lynred’s infrared (IR) products by enabling integrators in defense, commercial and industrial sectors to evaluate and enhance IR image quality and optimize IR sensor performance. It simplifies development, potentially halving time-to-market

First software suite offering from hardware manufacturer Lynred

Grenoble, France, April 8, 2025 – Lynred, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets, today announces its unveiling of Lynred ToolBox (LTB), an intuitive software solution designed to facilitate the  evaluation of Lynred’s IR modules and sensors by assessing IR image quality and overall performance. … Read More → "Lynred unveils LTB, comprehensive software suite enabling quicker integration of its infrared sensors"

TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications

April 8, 2025
  • HAL/HAR 35xy* is an ASIL C ready, stray-field robust Hall-effect 2D position sensor family with enhanced features for safety-critical automotive applications
  • New sensors include a single-die version (HAL 3550) and a dual-die version (HAR 3550) with analog (linear, ratiometric) and digital (PWM, SENT & Switch) output interfaces
  • Based on the flagship Micronas HAL/HAR 39xy family, offering a more cost-effective option without sacrificing performance or functional safety performance
  • Main target applications are steering wheel angles, brake and accelerator pedal positions, valve positions, and chassis position detection**

April 08, 2025

TDK … Read More → "TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications"

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