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Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces

Introspect Technology, a JEDEC® member and a leading manufacturer of test and measurement instruments, announced today that it is currently shipping the M5504 High-Speed Digital Test System. As … Read More → "Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces"

ROHM Develops 5th Generation SiC MOSFETs with Approximately 30% Lower On-Resistance at High Temperatures

ROHM Semiconductor today announced it has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high‑efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers.

Read More → "ROHM Develops 5th Generation SiC MOSFETs with Approximately 30% Lower On-Resistance at High Temperatures"

Posifa Technologies Introduces PGS5100 Series Hydrogen Sensors for EV Battery Safety and Leak Monitoring

Posifa Technologies today introduced its new PGS5100 series of MEMS thermal conductivity hydrogen sensors, engineered to provide early warning of abnormal conditions inside EV battery packs and other demanding safety-critical environments. Building on the proven performance of the company’s earlier PGS4100 series, the new sensors deliver 10x faster response, measure hydrogen concentrations from 0 % to 25 %, and … Read More → "Posifa Technologies Introduces PGS5100 Series Hydrogen Sensors for EV Battery Safety and Leak Monitoring"

Quantum chips: Infineon contributes industrialization know-how to European quantum pilot lines

Infineon Technologies AG is a core industrial partner in accelerating Europe’s move toward practical – and ultimately, commercially viable – quantum computing by contributing its world-class engineering and manufacturing expertise to three quantum pilot lines projects: SUPREME, CHAMP-ION and SPINS.

European quantum pilot lines are designed to bridge the gap between laboratory research and industrial-scale manufacturing. They provide open-access to industrial-grade facilities to startups, Small and Medium-sized Enterprises, and research organizations to accelerate quantum computing, communication and sensing technologies. Overall, six European projects spanning distinct hardware platforms have been selected to advance quantum chip technology in Europe over … Read More → "Quantum chips: Infineon contributes industrialization know-how to European quantum pilot lines"

Essent Reduces Contact Centre Technology Costs by 50%

Essent N.V., the Netherlands’ largest energy supplier, has completed a wholesale transformation of its contact centre infrastructure — cutting technology costs by 50%, achieving zero critical incidents post-migration, and improving agent workplace satisfaction by 36%.

The migration – which was delivered in partnership with AI-first customer experience transformation specialists, Sabio Group – was completed in under 12 weeks for an operation spanning over 1,000 agents across two locations.

The scale of the challenge was formidable. In a Read More → "Essent Reduces Contact Centre Technology Costs by 50%"

SEGGER Adds Support for OnMicro OM662X Series to J-Link and Flasher

Monheim am Rhein, Germany, April 22, 2026—All J-Link features, including unlimited breakpoints in RAM and flash memory, high-speed Real-Time Transfer (RTT) as well as ultra-fast download directly into on-chip and external flash memories, are fully supported. With J-Link support comes integration with most IDEs and debuggers, including SEGGER Read More → "SEGGER Adds Support for OnMicro OM662X Series to J-Link and Flasher"

Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces

Introspect Technology, a JEDEC® member and a leading manufacturer of test and measurement instruments, announced today that it is currently shipping the M5504 High-Speed Digital Test System. As … Read More → "Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces"

Quinas Technology advances ULTRARAM development with atomic-scale processing at KAUST Core Labs

Quinas Technology Ltd, developer of the disruptive ULTRARAM non-volatile memory technology, has announced a significant milestone in its research and development programme, confirming the use of Atomic Layer Etching (ALE) to fabricate and refine its quantum-engineered device structures at KAUST Core Labs in Saudi Arabia.

The work builds on more than a decade of foundational quantum device research … Read More → "Quinas Technology advances ULTRARAM development with atomic-scale processing at KAUST Core Labs"

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