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FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders

GRENOBLE, France – March 9, 2026 at 4:30pm CET – The FAMES Pilot Line today launched its second Open-Access Call for European semiconductor stakeholders to join the groundbreaking EU initiative focused on new chip architectures to boost European tech sovereignty.  An online launch … Read More → "FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders"

MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform

  • Inova Semiconductors collaborate with MIPS to build reference Physical AI platform for secure architectures in Robotics applications
  • New platform will be a hardware-based custom SoC solution enacting sense-think-act-communicate signal chains to reduce size, weight and power constraints
  • Flexible and scalable architecture reduces software requirement for data communication, driving rapid development cycles and accelerating time-to-market for Robotics platforms

SAN JOSE, Calif., March 9th, 2026 – MIPS, a GlobalFoundries company, announced today a … Read More → "MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform"

AMD Extends Ryzen AI Embedded Processor Portfolio, Delivering Scalable, Efficient AI Compute for Industrial and AI Edge Solutions

News Snapshot:

  • New processors enable next-generation industrial and robotics solutions with up to twice the CPU cores and higher AI throughput in the same compact footprint.
  • From industrial automation to mobile robotics and medical imaging, embedded developers can accelerate AI deployments using AMD ROCm™, a proven, open-source software stack for edge applications.

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that … Read More → "AMD Extends Ryzen AI Embedded Processor Portfolio, Delivering Scalable, Efficient AI Compute for Industrial and AI Edge Solutions"

SEGGER Partners with Razorcat on Automated Embedded-Software Testing

Monheim am Rhein, Germany — March 9, 2026 — TESSY is a widely used unit and integration testing tool for embedded software, particularly for safety-related projects. It automates test creation and test cycles; aids test organization and management; and supports a wide range of microcontrollers, compilers, and debuggers.

SEGGER’s software-development tools are well integrated with TESSY. Read More → "SEGGER Partners with Razorcat on Automated Embedded-Software Testing"

POLYN Highlighting Live NASP Voice Chip Demo at Embedded World 2026

March 9, 2026 – Nuremberg, Germany – POLYN Technology, a pioneer in ultra-low-power neuromorphic computing, will present a live demonstration of its NeuroVoice voice chip at Embedded World 2026, showcasing the first production-oriented implementation of its silicon-proven Neuromorphic Analog Signal Processing (NASP™) technology.

The live demo highlights POLYN’s first silicon-proven NASP VAD chip, which performs always-on voice detection with microwatt-level power consumption. By executing neural-network inference directly in the analog domain, the chip eliminates the traditional power–latency tradeoff that constrains digital edge AI architectures. The result is deterministic, ultra-fast voice detection suitable for battery-operated and energy-harvesting … Read More → "POLYN Highlighting Live NASP Voice Chip Demo at Embedded World 2026"

STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack

Geneva, Switzerland, March 9, 2026 — STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT evaluation board and start exploring.

The Read More → "STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack"

Rohde & Schwarz and NETGEAR collaborate for next generation Wi-Fi 8 access point testing

NETGEAR has selected the CMP180 radio communication tester from Rohde & Schwarz for the development of future Wi-Fi 8 access points. By integrating the tester into their design validation test environment, NETGEAR will be able to speed up the development of performance optimized Wi-Fi products.

Rohde & Schwarz, a leading supplier of test and measurement equipment for wireless applications, and NETGEAR, manufacturer of advanced networking technologies and leading-edge Wi-Fi 7 products, collaborate to get the next generation Wi-Fi 8 products ready for the market.

Wi-Fi 8 is the next generation Wi-Fi based on the upcoming IEEE 802.11bn standard. With … Read More → "Rohde & Schwarz and NETGEAR collaborate for next generation Wi-Fi 8 access point testing"

Panasonic Connect Unveils Latest in Smart Manufacturing at APEX EXPO 2026

NEWARK, NJ (March 9, 2026) – Panasonic Connect North America is showcasing a broad portfolio of smart manufacturing solutions at APEX EXPO 2026 (booth #2103), taking place March 16-19 in Anaheim, CA. In addition to hands-on demonstrations that highlight how the company’s innovations drive real-world customer success, Panasonic Connect … Read More → "Panasonic Connect Unveils Latest in Smart Manufacturing at APEX EXPO 2026"
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