News – Page 37 – EEJournal

Emerson Reaches Milestone with Enhanced AI for Flagship Test and Measurement Software Platform

NI LabVIEW+ Suite introduces code completion and other powerful capabilities to redefine test development productivity and efficiency in the age of AI

February 3, 2026

AUSTIN, Texas (Feb. 3, 2026) – Emerson today announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite. This iteration of Nigel AI introduces code completion and contextual awareness of test projects and local hardware to further accelerate test development. Nigel AI is available … Read More → "Emerson Reaches Milestone with Enhanced AI for Flagship Test and Measurement Software Platform"

Bourns Announces Versatile Square-Package Air Coil Inductor Series Featuring a High Q Value and High Self-Resonant Frequency

New air coil inductors meet today’s high-frequency application demands for enhanced signal filtering, efficient energy transfer and tight inductance tolerance

February 2, 2026

RIVERSIDE, Calif., January 29, 2026 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its AC3028SQ, Read More → "Bourns Announces Versatile Square-Package Air Coil Inductor Series Featuring a High Q Value and High Self-Resonant Frequency"

Web-based tool makes it easier to design advanced materials

A new tool offers researchers a better way of exploring and understanding catalyst data.

February 2, 2026

TSUKUBA, Japan, Feb 2, 2026 – (ACN Newswire) – Modern industry relies heavily on catalysts, which are substances that speed up chemical reactions. They’re vital in everything from manufacturing household chemicals to generating clean energy or recycling waste. However, designing new catalysts is challenging because their performance is affected by many interacting factors.

A new tool developed by researchers at Hokkaido University, published in Science and Technology of Advanced Materials: Methods, will simplify the process by providing researchers with a way to easily view and explore data … Read More → "Web-based tool makes it easier to design advanced materials"

NanoIC extends its PDK portfolio with first A14 logic and eDRAM memory PDK

Launch of new A14 and embedded DRAM process design kits (PDKs) accelerates research and innovation in logic and memory scaling

February 2, 2026

[SUMMARY]
1. NanoIC announces the release of two new process design kits (PDKs): the A14 pathfinding PDK for advanced logic scaling and the eDRAM system exploration PDK for embedded memory research.
2. Both PDKs accelerate learning by connecting early‑stage design exploration with real-world integration, helping researchers and start‑ups explore emerging nodes, anticipate integration challenges, and benchmark designs against realistic scaling metrics.
3. The A14 PDK introduces a direct backside contact architecture that supports continued CMOS scaling, reducing IR drops and generating an 18% area gain and 7% power reduction.
4. The eDRAM PDK enables deeper investigation of embedded memory, … Read More → "NanoIC extends its PDK portfolio with first A14 logic and eDRAM memory PDK"

Major release of HighTec Rust and C/C++ Arm Development Platform v10.0.0 speeds up safety and security focused Automotive software development

February 2, 2026

Saarbruecken/Germany, February 2, 2026 – HighTec EDV-Systeme, a leading provider of compiler solutions for automotive MCUs, announces a new major release of their HighTec Rust and C/C++ Arm Development Platform. The latest version v10.0.0 broadens its device support, integrates LLVM 17 to boost performance, supports memory-safe Rust for hybrid development with legacy C/C++ and comes with comprehensive qualification kits to speed up safety and security certification. HighTec’s toolchain for Rust and C/C++ Arm development is qualified according to the highest functional safety standard ISO 26262 up to ASIL D and … Read More →

NFC Forum Publishes Its Latest Technology Roadmap

Six key initiatives are highlighted, offering an insight into the future of NFC tech

February 2, 2026

2 February 2026 – Read More → "NFC Forum Publishes Its Latest Technology Roadmap"

PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio

Low-power, 5V‑capable devices deliver high performance while preserving low system complexity and costs

January 30, 2026

CHANDLER, Ariz., January 29, 2026 — Building on decades of experience in serving embedded applications where low power, affordability and ease of development are critical, Microchip Technology (Nasdaq: MCHP) has added PIC32CM PL10 MCUs to its … Read More →

Cincon’s 600W CFM Series: Addressing Today’s Engineering Challenges

January 30, 2026

FORTEC United Kingdom is introducing the new CFM600S Series from Cincon, a 600W AC-DC power supply designed to directly address the key challenges faced by today’s design and system engineers: space constraints, thermal management, regulatory compliance and long-term reliability.

As power requirements increase and enclosures shrink, engineers are under growing pressure to deliver higher performance without compromising safety, efficiency or service life. The CFM600S responds with a compact 3” × 5” form factor, integrated PFC and a power density of up to 25.97 W/in³, enabling high-power designs without costly mechanical … Read More → "Cincon’s 600W CFM Series: Addressing Today’s Engineering Challenges"

Rohde & Schwarz at DesignCon 2026 to deliver the latest in T&M solutions and a chance to win an MXO 3 oscilloscope

January 30, 2026

Rohde & Schwarz will exhibit its latest advancements in test and measurement technology at DesignCon 2026, booth #949. Attendees can participate in a full-day technical workshop open to all DesignCon visitors, experience hands-on demonstrations of cutting-edge solutions, and enter a drawing to win the new MXO 3 oscilloscope.

Rohde & Schwarz has announced comprehensive plans for DesignCon 2026, the premier high-speed communications and system design conference and exposition, taking place February 24 to 26 in Santa Clara, California, in the heart of Silicon Valley. This year’s program for the conference reflects the commitment of Rohde & Schwarz to delivering technical expertise directly … Read More → "Rohde & Schwarz at DesignCon 2026 to deliver the latest in T&M solutions and a chance to win an MXO 3 oscilloscope"

EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI

Ultra-low-power Edge AI SoC enters fabrication, validating next-generation architecture

January 30, 2026

LOS ANGELES (Jan. 28, 2026) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC). The device has entered fabrication at TSMC, marking the transition of EMASS’s next-generation ultra-low-power edge AI architecture from final design into production silicon.

The 16nm ECS-DoT represents a process-node and architectural scaling of EMASS’s proven 22nm ECS-DoT platform, increasing compute density, memory bandwidth and system integration while preserving the ultra-low-power design principles that define the ECS-DoT family. The move to 16nm enables higher logic density … Read More → "EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI"