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Agentuity Launches V1 of Cloud Platform Built for AI Agents

Full-stack platform gives developers and AI agents the infrastructure to build, deploy, and scale agentic software, with built-in services, sandboxes, and deployment anywhere.
February 4, 2026

AUSTIN, Texas—February 3, 2026—Agentuity today announced the launch of V1 of its cloud platform built for AI agents. Now in general availability, Agentuity is a full-stack platform for developers of AI agents. The platform enables the streamlined creation of fully functional and easy-to-manage agents through purpose-built primitives for agentic software. These include built-in storage services, secure code execution sandboxes, production evaluations, and the ability to deploy anywhere from public cloud to on-premises infrastructure.

 

Agentuity’s debut is occurring at a time when the software industry and the corporate world in general are … Read More → "Agentuity Launches V1 of Cloud Platform Built for AI Agents"

Zapata Secures Foundational Patent for Interoperable Quantum Software Across Key Global Markets

New grants in four additional jurisdictions complete global patent protection for Quantum Intermediate Representation (QIR), a core enabler of hardware-agnostic quantum applications
February 4, 2026

Boston, MA – February 3, 2026 – Zapata Quantum (OTC: ZPTA) (“Zapata”, “Zapata Quantum” or the “Company”), a pioneer in quantum computing application and algorithm development, today announced that its patent for Quantum Intermediate Representation (QIR) has been granted in Canada, Europe, Israel and Australia, in addition to its earlier U.S. grant.

QIR is a hardware-agnostic translation layer that enables quantum applications to interoperate across distinct hardware platforms and programming frameworks. With global patent protection now in place, Zapata has secured exclusive rights to this capability, allowing developers to translate a program once into a universal representation, then execute it … Read More → "Zapata Secures Foundational Patent for Interoperable Quantum Software Across Key Global Markets"

Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems

Company announces breakthrough in memory efficiency and silicon readiness for next-gen AI data centers; 3nm Chip Tape-Out
February 4, 2026

Barcelona, Spain—February 3rd, 2026—Semidynamics today announced its expansion into full-stack AI infrastructure, unveiling a strategic roadmap to deliver high-performance inference silicon and vertically integrated systems. Building on its proprietary architecture, the company is developing chips, boards, and rack-level systems designed for the most demanding AI workloads in next-generation data centers

Breaking the Memory Wall and 3nm Milestone

Semidynamics’ entry into the silicon market is built on years of architectural innovation.  The company’s silicon architecture features a new memory subsystem designed to overcome bandwidth bottlenecks and mitigate supply constraints tied to high-end … Read More → "Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems"

Samtec Showcases 224 and 448 Gbps High-Performance Interconnect Solutions at DesignCon 2026

February 3, 2026

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces it will showcase high-performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026 in Santa Clara, CA on February 25-26. Attendees can register with the Samtec VIP code: INVITE373903 to receive a free Expo Pass or 15% discount for conference passes.

Visit Booth 939 Wednesday and Thursday

Samtec will be celebrating 50 years of Sudden Service® in Booth #939. In-booth engineering experts can help attendees find the optimal … Read More → "Samtec Showcases 224 and 448 Gbps High-Performance Interconnect Solutions at DesignCon 2026"

Concurrent Achieves AS9100 Certification in the UK

February 3, 2026

Concurrent Technologies Plc (Concurrent), a designer and manufacturer of computer products, systems, and mission-critical solutions for high-performance markets, announces that its UK facilities have achieved AS9100 certification.

AS9100 is the internationally recognised quality management standard for the aviation, space, and defence sectors. Certification reflects a rigorous assessment of quality management practices, including process control, product conformity, traceability, risk management, and continuous improvement.

Concurrent’s Colchester and Theale facilities join it’s Los Angeles facility, which already has AS9100 accreditation. With the UK facilities now certified, Concurrent can support customers … Read More → "Concurrent Achieves AS9100 Certification in the UK"

Knowles Introduces New Multi-Way Balanced Armature Driver Family to Simplify Premium IEM Design

Pre-configured multi-driver combinations with integrated crossover circuits accelerate development of high-performance in-ear monitors
February 3, 2026

Knowles Corporation today announced the availability of a new family of multi-way balanced armature driver combinations designed to streamline the development of premium in-ear monitors (IEMs), gaming earphones, and high-resolution audio products.

For decades, designing high-performance IEMs has required the careful selection and integration of multiple individual drivers, along with complex crossover tuning to achieve the desired sound signature. Knowles’ new multi-way driver family simplifies that process by combining advanced BA technologies into compact, pre-configured packages with integrated crossover circuits — enabling faster development and consistent, world-class audio performance.

Advanced BA Technologies in a Single … Read More → "Knowles Introduces New Multi-Way Balanced Armature Driver Family to Simplify Premium IEM Design"

STMicroelectronics’ space-grade driver supports high-speed data and low-voltage logic

New QML-V qualified LVDS (Low-Voltage Differential Signaling) device raises performance and eases integration
February 3, 2026

Geneva, Switzerland, February 3, 2026 — Supporting faster data speeds in space applications, ST’s RHFLVDS41 Low-Voltage Differential Signaling driver sets a new performance benchmark among QML-V qualified devices for data exchanges at up to 600Mbps. Having a wide operating-voltage range, from 2.3V-3.6V, the driver is compatible with the latest low-voltage logic and … Read More → "STMicroelectronics’ space-grade driver supports high-speed data and low-voltage logic"

Impulse Embedded Introduces Neousys POC-915: Compact, Fanless System for Vision and Industrial Automation

February 3, 2026

Staffordshire, UK – Impulse Embedded, supplier of industrial computing and networking platforms for demanding applications, has announced availability of the Neousys POC-915: an ultra-compact, fanless embedded computer designed for machine vision, industrial automation, and edge AI deployments.

The POC-915 combines rugged mechanical design with modern processing and AI acceleration in a form factor that integrates cleanly into industrial environments. It is designed for DIN-rail mounting as standard (with wall-mount options available) and is well suited to control cabinets, trackside infrastructure, and vehicle or roadside installations where equipment must stay secure and operate consistently over … Read More → "Impulse Embedded Introduces Neousys POC-915: Compact, Fanless System for Vision and Industrial Automation"

Amid rising cyber threats, EnSilica joins the CHERI Alliance to enable safe & secure silicon

February 3, 2026

Oxford UK – 3 February 2026 – EnSilica, a leading provider of mixed-signal ASICs (Application-Specific Integrated Circuits), today announced that it has  joined the CHERI Alliance. In a world facing an explosion of cyber threats, this  collaboration will accelerate the adoption of a technology that could  eliminate more than 70% of current vulnerabilities. 

The Power of CHERI Technology 

CHERI (Capability Hardware Enhanced RISC Instructions) is an open technology that fundamentally strengthens … Read More → "Amid rising cyber threats, EnSilica joins the CHERI Alliance to enable safe & secure silicon"

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