News – Page 38 – EEJournal

RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026

A system-level platform spanning humanoid robotic arms, integrated joint modules, global remote operations, and open-sourced real-world data.

January 29, 2026

Las Vegas, CES 2026 – RealMan Robotics, a system-level infrastructure platform company for the era of embodied intelligence, unveiled its latest advancements at CES 2026, showcasing a comprehensive technology stack spanning hardware, data, and remote operations.

At the exhibition, RealMan presented three core innovations:

A fully integrated joint module

Ultra-lightweight humanoid robotic arms

The Global Labor Network (GLN), powered by RealBOT wheel-foldable robots and the Humanoid Robot Data Training Center

Read More → "RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026"

Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact

January 29, 2026

WHAT’S NEW: Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program. This recognition places both companies among a distinguished global group of pioneers advancing artificial intelligence solutions that are not only technically advanced but also deployed with measurable real-world impact.

The MINDS awards and program, part of the World Economic Forum’s AI Global Alliance initiative, identifies organizations that are leading the way in applying AI to complex, high-stakes challenges. Synopsys and AMD were specifically recognized for their work applying reinforcement learning, generative … Read More → "Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact"

Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects

Collaboration validates Point2 Technology’s innovative e-Tube™ multi-terabit interconnects using Keysight's high-speed digital test solutions, addressing critical power and bandwidth challenges in AI infrastructure

January 29, 2026

Keysight Technologies, Inc. (NYSE: KEYS) and Point2 Technology today announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up connectivity bottlenecks in artificial intelligence (AI) and machine learning (ML) data centers. Using Keysight’s high-speed digital test solutions, including theRead More → "Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects"

KIOXIA Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage

8th-Generation BiCS FLASHTM Technology Delivers Performance, Efficiency Gains

January 29, 2026

Germany, Düsseldorf, 28 January 2026 – Read More → "KIOXIA Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage"

Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics

First-Of-Its-Kind Solution For Barium Titanate Epitaxy on Silicon to Accelerate Datacom and Quantum Computing Applications

January 28, 2026

Plainview, N.Y. (U.S.A) and Leuven (Belgium), January 28, 2026 – Veeco
Instruments Inc. (Nasdaq: VECO) and imec announced today that they have
collaboratively developed a 300mm high volume manufacturing compatible
process that enables the integration of barium titanate (BaTiO3 or BTO)
on a silicon photonics platform. BTO is a promising material with unique
electro-optical properties that can be used for high-speed and low-power
light modulation in emerging applications such as high-speed optical
transceivers, quantum computing, light detection and ranging (LiDAR),
and AR/VR applications. Historically, approaches to integrate BTO have
… Read More → "Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics"

NEXCOM Unveils NDiS B340, a Cost-efficient and Expandable Edge Computing Platform

Optional PCIe expansion enables scalable SD-Edge deployment

January 28, 2026

Taipei, Taiwan – January 28^th, 2026 – Edge computing today faces competing demands, for computers which are affordable and power efficient, but also for computers which can take on more demanding roles when required. Now, NEXCOM’s new NDiS B340 Duro Edge Computer serves this large but challenging market in a single product, with a versatile base unit that can be upgraded at any time with a dockable PCIe expansion module (DockInfinity-E4X1).

This provides the best of both worlds: a compact and affordable base computer with a huge array of connectivity options, which can be extended on … Read More → "NEXCOM Unveils NDiS B340, a Cost-efficient and Expandable Edge Computing Platform"

Concurrent Unveils Industry-Leading 32-Core 3U VPX using Intel Xeon 6 Soc Designed by Pioneering Engineer Rachael Peterson

January 28, 2026

-For immediate release- Concurrent, a leader in embedded computing solutions, is launching an enhanced version of its flagship rugged computing product, Kratos.

The new Kratos 32-core increases available performance from the original 20-core version and so becomes the highest-core-count Intel® Xeon® 3U VPX computing board available. Built around a 32-core Intel® Xeon® processor in a SOSA® aligned 3U VPX form factor, this latest version sets a new industry standard for computing power in compact, mission-ready hardware.

While the earlier released Kratos (20-core) combines 20 CPU cores with a vRAN accelerator, making it … Read More →

SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability

Policy Priorities Focus on Trade, Workforce, Investment Certainty, CHIPS Act Implementation, and Supply Chain Resilience

January 28, 2026

MILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced its Read More → "SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability"

Partsol Announces Next Generation AI Stem Cells, A New Foundation for Truth Based Cognitive Intelligence

Revolutionary technology redefines how AI is designed, grown, and trusted, promising to transform high stakes industries from cancer research to national security

January 28, 2026

TAMPA, Fla., Jan. 28, 2026 /PRNewswire/ — Partsol today announced the release of their enhanced AI Stem Cells, a groundbreaking scientific breakthrough that redefines how artificial intelligence is designed, grown, and trusted. Revealed through a newly released video, these next generation AI Stem Cells represent a new approach to cognitive intelligence rooted in absolute truth rather than probabilistic guesswork. Watch the full video here: Read More → "Partsol Announces Next Generation AI Stem Cells, A New Foundation for Truth Based Cognitive Intelligence"

Microchip Technology’s PIC32WM-BZ6 Multiprotocol Module, Now at Mouser, Delivers Connectivity and Scalability in IoT Devices

January 28, 2026

January 28, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the Read More → "Microchip Technology’s PIC32WM-BZ6 Multiprotocol Module, Now at Mouser, Delivers Connectivity and Scalability in IoT Devices"