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Renesas Introduces New MOSFETs with Exceptional Performance

New Renesas Wafer Technology Delivers 30 Percent Lower On-resistance, 40 Percent Reduction in Gate-Drain Charge, and 50 Percent Smaller Package Size
January 13, 2025
TOKYO, Japan, January 9, 2025 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced new 100V high-power N-Channel MOSFETs that deliver industry-leading high-current switching performance for applications such as motor control, battery management systems, power management and charging. End products include electric vehicles, e-bikes, charging stations, power tools, data centers, uninterruptable power supplies (UPS) and more.
Renesas has developed a new MOSFET wafer manufacturing process (REXFET-1) that enables the new devices to drastically reduce on-resistance (the resistance between the drain and source when the MOSFET is on) by 30 percent. The lower on-resistance contributes … Read More → "Renesas Introduces New MOSFETs with Exceptional Performance"

Bluetest and Rohde & Schwarz collaborate to offer over-the-air testing of next-generation WLAN devices

January 13, 2025

Bluetest and Rohde & Schwarz extend their long-established collaboration and have integrated the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test systems (RTS) to perform MIMO stress testing of IEEE 802.11be stations as well as access points under realistic conditions.

Bluetest specializes in reverberation chambers, such as the RTS65, which are designed for efficient over-the-air performance evaluation of wireless devices. In contrast to anechoic test chambers, reverberation chambers extensively reflect an RF signal … Read More → "Bluetest and Rohde & Schwarz collaborate to offer over-the-air testing of next-generation WLAN devices"

TriLite to Showcase Smart Glasses and Automotive Projection Innovations at SPIE AR | VR | MR

January 13, 2025

Vienna, Austria – January 13, 2025 – TriLite, a pioneer in ultra-compact projection display technology, announces its participation at this year’s SPIE AR | VR | MR event in San Francisco, California. Located at booth 6418, TriLite will present live demonstrations of its augmented reality (AR) smart glasses, powered by Trixel® 3—the world’s smallest projection display.

Exclusive Demonstration: Dynamic Automotive Projection

Read More → "TriLite to Showcase Smart Glasses and Automotive Projection Innovations at SPIE AR | VR | MR"

TDK launches next-gen TWS solution VibeSense360™ enabling premium immersive sound

January 13, 2025
  • The next-gen VibeSense360™ TWS solution includes motion sensor hardware and software
  • Running on the latest SmartMotion® ICM-45606 IMU, the next-gen VibeSense360 enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning
  • The 220 µA @ 50 Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications

January 7, 2025

TDK Corporation (TSE:6762) announces the enhanced next-generation InvenSense VibeSense360™ solution for state-of-the-art spatial audio head tracking. Samples are available via direct inquiry with InvenSense sales.

VibeSense360™ enables concurrent execution of … Read More → "TDK launches next-gen TWS solution VibeSense360™ enabling premium immersive sound"

TE Connectivity’s MULTIGIG HD selected as future VPX connector standard

With doubled pin count compared to VITA 46 and speeds up to 112 Gb/s, TE’s MULTIGIG HD connector designed to meet defense industry’s increased connectivity and bandwidth requirements
January 13, 2025

HARRISBURG, Pa., January 13, 2025 – TE Connectivity, a world leader in connectivity and sensors, today revealed its MULTIGIG HD connector was selected by the VITA Standards Organization (VSO) as the Next-Generation VPX plug-in module connector and will become a defense industry standard. The redesigned MULTIGIG HD connector builds on the previous variants of TE’s MULTIGIG HD product family, while bringing significant … Read More → "TE Connectivity’s MULTIGIG HD selected as future VPX connector standard"

Nokia’s Cellular Network Ready for Moon as Intuitive Machines Completes Final Lunar Lander Installation

January 9, 2025

HOUSTON, Jan. 07, 2025 (GLOBE NEWSWIRE) — Today Intuitive Machines, Inc. (Nasdaq: LUNR, LUNRW) (“Intuitive Machines”) and Nokia (NYSE: NOK, Euronext: NOKIA) announced the successful final integration of Nokia’s Lunar Surface Communication System (“LSCS”) into the IM-2 mission lander, named Athena. Athena and the LSCS will voyage to the lunar south pole region in the upcoming IM-2 mission, where Nokia and Intuitive Machines intend to deploy the first cellular network on the Moon.

After months of testing and validation with Nokia Bell Labs, Intuitive Machines engineers installed the LSCS “network in a box” to one of Athena’ … Read More → "Nokia’s Cellular Network Ready for Moon as Intuitive Machines Completes Final Lunar Lander Installation"

NXP’s New Ultra-low-power MCX L Microcontrollers Enable the Next Generation of Smart, Sustainable Solutions

Using 3x less power than previous MCX devices, the MCX L series MCUs leverage an ultra-low-power sense domain to extend the battery life for smart sensor nodes, flow meters and other battery-constrained industrial and IoT devices.
January 9, 2025

What’s new: As part of its ongoing initiative to provide innovative systems solutions for industrial and home energy management, NXP Semiconductors today announced the MCX L14x and MCX L25x, the first families in the ultra-low-power L Series of theRead More → "NXP’s New Ultra-low-power MCX L Microcontrollers Enable the Next Generation of Smart, Sustainable Solutions"

Imec and partners show outdoor stability of highly anticipated perovskite solar modules

A leap for photovoltaic research
January 9, 2025

LEUVEN (Belgium), JANUARY 7, 2024—Imec, partner in EnergyVille, in collaboration with the University of Cyprus, has demonstrated long-term outdoor stability of perovskite solar modules. Mini-modules of 4 cm2, developed at imec/EnergyVille, were comprehensively evaluated over two years in real-world conditions in Cyprus, with a remarkable power efficiency retention of 78 percent after one year, which current perovskite solar modules only retain for weeks. These promising findings are among the first real-world results to address the stability issues that currently hinder perovskite solar cells from commercialization.

Over the last decade, metal halide perovskites have … Read More → "Imec and partners show outdoor stability of highly anticipated perovskite solar modules"

Ceva Powers Oritek’s Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles

Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions
January 9, 2025

LAS VEGAS, NV. – CES 2025 – January 8, 2025  – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that Oritek Semiconductor, a provider of AI system-on-chip (SoC) solutions for intelligent automotive platforms, has licensed Ceva’s SensPro™ Vision AI DSP for its Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets.

The Longquan 560 series represents Oritek’s commitment to innovation, catering to diverse intelligent automotive needs of Electric Vehicles (EV) such as AI-based headlights, camera monitoring systems (CMS), zone … Read More → "Ceva Powers Oritek’s Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles"

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