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L-com Debuts 18 New Passive Fiber Optic Splitters/Combiners

IRVINE, Calif. – L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that it has introduced a new series of passive optical splitters/combiners. This product line is designed to work in various Passive Optical Network (PON), Gigabit Passive Optical Network (GPON) applications and in a wide range of fiber to the home, building, curb and other (FTTx) networks

L-com’s new line of Read More → "L-com Debuts 18 New Passive Fiber Optic Splitters/Combiners"

Mouser Electronics New Product Insider: February 2021

February 25, 2021 As an authorized distributor, Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 1,100 semiconductor and electronic component manufacturer brands count on Mouser to help them introduce their products into the global marketplace. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each manufacturer.

Last month, Mouser launched more than 436 < … Read More → "Mouser Electronics New Product Insider: February 2021"

KEMET Advances Noise Suppression Solutions for Commercial, Telecommunications, and Automotive Applications

FORT LAUDERDALE, Florida, 25. February 2020 – KEMET, part of the Yageo Group and leading global supplier of electronic components, announces advancements in its FLEX SUPPRESSOR, a thin, flexible noise suppression sheet designed to reduce electromagnetic interference (EMI) and other noise disturbances. Its EFG3 and FS series now operate in a broader frequency range (up to 40GHz band), advancing FLEX SUPPRESSOR’s capabilities in 5G-connected devices and electronics for commercial, telecommunications, and automotive applications.

Made from KEMET’s innovative, proprietary EMI-absorbent material, FLEX SUPPRESSOR sheets help prevent noise-induced impairments, malfunctions, and total system failure from occurring. The flexible polymer material … Read More → "KEMET Advances Noise Suppression Solutions for Commercial, Telecommunications, and Automotive Applications"

Silexica to Co-present with Xilinx at the ISFPGA Conference 2021

San Jose, CA – February 25, 2021 – Silexica (Silexica.com) will be co-presenting with Xilinx, Inc. at the 29th International Symposium on Field-Programmable Gate Arrays (ISFPGA) 2021, the premier conference for presentation of advances in FPGA technology. In close collaboration with Xilinx, Silexica designed the new SLX Plugin to extend the capabilities of Vitis HLS as part of the Xilinx Open Source strategy. The SLX Plugin is a high-level synthesis (HLS) compiler add-on, providing a new Loop Interchange pragma that improves Vitis HLS latency and throughput results and expands the reach of … Read More → "Silexica to Co-present with Xilinx at the ISFPGA Conference 2021"

Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions

TOKYO, Japan and BERLIN, Germany, February 24, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open front camera solution, featuring Renesas’ Read More → "Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions"

High Speed Contact from Amphenol Can be used in Harsh Environments

Technical Specifications
  • Bandwidth up to 1.25 GHz
  • Data rate exceeding 2.5 Gbps
  • Maximum voltage rating of 500 Vrms at sea level
  • Available in size 8 crimp termination style

Endicott, N.Y. February 2021 – Amphenol Industrial Operations, a global leader in interconnect systems, now offers the Read More → "High Speed Contact from Amphenol Can be used in Harsh Environments"

Micron Launches Low-Power Memory Qualified for Automotive Safety Applications

BOISE, Idaho, Feb. 24, 2021 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun sampling the industry’s first automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D. The solution is part of Read More → "Micron Launches Low-Power Memory Qualified for Automotive Safety Applications"

Keysight Delivers New Event-Based Power Analysis Software

February 24, 2021 11:00 AM Eastern Standard Time

SANTA ROSA, Calif.- Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced

Keysight’s X8712A software, the KS833A2A Event-based Power Analysis software, enables these engineers to analyze an IoT device’s power consumption and delivers an accurate view of how the IoT device behaves to the subsystem level, as well as its charge consumption profile. It offers an easy-to-use visualization tool, via the company’ … Read More → "Keysight Delivers New Event-Based Power Analysis Software"

New Evaluation Kit for predictive maintenance enables quick and easy condition monitoring in Smart Buildings

Munich, Germany – 23 February 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new XENSIV™ Predictive Maintenance Evaluation Kit, which was co-developed with the IoT service provider Klika Tech and is powered by the cloud service provider AWS to offer an end-to-end solution for customers. The kit includes hardware (sensors, microcontroller, embedded security), software as well as CloudFormation templates. It represents a perfect starting point for quick and easy evaluation of sensor-based condition monitoring and predictive maintenance – proving that Infineon makes the IoT work. The target applications involve heating, ventilation and air conditioning (< … Read More → "New Evaluation Kit for predictive maintenance enables quick and easy condition monitoring in Smart Buildings"

Imec Pushes Single-Exposure Patterning Capability of 0.33NA EUVL to its Extreme Limits

LEUVEN (Belgium), February 23, 2021 — This week, at the 2021 SPIE Advanced Lithography Conference, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and ASML, the world’s leading manufacturer of semiconductor lithography equipment, present several papers that demonstrate the ultimate single-exposure patterning capability of today’s 0.33NA NXE:3400 extreme ultraviolet lithography (EUVL). Process optimizations have enabled the patterning of dense 28nm pitch line/spaces with an Inpria metal-oxide resist in one single exposure, relevant for high-volume manufacturing. For the first time, optical and e-beam inspections were correlated with electrical data … Read More → "Imec Pushes Single-Exposure Patterning Capability of 0.33NA EUVL to its Extreme Limits"

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