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Digital and Analog MEMS Microphones Added to CUI’s Audio Product Group

TUALATIN, Ore. — January 8, 2019 — CUI’s Audio Group today announced the introduction of a comprehensive line of MEMS microphones ideal for a range of portable electronic devices. Boasting improved audio quality, performance, and reliability, CUI’s CMM series is housed in extremely compact, low profile footprints measuring as small as 2.75 x 1.85 x 0.95 mm. As reflow solder compatible components, these MEMS microphones … Read More → "Digital and Analog MEMS Microphones Added to CUI’s Audio Product Group"

Keysight Technologies Provides Test Solutions to SoftBank, Accelerating Mobile Operator’s Deployment of 5G Technology

SANTA ROSA, Calif., January 15, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, announced that SoftBank has chosen Keysight’s Read More → "Keysight Technologies Provides Test Solutions to SoftBank, Accelerating Mobile Operator’s Deployment of 5G Technology"

Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP

MOUNTAIN VIEW, Calif., Jan. 14, 2019 Highlights:

  • Habana Labs achieved first-pass silicon success for its Goya inference processor SoC using Synopsys’ DesignWare Controller and PHY IP for PCI Express 4.0
  • DesignWare IP for PCI Express 4.0 in 16-nm FinFET process delivers the required 16 GT/s data rate and all key features needed for the AI application
  • The Goya AI processor card and the HL-1000 chip, have been added to the PCI-SIG integrators list for PCI Express 3.0 x16, operating at 8 GT/s, as Add-in Cards and Components lists, respectively

Synopsys, … Read More → "Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP"

Dual-Radio Bluetooth®/LPWAN IoT Development Kit from STMicroelectronics Enables Creatively Connected Smart Devices

Geneva, January 14, 2019 — By supporting concurrent communication over Bluetooth® Low Energy (BLE) and Sub-1GHz wireless, the STMicroelectronics STEVAL-FKI001V1 dual-radio development kit gives unrivaled flexibility to envision, build and connect IoT devices like … Read More → "Dual-Radio Bluetooth®/LPWAN IoT Development Kit from STMicroelectronics Enables Creatively Connected Smart Devices"

Adesto Announces that New IoT Standard will Speed Adoption of LON Technology in Building and Industrial Automation

SANTA CLARA, CA – January 14, 2019 – Adesto® Technologies Corporation (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors and embedded systems for the IoT era, announces that the new ANSI/CTA 709.7 LON® IP protocol, recently approved by the American National Standards Institute (ANSI), will speed further adoption of LON technology and continue to expand the LonWorks® ecosystem. The new standard enables native LON communication over any IP transport such as Ethernet and Wi-Fi, as well as interoperability with IP-based web services so that building and industrial automation systems can seamlessly and securely interoperate with cloud and IoT applications.

Adesto, … Read More → "Adesto Announces that New IoT Standard will Speed Adoption of LON Technology in Building and Industrial Automation"

Aldec shortens time of ASIC design prototype bring-up in FPGA with HES-DVM Proto mode

Henderson, Nevada, U.S.A. – January 14, 2019 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for ASIC and FPGA designs, has unveiled the latest release of HES-DVM™, the company’s fully automated and scalable hybrid verification environment for SoC and ASIC designs. Release 2018.12 features enhancements to the level of automation in Prototyping mode plus the faster compilation of HDL to FPGA.

The new HES-DVM provides design partitioning and partition interconnection tools designed to meet the growing need for, and challenges associated with, FPGA prototyping; i.e. FPGAs used as a … Read More → "Aldec shortens time of ASIC design prototype bring-up in FPGA with HES-DVM Proto mode"

New OpenVPX Chassis Platform from Pixus Features Multiple Segments

Waterloo, Ontario  —  Jan 10, 2018 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a 4U OpenVPX chassis platform that features multiple segments for the backplane slots and power supplies.  The configuration provides the ability to have replicated redundancy in one chassis platform as well as red/black segmentation.  

The 4U OpenVPX segmented chassis from Pixus has three pluggable PSU slots and three power and ground backplanes in the 19” rackmount/desktop enclosure.  Single or dual AC feeds are available. 

New multi-channel spectral sensor from ams set to transform the market for mobile color & light measurement

Premstaetten, Austria (09 January, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today launched a miniature spectral sensor chip that brings laboratory-grade multi-channel color analysis capability to portable and mobile devices.

In end products such as mobile phones or accessories, the new AS7341 from ams produces more precise spectral measurements in a wider range of lighting conditions than competing sensors. The new sensor’s small dimensions also mean that it is easier to accommodate it in mobile phones and other portable devices.

“The … Read More → "New multi-channel spectral sensor from ams set to transform the market for mobile color & light measurement"

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