News – Page 2 – EEJournal

Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications

The feasibility of processing a charge coupled device (CCD) in a 3D NAND-like architecture paves the way for a cost-effective, high-bit-density memory solution to address the memory wall for AI specific workloads

May 13, 2026

This week, at the 2026 IEEE International Memory Workshop (IMW), imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents a 3D implementation of a CCD memory device with IGZO channel – a world first. The functional 3D CCD device consists of vertical memory holes drilled through a stack of 3 word-lines, serving as phase gates. Transfer of charges (that make up the bits) across the gates could be demonstrated at >4MHz transfer speed. The feasibility of processing the CCD device in a 3D NAND Flash architecture ensures cost-effective fabrication and … Read More → "Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications"

Infineon collaborates with d-Matrix to optimize performance and power efficiency for interactive AI inferencing

May 13, 2026

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced a collaboration with d-Matrix®, a pioneer in highly interactive, low-latency AI inference compute for data centers. Infineon’s power solutions help d-Matrix’s Corsair™ inference accelerator achieve industry-leading performance, energy efficiency, and system integration in their high-density boards. d-Matrix’s solution leverages the Infineon OptiMOS™ TDM2254xx dual-phase power modules, which enable true vertical power delivery and offer a high density of 1.0 A/mm2.

AI inference applies a trained machine learning model to new data to generate predictions, classifications, or decisions. These models use learned parameters to process inputs … Read More → "Infineon collaborates with d-Matrix to optimize performance and power efficiency for interactive AI inferencing"

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation

May 13, 2026

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosystem, the 3DFabric Alliance enables 3D integrated circuit (IC) innovation, readiness and customer adoption of TSMC’s 3 … Read More → "IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation"

Vacuum Interrupters Introduces RVI-WL-23338 Replacement Vacuum Interrupter for Westinghouse R-4 Vacuum Circuit Breakers

May 13, 2026

TDK launches patented non-isolated buck-boost DC-DC converters with up to 99 % efficiency

May 13, 2026

TDK Corporation (TSE: 6762) announces the launch of the TDK‑Lambda i9C series, a 1500 W non‑isolated DC‑DC buck‑boost power module designed to maximise system efficiency, reduce thermal stress, and extend battery runtime in demanding industrial and battery‑powered applications. The i9C series launches with a 9 – 80 V input, 9.6 – 60 V output model delivering up to 30 A. A second configuration supporting a 9 – 40 V input range with 5 – 36 V output and up to 50 A is planned to follow, expanding the series’ voltage and current options.

At the core of the i9 … Read More → "TDK launches patented non-isolated buck-boost DC-DC converters with up to 99 % efficiency"

Altech Smart Relays and Multi-Timer Combine Scalable Control and Fast Installation

May 12, 2026

Altech Corporation, a leader in industrial automation solutions, offers a broad line of smart relays and timers in its lineup. Available in AC and DC base versions, the smart relays offer system designers easy installation and integration, and a modular design for quick scalability — all in a compact size that make them ideal to monitor and control small- to mid-size systems in real time.

The relays come ready to use and, with their compact 72 x 90 x 65-millimeter housing, they snap on a DIN rail. Installation is fast and easy. With … Read More → "Altech Smart Relays and Multi-Timer Combine Scalable Control and Fast Installation"

Vishay Intertechnology ESD Protection Diode Passes IEEE 10BASE-T1S Compliance Tests

VETH100A1DD1 Meets All Three OPEN Alliance EMC Test Specifications for ESD Protection Devices

May 12, 2026

Vishay Intertechnology, Inc. today announced that its VETH100A1DD1 ESD protection diode, offered in the DFN1006 package, has successfully passed IEEE 10BASE-T1S compliance testing, confirming its suitability for use in automotive One-Pair Ethernet (OPEN) bus architectures.

The VETH100A1DD1 meets all three OPEN Alliance EMC Test Specifications for ESD Protection Devices, supporting 10BASE-T1S, 100BASE-T1, and 1000BASE-T1 applications. In addition to the newly completed IEEE 10BASE-T1S compliance tests, the device has also … Read More → "Vishay Intertechnology ESD Protection Diode Passes IEEE 10BASE-T1S Compliance Tests"

Septentrio extends its GNSS module family with mosaic-G5 P6

View in Browser FOR IMMEDIATE RELEASE Hi , Hope this news release finds you well. Have a nice day, Maria Simsky Septentrio extends its GNSS module family with mosaic-G5 P6 All-in-one GPS/GNSS receiver with minimal SWaP sets a new performance benchmark for survey and industrial automation applications.

May 12, 2026

Septentrio, part of Hexagon, a leader in high-precision GNSS¹ positioning solutions, announces the launch of the mosaic-G5 P6 multi-frequency precise positioning module. This receiver, measuring only 23 mm by 16 mm and weighing as little as 2.2 grams, enables reliable positioning without performance compromises for commercial UAVs, robots, and other size and power-constrained applications. Read More → "Septentrio extends its GNSS module family with mosaic-G5 P6"

HellermannTyton Heat Shrink Moulded Shapes from Lane Electronics Protect Interconnects in Demanding Environments

Provide insulation, strain relief and environmental protection Adhesive lined and plain shapes available from stock

May 12, 2026

Specialist connector distributor Lane Electronics, are a stocking distributor for the HellermannTyton range of high-quality heat shrink boots, shapes, tubing and adhesives for connectors and cable assemblies. Used to protect and … Read More → "HellermannTyton Heat Shrink Moulded Shapes from Lane Electronics Protect Interconnects in Demanding Environments"

Infineon’s new XHP™ 2 CoolSiC™ high-power modules boost efficiency and power density in high-voltage energy systems

May 12, 2026

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems. The new 2300 V class devices support DC-link voltages of up to 1500 V, addressing the industry trend toward higher system voltages. The modules are available in several variants, offering on-resistance (RDS(on)) values ranging from 1 mΩ to 2 mΩ and isolation voltages of 4 kV or 6 kV. By leveraging silicon carbide (SiC) technology, the devices reduce both switching and conduction losses compared to conventional silicon-based solutions. This enables inverters to achieve higher efficiency and power density, or … Read More → "Infineon’s new XHP™ 2 CoolSiC™ high-power modules boost efficiency and power density in high-voltage energy systems"