ANAHEIM, Calif. (APEC) – March 18, 2019 – Read More → "New Isolated ICs Ensure Precise Current and Voltage Measurements with Ultra-Low Temperature Drift"
Aitech’s NVIDIA Jetson-Powered Products with RedHawk Linux RTOS Offer Guaranteed Hard Real-Time Response and Determinism
- Integration of RedHawk Linux for hard RT processing
- COTS SFF GPGPU for military (A176) and industrial (A177) applications
- Compact, low-power, SWaP-optimized with TFLOP performance
Chatsworth, Calif. March 14, 2019 – As leaders in GPGPU computing technologies, Aitech and Concurrent Real-Time have partnered to integrate RedHawk Linux RTOS with two of Aitech’s powerful Read More → "Aitech’s NVIDIA Jetson-Powered Products with RedHawk Linux RTOS Offer Guaranteed Hard Real-Time Response and Determinism"
Beltsville, MD – March 12, 2019 – DfR Solutions played an integral role in the recent publication of the SAE International Revision A of Aerospace Recommended Practice 6338: “Process for Assessment and Mitigation of Early Wearout of Life-limited Microcircuits.” Lloyd Condra of DfR Solutions led the SAE Working Group that published the revision, which included technical content based on DfR Solutions research.
The revision is a result of an eight-month project by the SAE Avionics Process Management Committee (APMC) to address this persistent problem for the avionics industry. DfR Solutions was invited to participate in this project due … Read More → "Microcircuit Aging/Wearout for Aerospace, Other High-Performance Industries"
Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
• Computing industry leaders collaborate in delivery of the industry’s first development platform for 7nm Arm Neoverse N1 SoCs and CCIX interconnect architecture
• Platform includes a 2.6-3GHz Neoverse N1 SoC implemented and verified using a full Cadence tool flow in TSMC 7nm FinFET process technology and connectivity to Xilinx FPGAs via CCIX
SAN JOSE, Calif., March 12, 2019—Arm, Cadence Design Systems, Inc. (NASDAQ: CDNS) and Xilinx, Inc. (NASDAQ: XLNX) today announced the delivery of a new development platform, silicon-proven on TSMC’s (TWSE: 2330, NYSE: TSM) 7nm FinFET process technology, for next-generation cloud-to-edge infrastructure … Read More → "Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology"
eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC
SOPHIA-ANTIPOLIS, France, March 12, 2019 — Menta SAS, a provider of embedded FPGA (eFPGA) Intellectual Property (IP), today announced that its eFPGA IP has been selected by Beijing Chongxin Communication Company to enable flexibility in baseband SoCs designed for 5G NR pico cell applications.
Menta’s eFPGA integrates embedded SRAM IP in addition to embedded logic blocks (eLBs), global clocks, memory, ALUs, and interfaces optimized for … Read More → "eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC"
MOUNTAIN VIEW, Calif., March 13, 2019 /PRNewswire/ —
- Synopsys Design Compiler NXT incorporates innovative and efficient optimization engines delivering faster runtime and improved power and timing QoR
- Advanced-node support, including common libraries and aligned RC extraction with IC Compiler II, delivers extremely … Read More → "Latest Release of Synopsys’ Design Compiler NXT is Ready for Broad Availability"
DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit
Rochester, NY – March 14, 2019 – D3 Engineering today announced its new DesignCore® sensor interface card for the NVIDIA Jetson AGX Xavier Developer Kit. The new card allows engineers to quickly connect multiple cameras or sensors with their NVIDIA Jetson AGX Xavier Developer Kit to access its full power for system development.
D3 Engineering will demonstrate its DesignCore NVIDIA Jetson AGX Xavier FPD-Link III Sensor Interface Card at the GPU Technology Conference (GTC) in San Jose March 18-21, 2019.
“The new DesignCore sensor interface card allows engineers to take advantage of … Read More → "DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit"
Waterloo, Ontario — Mar 15, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX faceplates for rugged applications.
The new 6U OpenVPX panels feature an extra thick extrusion, providing both rigidity and the ability to attach helicoils on the faceplate. There is also a PCB holder bar that extends along the inside of the 0.8” wide panel. This bar acts as a stiffener for the panel and provides a more … Read More → "Pixus Announces New Thick and Rugged Faceplates For Embedded Boards"
The 11th Annual I LOVE DAC Campaign Kicks Off Registration for the 56th Design Automation Conference
LOUISVILLE, Colo. – March 11, 2019 – Starting today, free registration is open to attend the exhibits and keynotes at the Design Automation Conference, the premier event for the design and automation of electronic systems. Avatar Integrated SystemsTM, ClioSoftTM</ … Read More → "The 11th Annual I LOVE DAC Campaign Kicks Off Registration for the 56th Design Automation Conference"
SAN FRANCISCO (US), FEBRUARY 25, 2019 — This week, at the SPIE Advanced Lithography conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, demonstrates the positive impact of sequential infiltration synthesis (SIS) on the EUVL (extreme ultra-violet lithography) patterning process. This post-lithography technique is shown to significantly reduce stochastic nano-failures and line roughness, contributing to the introduction of EUVL patterning of future nodes”. This work integrates recent advancements on metrology and etch, and on material developments, which will be presented in multiple papers at this week’s 2019 SPIE Advanced Lithography Conference.