News – Page 2 – EEJournal

NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys

NXP, BMW Group, and Continental work on new auto Ultra-Wideband (UWB) use cases and standards in CCC

November 13, 2019

Enables a broad range of striking new use cases such as true handsfree smartphone car access
Provides spatial awareness to cars and smart devices through unique UWB localization capabilities
New automotive Integrated Circuit (IC) completes NXP’s UWB portfolio spanning auto, mobile and IoT ecosystems
MUNICH, Germany – November 12, 2019 – NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC. UWB provides precise, secure, real-time localization capabilities unrivaled by other wireless technologies such as Wi-Fi, Bluetooth, and … Read More → "NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys"

Mentor’s Tessent Connect automation reduces IC test implementation costs and accelerates time to market

Tessent Connect helped eSilicon dramatically speed IC test cycles for next-generation ASIC

November 12, 2019

Mentor, a Siemens business, today introduced Tessent Connect – an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. As part of the Tessent Connect rollout, Mentor today also announced the Tessent Connect Quickstart program, offering detailed flow assessments from Mentor’s applications and consulting services engineers.

Today’s advanced IC designs can achieve very high defect coverage for manufacturing and in-system test by integrating dedicated on-chip infrastructure such as embedded compression, … Read More → "Mentor’s Tessent Connect automation reduces IC test implementation costs and accelerates time to market"

STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures

November 12, 2019

ST8500 smart-meter chipset now integrates both RF and PLC communication
Customer ADD Grup reveals first hybrid smart electricity meters leveraging upgraded functionality
Chipset and demonstration solutions to display at European Utility Week 2019

Geneva, November 12, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is facilitating smarter city and industry infrastructures through the combination of powerline and wireless communication in its market-proven smart-meter chipset.

Already widely used in smart electricity meters, ST’ … Read More → "STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures"

GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio

November 12, 2019

SAN JOSE, Calif. and GUANGZHOU, China, Nov. 12, 2019 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 Low Energy radio enabling an entirely new wave of FPGA computing capabilities at the edge.

Edge computing is requiring new demands on programmable devices. With significant variances in product requirements, GOWIN is paving the way for innovation with a variety of new features integrated within their next-generation FPGAs. Their latest device called the GW1NRF-4 provides a 4k LUT FPGA, a 32-bit power-optimized … Read More → "GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio"

Siemens extends offer for IoT applications in the energy automation in the power network

European Utility Week, 12th-14th November 2019, Paris Expo Porte de Versailles, Pavilion 1, Stand C60

November 12, 2019

New Grid Diagnostic Suite offers unique comprehensive insight
Overview of energy automation systems of the whole network
Launch of first four grid-relevant applications
Increases cost efficiency and increased availability of smart grids
Digitization helps increasing complexity in the power grid

Siemens presented at the European Utility Week in Paris his new Grid Diagnostic Suite: A total of four different cloud-based applications can use both capture and newly installed smart devices already in the network data and analyze it in the cloud. For this, virtually no additional engineering … Read More → "Siemens extends offer for IoT applications in the energy automation in the power network"

Wind River Teams with Xilinx on Secure and Safe Platform for Automated Driving Applications

Platform Provides Intelligence and Flexible Compute Power to Help Carmakers Deliver Next-Gen Vehicles on Schedule While Keeping to Budget

November 12, 2019

New platform delivers intelligent and real-time handling of complex, mixed-criticality workloads for more efficient and faster data processing.
Platform certifiable to safety standard ISO 26262 ASIL-D.
Platform addresses key needs for both consumers and carmakers.

XILINX DEVEOPER FORUM, THE HAGUE, NETHERLANDS Nov. 12, 2019 Read More →

Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions

New Software and Hardware Building Block Solutions Developed for RA Family of 32-bit Arm Cortex-M MCUs

November 12, 2019

Düsseldorf, November 12, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with … Read More →

Choose performance, choose Zynq® UltraScale+TM SoC platform

Reduce cost of SoC technology integration thanks to our new PFP-ZU+

November 12, 2019

Have you heard about SoC? Xilinx’s System on Chip (SoC) is the new disruptive technology for high- end embedded systems. SoC integrates the software programmability of ARM processor with the firmware programmability of FPGA in one unique component.

SoC offers an unrivalled level of system performance, flexibility, and scalability. This component is the perfect solution to build stand-alone “SWaP” (Size, Weight and Power) optimized equipment.

TECHWAY has 10+ years development experience in Xilinx FPGA PCIe platform with FMC interface. Thanks to our know-how, we … Read More → "Choose performance, choose Zynq® UltraScale+TM SoC platform"

Keysight Technologies Unveils Industry 4.0-ready In-Circuit Test (ICT) Suite

Keysight i3070 Series 6 ICT improves throughput and operational efficiency of printed circuit board assembly (PCBA) manufacturing

November 12, 2019

SANTA ROSA, Calif., November 12, 2019 – Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, today announced the i3070 Series 6 In-Circuit Test (ICT) suite of solutions which enables electronics manufacturers … Read More → "Keysight Technologies Unveils Industry 4.0-ready In-Circuit Test (ICT) Suite"

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and AI at the Edge Development

Single board computer is ideal for industrial automation, IoT, AI and multimedia applications

November 12, 2019

PHOENIX – November 12, 2019 – Leading global technology solutions provider Avnet (Nasdaq: AVT) is providing customers with the ability to focus more on the software side of their development by launching MaaXBoard, a low-cost, production-ready qualified single board computer. Based … Read More → "Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and AI at the Edge Development"

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Speaking in [Archaic] Tongues (BASIC)

Nov 14, 2019

In addition to playing retro games, THEC64 allows you to write your own programs in C64 or VIC 20 BASIC....