News – Page 29 – EEJournal

TDK introduces 3-phase input 4500 W AC-DC power supplies capable of providing single or dual outputs

January 8, 2026

January 7, 2026

TDK Corporation (TSE:6762) introduces the TDK-Lambda TPS4500 single- or dual-output industrial power supplies with a 4500 W rating. The modules can be configured to share the loads in any proportion, up to the rated output specifications, and are designed to operate in series or in parallel to increase the output voltage or power.

Capable of operating from a high voltage three-phase input in a 360 – 528 Vac Delta or Wye configuration, the TPS4500 series can be used in multiple applications, including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, lasers, … Read More → "TDK introduces 3-phase input 4500 W AC-DC power supplies capable of providing single or dual outputs"

AMD Expands AI Leadership Across Client, Graphics, and Software with New Ryzen, Ryzen AI, and AMD ROCm Announcements at CES 2026

January 8, 2026

News Summary

AMD introduces new Ryzen AI 400 and PRO 400 Series processors, delivering up to 60 NPU TOPS for Copilot+ PCs and AI experiences across consumer and commercial systems.
AMD introduces new Ryzen AI Max+ SKUs, bringing high-performance AI and graphics to ultra-thin notebooks, workstations, and small form factors for creation, gaming, and AI development.
AMD unveils AMD Ryzen AI Halo, a powerful, easy-to-use mini-PC that brings Ryzen AI Max+ performance to AI developers with an out-of-the-box experience designed to accelerate AI innovation at the edge.
AMD announced the new … Read More → "AMD Expands AI Leadership Across Client, Graphics, and Software with New Ryzen, Ryzen AI, and AMD ROCm Announcements at CES 2026"

AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI

January 7, 2026

News Highlights

New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration
Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems
Launching today, the Ryzen AI Embedded P100 Series processors featuring 4-6 CPU cores, estimated 35% faster GPU performance¹, and up to 50 AI TOPS²

SANTA CLARA, Calif., Jan. 05, 2026 (GLOBE NEWSWIRE) — Today, Read More → "AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI"

Elektrobit unveils EB civion to fast-track SDV cockpit development

EB civion to take center stage at CES 2026 where Elektrobit will showcase the evolution of the automotive supply chain and accelerated cockpit development for SDVs through build-to-print designs and cloud-native technologies

January 7, 2026

LAS VEGAS, Jan. 6, 2026 /PRNewswire/ — CES 2026, Las Vegas Convention Center, West Hall, Booth #3719 — Elektrobit, the trusted partner in the transition to the software-defined … Read More → "Elektrobit unveils EB civion to fast-track SDV cockpit development"

New Ruggedized NI E320 Software Defined Radio is IP67 Weatherproof

January 7, 2026

Waterloo, Ontario — Jan 5, 2026 – The E320 is the latest edition to the Pixus line of ruggedized Ettus/NI Software Defined Radios (SDRs). The first in the E-series ruggedized enclosures is an IP67 weatherproof design.

The E320 is an IP67 rated outdoor solution in a compact size. It features a conduction-cooled design from -10C to 60C temperature ranges, with extreme options from -40C to 70C upon request. A full MIL ruggedized version or other customized configurations are also available.

Pixus now has a ruggedized offering of NI … Read More →

Kudelski Labs Addresses Edge AI and Quantum-Era Security Threats at CES®

In its CES debut, Kudelski Labs, the innovation arm of the Kudelski Group, will showcase advances in embedded security from chip to cloud designed to help semiconductor manufacturers address new security challenges

January 7, 2026

CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA—January 5, 2026— Kudelski Labs, the innovation arm of the Kudelski Group, will be making its CES debut at Booth #52923 of the Venetian Expo, January 6-9, 2026. Showcasing advances in embedded security, from the silicon layer to the AI model and across the entire device lifecycle, demonstrations will focus on autonomous robotics, edge AI and real-time, in-field security provisioning.

As semiconductor and device manufacturers add local reasoning, autonomy, and advanced connectivity to new products, and with “harvest now, decrypt later” attacks already underway, security risks continue to escalate. Kudelski Labs, leveraging more than 30 years … Read More → "Kudelski Labs Addresses Edge AI and Quantum-Era Security Threats at CES®"

Macronix Flash Memory Family Includes Highest Level of Automotive Safety High-Performance MXSMIO Flash Devices Now Compliant with ISO 26262 ASIL D Standard

January 7, 2026

HSINCHU, Taiwan — January 7, 2006 — Macronix International Co., Ltd.
(TSE: 2337), a leading integrated device manufacturer in the
non-volatile memory (NVM) market, today announced the high-performance
and efficiency MXSMIO™ family of flash memory has been expanded to
include optimal-safety features for automotive applications. The MXSMIO
flash devices, which feature multiple-I/O interfaces, are now compliant
with the ISO 26262 ASIL D standard, requiring much higher levels of
safety in vehicles’ electronics.

Automotive Safety Integrity Level D (ASIL D) refers to the systems in
vehicles that require current highest safety level. Many
automotive-electronics … Read More → "Macronix Flash Memory Family Includes Highest Level of Automotive Safety High-Performance MXSMIO Flash Devices Now Compliant with ISO 26262 ASIL D Standard"

Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT

January 7, 2026

Munich, Germany – 07 January 2026 – To support continued growth of connected devices in home, industrial and commercial markets, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth® LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. This product family introduces the industry’s first 20 MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the … Read More → "Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT"

Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles

Integration of Ceva’s AI DSP in NXP’s S32Z2 and S32E2 real-time processors enables predictive analytics, energy management and intelligent control for software-defined vehicles

January 7, 2026

LAS VEGAS, NV. – CES 2026 – January 6, 2026 – As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that NXP® Semiconductors has integrated Ceva’s AI DSP into its Read More → "Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles"

Ambiq Unveils Atomiq®, the World’s First Ultra-Low Power NPU SoC Built on SPOT®

Enabling always-on audio, vision, and reasoning for next-generation edge AI devices

January 7, 2026

AUSTIN, Texas, January 6, 2026 — Ambiq Micro, Inc. (“Ambiq”) (NYSE: AMBQ), a recognized leader in ultra-low-power semiconductor solutions for edge AI, today announced Atomiq, the highly anticipated system-on-chip (SoC) integrating a Neural Processing Unit (NPU) designed to enable real-time, always-on artificial intelligence at the edge. Built on Ambiq’s Subthreshold Power Optimized Technology (SPOT) platform, Atomiq aims to establish a new benchmark for energy efficiency in demanding edge AI applications.

High Performance Meets Power Efficiency

As AI models continue to grow in complexity, manufacturers face a critical challenge: scaling device intelligence without compromising … Read More → "Ambiq Unveils Atomiq®, the World’s First Ultra-Low Power NPU SoC Built on SPOT®"

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