News – Page 30 – EEJournal

Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance

Next-generation architecture delivers faster analysis, clearer insights, and a compact design to turn days of digital validation into hours

February 19, 2026

SANTA ROSA, Calif. – Keysight Technologies, Inc. (NYSE: KEYS) launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and … Read More → "Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance"

SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026

From cost-efficient Edge AI modules to AI-powered HMIs for industrial and medical application

February 19, 2026

Arezzo, Italy – February 19, 2026– At Embedded World 2026 (March 10–12, Nuremberg), SECO will showcase a portfolio of MediaTek–based solutions, reinforcing its partnership and highlighting how their combined technologies enable advanced Edge AI across multiple verticals.

SOM-Trizeps-X-Genio360/360P: cost-efficient Edge AI SOMs based on MediaTek Genio 360 and pin-to-pin compatible Genio 360P

At Embedded World 2026, SECO will introduce Read More → "SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026"

STMicroelectronics’ phase-shift control ICs squeeze more efficiency from resonant converters

February 19, 2026

Geneva, Switzerland, February 18, 2026 — STMicroelectronics has introduced the STNRG599A and Read More → "STMicroelectronics’ phase-shift control ICs squeeze more efficiency from resonant converters"

Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities

February 19, 2026

CHATSWORTH, CA & Grenoble, France — Feb. 18, 2026 — Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductor are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC).

Designed for deployment in LEO, GEO, lunar, and deep space missions, the SP1 is a … Read More → "Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities"

PULS to showcase Decentralised Field Power supplies and Industrial Wireless Charging at IntraLogisteX 2026

18th – 19th March - NEC Birmingham - Stand 707

February 19, 2026

PULS, an innovation leader in power supply technology, announces its participation at IntraLogisteX in Birmingham, where it will showcase its expanding range of decentralised field power supplies for intralogistics and material handling, and demonstrate its industrial wireless charging solutions for mobile robotics. The event provides machine builders, system integrators and industrial automation teams with the opportunity to explore practical approaches to scalable DC … Read More → "PULS to showcase Decentralised Field Power supplies and Industrial Wireless Charging at IntraLogisteX 2026"

CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale

ISSCC Paper Presents New 22 nm IC That Delivers Record Scan Speed, Wide Spectral Coverage, and High Sensitivity—Moving Electron Paramagnetic Resonance into Portable Systems

February 18, 2026

SAN FRANCISCO — Feb. 18, 2026 — Researchers at CEA-Leti and CEA-IRIG-SyMMES* have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from a battery-operated integrated circuit. By replacing the bulky electromagnets used in conventional EPR instruments with an ultra-fast frequency-scanned architecture, the system enables high-performance paramagnetic sensing in portable and space-constrained environments where traditional systems cannot operate.

*SyMMES, the Molecular Systems and (Nano)Materials for Energy and Health Laboratory, is one of IRIG’s joint research units (UMR 5819). It brings together staff from CEA, the French National … Read More → "CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale"

CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers

ISSCC 2026 Presentation Shows a 28 nm CMOS Router Achieving 18 ns Frame-Level Optical Path Setup

February 18, 2026

SAN FRANCISCO — Feb. 18, 2026 — Researchers from CEA-List and CEA-Leti today unveiled at ISSCC the first electro-optical router with dynamic, frame-level optical routing integrated with CMOS control logic, marking a major step toward practical optical networking inside advanced chiplet-based packages.

Their paper, “A 3.19pJ/bit Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-6 Wavelength Flexible Link Capacity for Photonic Interposers”, demonstrates an electro-optical router implemented in 28 nm CMOS on a photonic interposer, capable of establishing optical paths in 18 nanoseconds. It dynamically selects one-to-six wavelengths per link, and achieves an energy efficiency of 3.19 pJ/bit … Read More → "CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers"

e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation

February 18, 2026

California & Chennai (February 17, 2026): e-con Systems®, a global leader in embedded vision solutions, launches DepthVista Helix 3D Continuous Wave iToF Camera, a high-performance depth camera engineered to deliver reliable and accurate 3D perception for wide range of industrial robotics applications, including Autonomous Mobile Robots (AMRs), pick-and-place, bin-picking, palletization and depalletization robots, industrial safety and automation, and smart agriculture.

This new camera is based on a 1.2MP onsemi Hyperlux ID … Read More → "e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation"

SemiQ to Debut SiC Power Solutions for Next-Gen AI Datacenters and High-Power Infrastructure at APEC 2026

QSiC™Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack and B3 full-bridge packages on display at Booth #1451

February 18, 2026

February 18, 2026, Lake Forest, CA – SemiQ Inc, a designer, developer, and global supplier … Read More →

TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs

The enhanced TASKING integrated toolchain combines compile, debug, and test capabilities to automate the measurement, assessment, and optimization of hidden timing interference in multicore SoCs for safety- and security-critical applications

February 18, 2026

MUNICH – February 18, 2026 – TASKING, a global leader in high-performance embedded software development tools, today announced enhancements to its unified toolchain that provide greater in-depth timing analysis of real-time, multicore embedded systems. With the integration of TASKING’s compiler technology, BlueBox debuggers, winIDEA IDE, and the LDRA tool suite, developers can more accurately assess complex timing issues such as worst-case execution time (WCET) as outlined by industry standards. By accelerating and simplifying complex timing coupling analysis, TASKING helps OEMs reduce the risks and costs associated with certifying mission-critical multicore systems, including applications in aerospace, automotive, industrial, and robotics such as collaborative … Read More → "TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs"