February 25, 2026 – Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, today announces a new Read More → "New eBook from Mouser, Microchip, and Samtec Examines PCIe Design for Emerging Embedded Systems"
VANCOUVER, BC, Feb. 24, 2026 /CNW/ – Read More → "TELUS Digital showcases AI transformation in telecom: Unlocking value with innovative use cases at Mobile World Congress 2026"
Teledyne SP Devices’ ADQ35 is an established leader in high-performance data acquisition. As part of the 12 bit ADQ3 series, it offers an exceptional combination of speed, resolution, and flexibility, making it a strong fit for demanding scientific, industrial, and OEM applications.
Applications and Market Demand
The ADQ35 is engineered for use in areas such as swept source optical coherence tomography (SS OCT), time of flight mass spectrometry, distributed fiber-optic sensing, LiDAR, scientific instrumentation, and automated test equipment. These applications require digitizers capable of capturing and processing large volumes of data with high fidelity and … Read More → "High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer"
GAINESVILLE, Fla., Feb. 24, 2026 // PRNewswire/
Caspia Technologies today announced broad availability of its … Read More → "Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification"
News Highlights
Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyze this data. At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secured IoT. True to the motto “Driving decarbonization … Read More → "Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026"
IBM (NYSE: IBM) and Deepgram today announced a collaboration to integrate Deepgram’s industry-leading leading Read More → "Deepgram and IBM Introduce Advanced Voice Capabilities for Enterprise AI"
Geneva, Switzerland, February 24, 2026 — STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated BCD driver with a high-performance GaN power transistor that has just 140mΩ RDS(on).
Leveraging the high … Read More → "STMicroelectronics’ new MasterGaN power ICs combine flexibility with advanced GaN technology"
MUNICH – February 24, 2026 – TASKING, a global leader in high-performance embedded software development tools, today announced enhancements to the TASKING toolchain … Read More → "TASKING Integrates Modern AI Technology to Enable Robust Software Verification and Validation (V&V)"
Lauta (Germany), February 24, 2026 – The debug, trace, and test tool UDE® Universal Debug Engine 2026, presented by PLS Programmierbare Logik & Systeme at embedded world 2026 in Nuremberg in Hall 4, booth 4-310, now enables debugging, runtime monitoring, and validation of special, data flow-oriented algorithms, such as those currently incorporated into embedded AI applications. As part of a research project funded by the German Federal Ministry for Economic Affairs and Energy, PLS developed innovative tools for the Bosch Data Flow Architecture (DFA) and integrated them into UDE 2026.
The Bosch DFA is a highly parallel, dynamically configurable hardware accelerator that enables very … Read More → "PLS’ UDE 2026 now also enables debugging of highly efficient embedded AI accelerators"
