News – Page 2286 – EEJournal

Bug Labs and Pitney Bowes Announce First Modular, Mobile Device Development Platform with Hardware-level Security Protection

March 14, 2011

NEW YORK — Bug Labs, an open source hardware and software provider that gives companies the tools and support needed to prototype, pilot and produce innovative networked devices with ease, and Pitney Bowes Inc. (NYSE: PBI) today announced the industry’s first modular, mobile device development platform incorporating hardware-level security and security life-cycle management services. As a new addition to Bug Lab’s flagship open source device prototyping platform, BUGsecure offers enterprises a flexible, trusted platform with the highest level of data protection and encryption available. Current devices on the market rely on software security, making them more … Read More → "Bug Labs and Pitney Bowes Announce First Modular, Mobile Device Development Platform with Hardware-level Security Protection"

Digi-Key Corporation Joins China Electronics Distributor Alliance (CEDA) as Founding Member

March 14, 2011

Monday, March 14, 2011 – THIEF RIVER FALLS, Minnesota, USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Joins China Electronics Distributor Alliance (CEDA) as Founding Member"

Powerstax USA launch of its NEW Ruggedised 1000 watt DC-DC Power Supply at Electronics New England

March 14, 2011

Powerstax, one of Europe’s leading application-rich power solutions manufacturers, will use the Electronics New England (formerly Nepcon East & Electro 2011) exhibition in Boston to show their new TVS1001 ruggedised 1000 watt DC-DC power supply for the first time in the USA.

The TVS1001 and other high efficiency commercial and MIL COTS power conversion products from Powerstax will be featured on booth 1102 by their North American Manufacturers Representative, Power Guide Marketing.

At the heart of the TVS1001 are two patented Powerstax F501 DC-DC converters which have demonstrated ability to perform under the harshest … Read More → "Powerstax USA launch of its NEW Ruggedised 1000 watt DC-DC Power Supply at Electronics New England"

Digi-Key Corporation and Richtek Technology Corporation Sign Global Distribution Agreement

March 14, 2011

Monday, March 14, 2011 – THIEF RIVER FALLS, Minnesota, USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation and Richtek Technology Corporation Sign Global Distribution Agreement"

Curtiss-Wright Controls Electronic Systems Debuts New Hybricon® VITA 46/48/OpenVPX™ 3U Backplane

March 14, 2011

LITTLETON, MA – March 11, 2011 — Curtiss-Wright Controls Electronic Systems, a business group of Curtiss-Wright Controls and a leading system integrator of rugged deployed integrated electronics for the aerospace, defense and industrial markets, has announced the newest addition to its industry-leading Hybricon® family of high performance OpenVPX™ backplanes. The new 024-901-06-CEN1-01 is a 3U, 6-slot VPX REDI (VITA 48) backplane. It speeds and simplifies the integration of high performance open standards based rugged deployed subsystems based on … Read More → "Curtiss-Wright Controls Electronic Systems Debuts New Hybricon® VITA 46/48/OpenVPX™ 3U Backplane"

Dual Ideal Diode & Hot Swap Controllers Save Power & Board Area

March 14, 2011

MILPITAS, CA – March 14, 2011 – Linear Technology Corporation introduces the LTC4227, a compact, dual ideal diode with Hot Swap™ controller that provides PowerPath™ and inrush current control for redundant supplies operating from 2.9V to 18V. The LTC4227 regulates the forward voltage drop across two external N-channel MOSFETs to ensure smooth current transfer between … Read More → "Dual Ideal Diode & Hot Swap Controllers Save Power & Board Area"

Agilent Technologies’ Latest GoldenGate RFIC Simulation Software Raises the Bar on Performance and Usability

March 14, 2011

SANTA CLARA, Calif., March 10, 2011 – Agilent Technologies Inc. (NYSE: A) today announced the latest release of its RFIC simulation, verification and analysis software – GoldenGate version 2011.

This release enhances Agilent’s leadership in advanced-node RFIC design with improved performance, fast mismatch analyses for analog/RF applications and a new easy-to-use graphical user interface. The release also extends the software’s RFIC analysis to more easily incorporate package and board effects.

“There are various ways to … Read More → "Agilent Technologies’ Latest GoldenGate RFIC Simulation Software Raises the Bar on Performance and Usability"

Arteris, EVE Strengthen Partnership to Provide Enhanced Design Flow for Mobile, Wireless SoCs

March 14, 2011

SUNNYVALE, Calif. –– March 14, 2011 –– Arteris Inc., the leading supplier of network-on-chip (NoC) interconnect intellectual property (IP) solutions and EVE, the leader in hardware/ software co-verification, today announced an integrated solution enabling system-on-chip (SoC) developers to easily generate and use actual SoC register transfer level (RTL) implementations on EVE’s ZeBu-Server emulation platform.

This integration allows SoC developers to create and ship their products sooner.

Arteris and EVE have worked together to integrate NoC interconnect creation and deployment with hardware emulation. The design flow allows the interconnect IP … Read More → "Arteris, EVE Strengthen Partnership to Provide Enhanced Design Flow for Mobile, Wireless SoCs"

FPGA Miniaturization Services Available for Commercial & Military Applications

March 11, 2011

March 10^th, 2011 – Nallatech, a leading supplier of high-performance FPGA solutions for over eighteen years, announces the availability of FPGA miniaturization services. Customers can engage this service on a turnkey concept-through-production basis or they can contract Nallatech to migrate their FPGA development boards/prototypes into fully-deployable miniaturized solutions.

This seamless integration of FPGA systems design and high-density packaging is cost effective across a wide range of production volumes and applications; including requirements with size, weight, and power constraints. A proven co-development methodology significantly lowers risks in bare die and packaged IC implementations by pro-actively … Read More → "FPGA Miniaturization Services Available for Commercial & Military Applications"

Ericsson 400W Power Interface Module Simplifies Low-EMI Design In ATCA Applications

March 11, 2011

400W quarter brick power interface module with 99% typical efficiency
10A output current at +80°C and 0.5m/s (100LFM) air speed
Low-EMI design for CISPR Class B with minimal external components
Optimized for AdvancedTCA Blade and power-board

Ericsson Power Modules announces the PIM4328P, a new 390-540W power interface module (PIM) compliant with the 300W de facto industry-standard footprint. The quarter-brick PIM4328P is optimized to simplify design in blade servers based on Advanced TCA (PICMG 3.0) systems. Ericsson’s low-EMI design rules and best practices ensure that minimal … Read More → "Ericsson 400W Power Interface Module Simplifies Low-EMI Design In ATCA Applications"